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Thermal Events: Root Cause Analysis & Prevention for Electronics

Presenter: Cheryl Tulkoff
Company: DfR Solutions
Date Published: 1/8/2015

Description: Presented by: Cheryl Tulkoff, DfR Solutions Cheryl Tulkoff



What You Will Learn:
Thermal events in electronics can be described as events where electronics, and potentially the environment surrounding them, are damaged in a manner that results in unplanned heat, smoke, flames, or damage while in operation. Why do thermal events like this occur? They result from a number of factors related to improper choices and variation in:

  • Design
  • PCB materials & construction
  • Input protection
  • Environment
  • Components
  • Quality
  • Electrical Overstress & ESD
  • Customer error / Mistake prevention
  • Sabotage
  • Unknown reasons

    This webtorial is design to walk you through the process of performing analysis on thermal event failures in the field. Analysis techniques and case studies will be covered along with some prevention and protections strategies.

    The course is designed for technicians and engineers working in design, manufacturing, quality, and field failure analysis.

    Webtorial Outline:

  • Background & Introduction
         o Need for Root Cause Analysis
  • Failure Analysis Intro
         o Thermal Events
         o Case Studies
  • Failure Analysis
         o Techniques & Tools for Thermal Events
  • Conclusions

    Instructor Bio:
    Cheryl Tulkoff has over 22 years of experience in electronics manufacturing with an emphasis on failure analysis and reliability. She has worked throughout the electronics manufacturing life cycle beginning with semiconductor fabrication processes, into printed circuit board fabrication and assembly, through functional and reliability testing, and culminating in the analysis and evaluation of field returns. She has also managed no clean and RoHS-compliant conversion programs and has developed and managed comprehensive reliability programs.

    Cheryl earned her Bachelor of Mechanical Engineering degree from Georgia Tech. She is a published author, experienced public speaker and trainer and a Senior member of both ASQ and IEEE. She had held leadership positions in the IEEE Central Texas Chapter, IEEE WIE (Women In Engineering), and IEEE ASTR (Accelerated Stress Testing and Reliability) sections. She chaired the annual IEEE ASTR workshop for four years and is also an ASQ Certified Reliability Engineer.

  • Key Words: 

    thermal events, failure analysis, root cause, electronics, case studies



    Pricing:
      Members: $200.00 (Log on to receive the member rate)
      Non-Members: $300.00



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