Reflow Soldering Process and Influence on Defects - An In-Depth LookPresenter: Dr. S. Manian Ramkumar
Company: Rochester Institute of Technology
Date Published: 12/10/2013
The reflow soldering process is a key process in surface mount electronics assembly after stencil printing process. The soldering parameters influence the quality of the solder joint in a surface mount PCB assembly. This course will provide a thorough understanding of the reflow process for tin-lead and lead free soldering. Topics include an in-depth look at the various soldering methods, mechanism for solder joint formation, intermetallic formation, reflow parameters, effect of reflow parameters, thermocouple attachment and profiling, importance of profiling, defect identification and corrective action. Participants in this course are sure to acquire a sound understanding of the soldering process and its influence on assembly yield.
Who should attend?
Dr. Ramkumar is a Professor and Chair of the Mechanical and Manufacturing Engineering Technology Department at the Rochester Institute of Technology (RIT). He is also the Director for the Center for Electronics Manufacturing & Assembly (CEMA). He teaches courses in surface mount electronics packaging and manufacturing automation. He was instrumental in developing the Electronics Packaging Center and the Automation laboratories at RIT. The Center supports hands-on training and applied research projects for industry. Dr. Ramkumar has been the principal investigator for several applied research projects and has presented technical papers at the SMTA, APEX, IMAPS, ASME and IEEE conferences. He also teaches Surface Mount Technology (SMT) and Advanced Packaging courses at the IPC-APEX and SMTA shows and for companies on-site. His current research is in the use of a novel magnetically aligned ACA as a lead-free replacement with PCB assembly and 3D packaging.
Reflow Soldering, Defects,
Members: $200.00 (Log on to receive the member rate)