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BGA Rework/Repair-A Primer

Presenter: Bob Wetterman
Company: BEST Inc.
Date Published: 11/27/2012

Description: Overview:
While BGAs are relatively forgiving in their placement on PCBs there is fallout requiring the rework of BGAs. This course is a primer on the the various aspects of the process from initial inspection through the site preparation, placement and final inspection. If you are just beginning to place BGAs and know that eventually you will be needing to rework them or have just begun reworking BGAs this 2 part series will guide you through the basics. We will talk about the problems in initial placement which leads to rework, the equipment set and capabilities required to adequately rework BGAs and the process steps involved.

What Will You Learn:
We will develop the following topics in this class:

1.Rework Process including : part removal, site dressing, placement , reflow, cleaning and inspection

2. Equipment-what is right for your process

3. Material Set-flux, cleaning and paste materials

4. Unlucky 13 "Gotchas" of BGA Rework including damaging the mask, part reballing, pad repair and others.

Who Should Attend:
This course is designed for the process engineer, manufacturing engineer or the repair technician working at a repair depot.

Bio:
The instructor for this class is Bob Wettermann of BEST. BEST is a contract rework and repair facility repairing thousands of BGAs every year. In addition BEST is an IPC Master instruction location. This class will bring to life the process through real applications.

Key Words: 

BGA, Rework, Repair, Inspection



Pricing:
  Members: $200.00 (Log on to receive the member rate)
  Non-Members: $300.00



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