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Practical Guidelines for Moisture Sensitive Component Handling

Presenter: Mumtaz Bora
Company: Peregrine Semiconductor
Date Published: 12/1/2009

Seika Machinery, Inc.

Description: The handling, transportation, storage and packaging of components and PWBs has become critical as the industry has migrated to higher temperature lead free assembly processes. Components have expanded beyond the traditional SMD ICs and now includes any non-IC device that will likely be subjected to the higher temperature lead free (Pb-free) soldering, such as capacitors, LEDs, etc. Additionally, the advent of alternative surface finishes such as Immersion tin, Immersion silver, Organic solderability preservative(OSP), Hot Air Solder Leveling (HASL), Electroless Nickel/Immersion Gold (ENIG) has added complexity in packaging, handling and storage of PWBs and assure good solderability during assembly. It has been diffcult to standardize moisture sensitivity levels in PWBs due to the variety of laminate materials, PWB thicknesses , designs and environmental conditions for storage. This presentation will give an overview of process controls in handling, storage and baking of packages and PWBs and conducting audits. The intent of this webcast is to give a Practical guideline for MSL handling and a review of the ongoing efforts in developing industry guidelines for packages and PWB handling and storage.

Key Words: 

MSD, MSL, handling, storage



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