SMTA International 2005 Proceedings

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    TITLE AUTHOR DOWNLOAD
    RELIABILITY OF MIXED SOLDER INTERCONNECTS - CASE STUDIES Adam Zbrzezny et al.  Purchase 
    COMPONENTS & LEADED SURFACE MOUNT PACKAGES Alan Donaldson  Purchase 
    PARADIGM SHIFT IN APPLYING UNDERFILL-UPDATE Alec J. Babiarz  Purchase 
    STUDY OF NOISE FACTORS IN SOLDER PASTE PRINTING Aleksandra Djordjevic  Purchase 
    CHALLENGES ASSOCIATED WITH CONCURRENT MANUFACTURING (PB-BASED &PB-FREE) IN AN EMS ENVIRONMENT Amey Teredesai and Tony Batalha  Purchase 
    ASSEMBLY OF JCAA/JG-PP TEST VEHICLES Ana L. Campuzano-Contreras  Purchase 
    ASSEMBLY AND RELIABILITY OF HIGH CTE CERAMIC LAND GRID ARRAY Andrew Mawer et al.  Purchase 
    ACCELERATION FACTOR TO RELATE THERMAL CYCLES TO POWER CYCLES FOR CERAMIC AREA ARRAY PACKAGES Andrew Perkins and Suresh K. Sitaraman  Purchase 
    PROCESS AND RELIABILITY ISSUES WITH LEAD-FREE CSP REWORK Arun Gowda et al.  Purchase 
    INFLUENCE OF SURFACE CHARACTERISTICS ON THE IN-SITU PERFORMANCE OF THERMAL GREASES Arun Gowda et al.  Purchase 
    STUDY ON ASSEMBLY, REWORK PROCESS, MICROSTRUCTURES AND MECHANICAL STRENGTH OF BACKWARD COMPATIBLE ASSEMBLY Bala Nandagopal et al.  Purchase 
    OPTIMIZING THE REFLOW PROCESS UTILIZING A TIN/COPPER ALLOY Bob Gilbert  Purchase 
    SOLDERBALL(TM) INTERCONNECTS FACILITATE SMT REFLOW & ELIMINATE CO-PLANARITY ISSUES FOR SUB-ASSEMBLIES AND POWER MODULES Carlos Juvera et al.  Purchase 
    A FEASIBILITY STUDY OF 01005 CHIP COMPONENTS IN A LEAD-FREE SYSTEM Chrys Shea et al.  Purchase 
    CHARACTERIZING TRANSFER EFFICIENCIES AND THE FINE FEATURE STENCIL PRINTING PROCESS Chrys Shea, Greg Wade, Esse Leak, and Ron Tripp  Purchase 
    MASS IMAGING OF LEAD FREE MATERIALS - WHAT IMPACT DOES STENCIL TECHNOLOGY HAVE? Clive Ashmore  Purchase 
    THE EFFECT OF SURFACE FINISH ON THE RELIABILITY OF PB-FREE SOLDER JOINTS IN CHIP SCALE PACKAGES Corey Reichman and Robert Darveaux  Purchase 
    PRINTED CIRCUIT BOARD CONSIDERATIONS FOR LEAD FREE ASSEMBLY Dale Lee  Purchase 
    GOLD BUMP TECHNOLOGIES: A COMPARISON OF SERIAL PROCESSING (BALL BUMPING) AND BATCH PROCESSING (PLATING) Daniel Evans, Jr. and Mark S. Greenwell  Purchase 
    EVALUATION OF RELIABILITY AND METALLURGICAL INTEGRITY OF WIRE BONDS AND LEAD FREE SOLDER JOINTS ON FLEX CIRCUIT MODULES Daniel T. Rooney, Ph.D. et al.  Purchase 
    ONE PROCESS, DIFFERENT RESULTS: METHODOLOGIES FOR ANALYZING A STENCIL PRINTING PROCESS USING PROCESS CAPABILITY INDEX ANALYSES Daryl L. Santos et al.  Purchase 
    MEASUREMENT VARIATION IN THE FILL OF INTRUSIVELY REFLOWED LEAD FREE SOLDER JOINTS WITH DIFFERENT BOARD FINISHES BY X-RAY INSPECTION David Bernard et al.  Purchase 
    JCAA/JG-PP NO-LEAD SOLDER PROJECT: -20ºC TO +80ºC and -55ºC TO +125ºC THERMAL CYCLE TESTING David D. Hillman  Purchase 
    JCAA/JG-PP NO-LEAD SOLDER PROJECT: -20ºC TO +80ºC and -55ºC TO +125ºC THERMAL CYCLE TESTING David D. Hillman  Purchase 
    EVALUATION OF OSP SURFACE FINISHES FOR LEAD-FREE SOLDERING David Geiger, Yueli Liu, and Dr. Dongkai Shangguan  Purchase 
    MINIMIZING FLUX RESIDUES ON THE COMPONENT BODY Deepak Manjunath  Purchase 
    FILLING BLIND MICROVIAS TO IMPROVE RELIABILITY Dennis Fritz, Jim Watkowski, and Maria Nikolava  Purchase 
    EMERGING NANOTECHNOLOGY AND ITS EFFECT ON ELECTRONICS MANUFACTURING Dr. Alan Rae and Dr. Robert C. Pfahl, Jr.  Purchase 
    RELIABILITY AND PERFORMANCE OF THERMALLY CONDUCTIVE ADHESIVES Dr. Brian J. Toleno  Purchase 
    iNEMI OPTOELECTRONICS ROADMAP FOR 2004 Dr. Laura J. Turbini  Purchase 
    SIX SIGMA R&D AND THE SUPPLY CHAIN Dr. William L. Olson and Dr. Jim Liu  Purchase 
    REWORKABLE NO-FLOW UNDERFILLING FOR BOTH TIN-LEAD AND LEADFREE REFLOW ASSEMBLED UNDER AIR Dr. Wusheng Yin and Dr. Ning-Cheng Lee  Purchase 
    EFFECT OF FLUX AND COOLING RATE ON MICROSTRUCTURE OF FLIP CHIP SAC BUMP Dr. Wusheng Yin and Dr. Ning-Cheng Lee et al.  Purchase 
    BENCHMARKING OF LEAD-FREE NO-CLEAN FLUXES SOLDERING PERFORMANCE ON OSP BOARD Dr. Xiaobai Wang and Christine Poon  Purchase 
    A KINETIC APPROACH OF PROFILING FOR VOIDING CONTROL AT LEAD-FREE REFLOW SOLDERING Dr. Yan Liu et al.  Purchase 
    EPC/RFID IMPLEMENTATION IN MANUFACTURING Edward Adelakun, David Halliday, and Azhar Zaidi  Purchase 
    EFFECT OF UNFILLED UNDERFILL ON BOARD LEVEL RELIABILITY Edward S. Ibe et al.  Purchase 
    CAPABILITY MATURITY MODEL FOR SUPPLY CHAIN IMPROVEMENT: A CASE STUDY Edwin B. Smith, III  Purchase 
    ENHANCING THE TARNISH PERFORMANCE OF IMMERSION SILVER FINISHES Elizabeth Norwood and John Swanson  Purchase 
    KEY ISSUES IN SUPPORTING LEAD-FREE AND COMPLEX PROTOTYPES IN THE ELECTRONICS MANUFACTURING SERVICES ENVIRONMENT Elliot L. Shev  Purchase 
    SOLDER AS THERMAL INTERFACE MATERIAL FOR HIGH POWER DEVICES Fay Hua and Carl Deppisch  Purchase 
    SURVEY OF SUCCESSFUL RFID CASE STUDIES IN ELECTRONICS MANUFACTURING François Monette  Purchase 
    FIRST PASS YIELD ENHANCEMENT THROUGH STRATEGIC IMPLEMENTATION OF AOI AS A PROCESS IMPROVEMENT TOOL Fredrika M. Haneborg-Luhr  Purchase 
    CONVERSION OF ONGOING PRODUCTS TO RoHS COMPLIANCE Gary Schulte  Purchase 
    TOWARD LEAD-FREE COMPLIANT PIN CONNECTIONS George J.S. Chou, Ph.D. and Robert D. Hilty, Ph.D.  Purchase 
    SCALING UP RFID MANUFACTURING - ADDRESSING THE NEED FOR HIGH VOLUME PRODUCTION Gerald Steinwasser  Purchase 
    RELIABILITY AND SOLDERABILITY OF THE LEAD FREE HASL PROCESS Glenn Sikorcin  Purchase 
    LEAD-FREE SOLDER JOINTS AND FAILURE MECHANISM ON DIFFERENT FINISHES H.-J. Albrecht  Purchase 
    ASSESSING THE RELIABILITY OF NEW CONNECTOR DESIGNS Heather McCormick and George Riccitelli  Purchase 
    DEVELOPMENT OF A "SYSTEMS BASED" COMPLIANCE APPROACH TO THE EUROPEAN UNION’S ROHS DIRECTIVE Holly Evans  Purchase 
    microPowerChip: INTEGRATED POWER FOR WIRELESS MICROSYSTEMS J. DeGreeff, P. Fleig, and C. Lakeman  Purchase 
    ASSEMBLY AND BOARD LEVEL RELIABILITY CONSIDERATIONS FOR 0.4 MM PITCH BALL GRID ARRAY PACKAGES J. Scanlan, A. Syed, WJ. Kang, and M. Abe et al.  Purchase 
    ADHESIVE FLIP CHIP FOR LARGE ARRAYED DEVICES James E. Clayton  Purchase 
    THE USE OF CLOSED-LOOP PROCESS CONTROLS IN DISPENSING APPLICATIONS James Klocke  Purchase 
    RELIABILITY EVALUATION OF LEAD-FREE SNAGCU PBGA676 COMPONENTS USING TIN-LEAD AND LEAD-FREE SNAGCU SOLDER PASTE Jasbir Bath et al.  Purchase 
    iNEMI LEAD-FREE MICRO-BGA, CBGA, MICTOR CONNECTOR AND THROUGH-HOLE DIP REWORK EVALUATIONS Jasbir Bath et al.  Purchase 
    LOW TEMPERATURE, SPOT CURE CONDUCTIVE ADHESIVE TECHNOLOGIES FOR RFID TAGS ASSEMBLY Jayesh Shah et al.  Purchase 
    ACCELERATION FACTORS AND THERMAL CYCLING TEST EFFICIENCY FOR LEAD-FREE SN-AG-CU ASSEMBLIES Jean-Paul Clech  Purchase 
    JCAA/JG-PP LEAD-FREE SOLDER PROJECT: COMBINED ENVIRONMENTS TEST Jeff Bradford, Joe Felty, and Bill Russell  Purchase 
    PRINTED ELECTRONICS FOR LOW COST RFID Jie Zhang and Daniel Gamota  Purchase 
    FREE SILICON: THE ONLY SUCCESSFUL MARKETING STRATEGY LEFT? Jim Walker  Purchase 
    CONSIDERATION IN THE DEVELOPMENT OF THE 01005 COMPONENT ASSEMBLY PROCESS Joe Belmonte and Srinivasa Aravamudhan  Purchase 
    RELIABILITY OF SAC BGA USING SnPb PASTE FOR HARSH ENVIRONMENT ELECTRONICS John L. Evans, Ph.D et al.  Purchase 
    A COMPARISON OF CLEANING TECHNOLOGIES FOR NEW LEAD-FREE SOLDER PASTE FORMULATIONS John R. Sanders et al.  Purchase 
    RELIABILITY OF TIN TERMINATED COMPONENTS IN A LEAD-FREE SYSTEM Jorge A. Manriquez, Ph.D. et al.  Purchase 
    A STUDY OF THE FAILURE MECHANISMS IN LEAD-FREE AND EUTECTIC TIN-LEAD SOLDER BUMPS FOR FLIP CHIP ASSEMBLY Julia Y. Zhao, David Mackessy, and John Jackson  Purchase 
    INTERMETALLIC GROWTH IN LEAD-FREE SOLDERS ON PCB SUBSTRATES K. Sweatman, S. Suenaga, and T. Nishimura  Purchase 
    EFFECT OF CLEANING PROCESS PARAMETERS AND MATERIALS ON FLUX RESIDUE FOR FLIP CHIP ASSEMBLY Kaustubh Nagarkar et al.  Purchase 
    SUNTRON’S LEAN MANUFACTURING LINE Keith Garrison and Sal Bora  Purchase 
    GETTING STARTED WITH AOI - A PROGRAMMER’S VIEW Ken Klima  Purchase 
    DEVELOPMENT AND DEPLOYMENT OF LEAD-FREE ASSEMBLY PROCESS WORLD-WIDE Kim Hyland  Purchase 
    BUILDING A "REASONABLE STEPS" DEFENSE: LABORATORY TESTING Kris Erickson et al.  Purchase 
    APPLICATION OF A NEAR INFRARED DEFECT INSPECTION PROCESS FOR FLIP CHIP ASSEMBLY L. Todd Woods et al.  Purchase 
    INTEGRATION OF ACTIVE AND PASSIVE COMPONENTS USING CHIP IN POLYMER TECHNOLOGY Lars Boettcher et al.  Purchase 
    SALT ATMOSPHERE, TEMPERATURE HUMIDITY, AND MECHANICAL SHOCK ENVIRONMENTAL STRESS TESTING RESULTS OF THE JG-PP / JCAA LEAD FREE SOLDERING PROGRAM Lee Whiteman  Purchase 
    MULTI-ROW LEADLESS TAPP - HIGH PERFORMANCE PACKAGING AT VERY FINE PITCH Leo M. Higgins III, Ph.D.  Purchase 
    CREATING A HIGH SERVICE EMS ENVIRONMENT THROUGH BUSINESS PROCESS ALIGNMENT Leo Reynolds  Purchase 
    IMPACT OF CRACKING BENEATH SOLDER PADS IN PRINTED CIRCUIT BOARDS ON RELIABILITY OF BALL GRID ARRAY PACKAGES M. Mukadam, G. Long, P. Butler, and V. Vasudevan  Purchase 
    INVESTIGATION OF THE PERFORMANCE OF SAC AND SACBi LEAD-FREE SOLDER ALLOYS WITH OSP AND IMMERSION SILVER PCB FINISHES Manivannan Sampathkumar et al.  Purchase 
    EFFECT OF DEVIATING FROM THE REFLOW PROCESS WINDOW FOR LEAD-FREE ASSEMBLY Manivannan Sampathkumar et al.  Purchase 
    PRODUCT MATERIAL CONSIDERATIONS - CUSTOMER AND INDUSTRY ISSUES Marie Cole and Jay Dietrich  Purchase 
    SUPPLY CHAIN DATA EXCHANGE FOR MATERIAL DISCLOSURE Mark Myles  Purchase 
    PROCESS CONTROL THROUGH VOLUMETRIC OPTICAL INSPECTION Matthew T. Holzmann  Purchase 
    LEAD-FREE WAVE SOLDER FLUX EVALUATION Michael Havener  Purchase 
    COMBINED PRINTED SOLDER PASTE AND PRINTED ADHESIVE PROCESS FOR DEVICES GOING THROUGH WAVE SOLDER Michael Kochanowski  Purchase 
    PROCESS AND DESIGN CONSIDERATIONS FOR PERFORMING HIGH VOLUME PB Free FLIP CHIP on FLEX ASSEMBLIES Michael Peterson  Purchase 
    EFFECTS OF MICROSTRUCTURE, PCB FINISH AND PROCESSING ON LEAD-FREE RELIABILITY Milos Dusek and Chris Hunt  Purchase 
    QUALIFICATION OF ALIVH-G BOARDS FOR HANDSET ASSEMBLY Mumtaz Y. Bora  Purchase 
    AN ACCELERATION MODEL FOR Sn-Ag-Cu SOLDER JOINT RELIABILITY UNDER VARIOUS THERMAL CYCLE CONDITIONS N. Pan et al.  Purchase 
    A COMPARISON OF THE ISOTHERMAL FATIGUE BEHAVIOR OF SN-AG-CU TO SN-PB SOLDER Nathan Blattau and Craig Hillman  Purchase 
    INTEGRATED MANUFACTURING AND ITS EFFECT ON FRONT-END Nick Misra  Purchase 
    JOB CLUSTERING - AN UNTAPPED LEAN MANUFACTURING OPPORTUNITY Nir Dvir  Purchase 
    CRACK GROWTH RATE MEASUREMENT AND ANALYSIS FOR WLCSP Sn-Ag-Cu SOLDER JOINTS Paresh Limaye et al.  Purchase 
    A NEW GENERATION OF CONDUCTIVE INKS FOR ENHANCED PERFORMANCE IN SMART LABEL APPLICATIONS Paul Berry et al.  Purchase 
    FLIP CHIP ULTRASONIC GOLD TO GOLD INTERCONNECT FOR SMALL DIE WITH HIGH BUMP COUNT Philip Couts  Purchase 
    MODELS FOR THERMO-MECHANICAL RELIABILITY TRADE-OFFS FOR LEADED AND LEADFREE FLIP-CHIP ELECTRONICS IN EXTREME ENVIRONMENTS Pradeep Lall et al.  Purchase 
    STENCIL PRINTING AND REFLOW PARAMETER 'OPTIMIZATION' DURING ASSEMBLY OF 0201 COMPONENTS BY A DESIGNED EXPERIMENT APPROACH Praveen Kumar Manjeshwar et al.  Purchase 
    EFFECT OF BALL SIZE ON UNDERCOOLING OF Sn-Ag-Cu SOLDER JOINTS R. Kinyanjui, L. P. Lehman, and E. J. Cotts  Purchase 
    CASE STUDIES IN PREVENTING COMPONENT DAMAGE FROM LEAD-FREE HEAT Rahul Raut, Brian Lewis and Tom Hunsinger  Purchase 
    ASSEMBLY OF RFID FLIP CHIPS ON STRAPS USING A HIGH SPEED CHIPSHOOTER Richard Boulanger and Peter Borgesen et al.  Purchase 
    APPLICATIONS OF RFID INTELLIGENT FEEDERS FOR PRODUCTION MANAGEMENT Robert J Black, Jr.  Purchase 
    RELIABILITY OF PCB ALTERNATE SURFACE FINISHES IN A HARSH INDUSTRIAL ENVIRONMENT Robert Veale  Purchase 
    A PROTOCOL FOR RoHS AND WEEE COMPLIANCE Ronald C. Lasky et al.  Purchase 
    BEST PRACTICES FOR POST-ERP IMPLEMENTATION AT AN EMS PROVIDER S. Ramakrishnan, S. Parimoo, and K. Srihari, Ph.D.  Purchase 
    MODEL BASED APPROACHES FOR SELECTING RELIABLE UNDERFILLFLUX COMBINATIONS FOR FLIP CHIP PACKAGES Satyanarayan Iyer et al.  Purchase 
    PACKAGING OF HIGH-POWER LEDS USING Au STUDBUMP INTERCONNECTS Shatil Haque et al.  Purchase 
    SELF-CENTERING OF CHIP COMPONENTS IN A PB-FREE ASSEMBLY AS A FUNCTION OF COMPONENT AND SOLDER PASTE PRINT OFFSETS Srinivasa Aravamudhan et al.  Purchase 
    FILLET WETTING AND DIE COLLAPSE OF WAFER-LEVEL FLIP CHIP ASSEMBLIES Stephen C. Busch and Daniel Baldwin, Ph.D.  Purchase 
    THE OPTIMIZED REFLOW PROFILE FOR REWORK OF HIGH I/O LEAD FREE AREA ARRAY PACKAGES Stephen Schoppe  Purchase 
    OPTIMIZING CLEANING ENERGY IN ELECTRONIC ASSEMBLY SPRAY IN AIR SYSTEMS: PHASE II Steve Stach and Mike Bixenman  Purchase 
    HOW DEFECT COVERAGE AS A VARIABLE CAN BE USED TO DETERMINE TEST AND INSPECTION STRATEGIES Stig Oresjo  Purchase 
    PB-FREE WAVE SOLDERING PROCESS OPTIMIZATION Sunil Gopakumar et al.  Purchase 
    SOLDER-JOINT RELIABILITY AND BOARD ASSEMBLY OF PQFN PACKAGES Terry Burnette et al.  Purchase 
    JCAA/JG-PP NO-LEAD SOLDER PROJECT: VIBRATION TEST Thomas A. Woodrow, Ph.D.  Purchase 
    JCAA/JG-PP NO-LEAD SOLDER PROJECT: THERMAL SHOCK TEST Thomas A. Woodrow, Ph.D.  Purchase 
    OPTIMIZING LEAN MANUFACTURING IN ELECTRONICS MANUFACTURING SERVICES Todd Baggett  Purchase 
    REPLACEMENT OF WIRE-BOND INTERCONNECTS FOR DIRECT CHIP ATTACH OF POWER SEMICONDUCTORS Todd P. Oman  Purchase 
    CASE STUDY IMPLEMENTATION OF LOW SOLIDS VOC COMPLIANT CLEANING TECHNOLOGY AT A LARGE EMS OPERATION Tom Gervascio and Mike Bixenman  Purchase 
    EFFECTIVE FLUX REMOVAL UNDER STRINGENT ENVIRONMENTAL LIMITATIONS Umut Tosun and Sylvain Chamousset  Purchase 
    Pb-FREE PROCESS DEVELOPMENT AND MICROSTRUCTURAL ANALYSIS OF CAPACITOR FILTER ASSEMBLIES USING SOLDER PREFORMS Vatsal A. Shah et al.  Purchase 
    QUALIFICATION TESTING OF Pb-FREE ASSEMBLIES USING BALL STACKED CHIP SCALE IC PACKAGING Vern Solberg and Ignacio Osorio  Purchase 
    MATERIAL LOGISTICS FOR LEAD-FREE W. James Hall and Phil Zarrow  Purchase 
    MICROVIA-IN-PAD TECHNOLOGY CHALLENGES ON BGA PACKAGE PERFORMANCE Wendy Chet Ming, Ngoh et al.  Purchase 
    TEST METHODS AND COMPLIANCE WITH PRODUCT SUBSTANCE BANS William L. Olson and William F. Hoffman III  Purchase 
    DEVELOPING A BUSINESS CASE FOR IMPLEMENTING RFID IN MANUFACTURING William M. Scott  Purchase 
    CHARACTERIZATION OF SOLDER JOINT STRENGTH FOR HIGH I/O FCBGA PACKAGE WITH VARIOUS COMPRESSIVE LOAD FORCES AND COMPONENT PAD SURFACE FINISHES X. Zhou, J. Bath, K. Hyland, and D. Willie et al.  Purchase 

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