2000 Emerging Technologies Proceedings

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    TITLE AUTHOR DOWNLOAD
    DOES HIGH RELIABILITY EQUAL ZERO DEFECTS? Alexander J. Porter  Purchase 
    INTERCONNECTIONS IN 3 DIMENSIONS FOR HIGH SPEED COMPONENTS Christian VAL, CEO  Purchase 
    FLIP-CHIP AND GaAs : A ROUTE FOR RF PACKAGING Claude Drevon  Purchase 
    COST OPTIMIZATION OF HIGH DENSITY SUBSTRATES USING PLANAR RESISTORS Daniel Brandler  Purchase 
    CIRCUIT CONSTRUCTIONS AND MATERIAL SELECTIONS OF FLEX CIRCUITS FOR HIGH DENSITY INTERCONNECTS Darryl J. McKenney and Dominique Numakura  Purchase 
    CONSIDERATIONS FOR THE PIN PROBE TESTING OF NO-CLEAN SOLDER PASTE RESIDUES David Suraski  Purchase 
    LASER-ASSISTED PLATING OF PRINTED CIRCUIT BOARD (PCB) MICROVIAS E. S.W. Leung, W. K.C. Yung, W.B. Lee  Purchase 
    LASER SOLDERING APPLICATIONS FOR RF SHIELD REWORK Edgar Cerda  Purchase 
    SmartMediaTM CARD PACKAGING USING Au STUD BUMP AND ACF In-Ku Kang  Purchase 
    DIELECTRIC CHARACTERIZATION OF EMBEDDED CAPACITANCE FILMS AT MICROWAVE FREQUENCIES J. Obrzut and R. Nozaki  Purchase 
    SOLDERABILITY OF LEAD FREE METALLIZATIONS ON BOARD- AND COMPONENT-LEVEL UNDER DIFFERENT ATMOSPHERES, ESPECIALLY NITROGEN Jens Tauchmann  Purchase 
    CIRCUIT CARD ASSEMBLY PRODUCT DEVELOPMENT FOR HIGH DENSITY ELECTRONIC PACKAGING Michael G. Luke  Purchase 
    EVALUATION OF GAS CHEMISTRY EFFECTS ON WIRE BOND INTEGRITY AND PACKAGE INTERFACIAL ADHESION IN THE BGA PACKAGE Michael Leoni  Purchase 
    LITHIUM POLYMER CELL HIGH VOLUME MANUFACTURING Napoleon C. Cailipan  Purchase 
    THE EFFECT OF COPPER ADDITIONS IN THE ALUMINUM ALLOY METALLIZATIONS ON THE FORMATION OF INTERDIFFUSION ZONES AND VOIDS IN GOLD BALL BONDS Narendra Noolu  Purchase 
    EFFECTS OF BACKSIDE SCRATCHES ON RELIABILITY OF FLIP CHIPS ON ORGANIC BOARD ASSEMBLIES Prasad Godavarti  Purchase 
    IC AND MEMS TRENDS AND RELIABILITY Reza Ghaffarian, Ph.D.  Purchase 
    A UNIQUE, POLYIMIDE FILM BASED SUBSTRATE TECHNOLOGY THE NEO MANHATTAN TAPE INTERPOSER (NMTI) Stephen G. Pierce  Purchase 
    FLUORINATED SOLDERING TECHNOLOGY Stephen M. Bobbio  Purchase 
    METALLURGICAL AND RELIABILITY ASPECTS OF LEAD-FREE MIXED TECHNOLOGY ELECTRONIC ASSEMBLY FOR MOBILE COMMUNICATION PRODUCTS Steven O. Dunford & Dr. Puligandla Viswanadham  Purchase 

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