International Wafer-Level Packaging Conference 2013 Proceedings

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    TITLE AUTHOR DOWNLOAD
    Temporary Bonding Material Total Thickness Variation (TTV) A. Jacobs, M. Privett, G. Brand  Purchase 
    Some Trends In The Field Of Silicon Interposers A. Rouzaud, G. Simon, JP. Polizzi  Purchase 
    Advances In 300mm WLCSP Spheron™ Cu Platted RDL Technology For Higher Density And Lower Cost Packaging André Cardoso, Anthony Curtis  Purchase 
    An Investigation On The Effect Of Upstream Processes On The Quality Of Cu-Cu Bonding Interconnect Under Controlled Manufacturing Environment Anh Nguyen, Daniel Pascual, Eric Malocsay, Kevin Fealey, Paul Tariello, Peter Reilly  Purchase 
    Optical Technologies For TSV Inspection Arun A. Aiyer, Nikolai Maltsev, Jae Ryu  Purchase 
    Implementation Of A Fully Molded Fan-Out Packaging Technology B. Rogers, C. Scanlan, and T. Olson  Purchase 
    Cost Comparison Of Multi-Die Fan-Out Wafer Level Packaging And 2.5D Packaging With A Silicon Interposer Chet Palesko, Amy Palesko; and E. Jan Vardaman  Purchase 
    Thin Die Interconnect Process For 3DIC Utilizing Multiple Layers Of 50 Micron Thick Die On 300mm Wafers With A Tack And Collective Bonding Approach For Manufacturability Daniel Pascual, Colin McDonough, Anh Nguyen, Megha Rao, Robert Carroll, Douglas Coolbaugh, Joseph Piccirillo, Robert Geer  Purchase 
    MEMS Packaging: What Makes It So Special? Eric Mounier, PhD., Rozalia Beica  Purchase 
    Interconnect Structure For Room Temperature 3D-IC Stacking Employing Binary Alloying For High Temperature Stability Eric Schulte, Matthew Lueck, Alan Huffman, Chris Gregory, Keith Cooper, Dorota Temple  Purchase 
    Modeling The Imidization Kinetics Of A Low Temperature Cure Photosensitive Polyimide In Solid State Frank Windrich; Mikhail Malanin, Klaus-Jochen Eichhorn, Brigitte Voit  Purchase 
    Exploring Process Interaction Of No-Flow Underfill And Thermo-Compression Bonding In D2D Stacking G. Capuz, R. Daily, T. Wang, H. Struyf, R.A. Miller, K.J. Rebibis  Purchase 
    Quality In 3D Assembly – Is “Known Good Die” Good Enough? James Quinn, Barbara Loferer  Purchase 
    Vacuum-Assisted Wet Processing For Advanced 3D Devices Jennifer Rieker, Gim Chen and Ismail Kashkoush; Damien Michel and Patrick Daoust; and Irina Stateikina  Purchase 
    Minimizing Cost Of Calibration And Test (COCT) To Drive Cost Reduction Of MEMS John Rychcik, Barbara Loferer  Purchase 
    Spring Contact Probes In Wafer Level Test: Fundamentals And Advanced Concepts Jon Diller and Frank Zhou  Purchase 
    Examination Of Key Packaging Metrics Of A Hermetically Sealed MEMS Accelerometer Joshua Krabbe MSc., Nick Wakefield Ph.D., Serguei Roupassov MSc., Andy vanPopta Ph.D. Peter Hrudey Ph.D., Siamak Akhlaghi Ph.D.  Purchase 
    TSV Resist And Etch Residue Removal For 3DIC Kimberly Pollard, Richard Peters, Mike Phenis, Yuanmei Cao, Travis Acra, Don Pfettscher, Meng Guo  Purchase 
    Converging Front-End, Back-End And Flat Panel Display Manufacturing Technologies To Meet 2.5/3D And Fan-Out Packaging Requirements Klaus Ruhmer, Rajiv Roy, Philippe Cochet, Elvino Da Silveira  Purchase 
    Polyimede PCB Embedded With Two Dies In Stacked Configuration Koji Munakata, Nobuki Ueta, Masahiro Okamoto, Kumi Onodera, Kazuhisa Itoi, Satoshi Okude and Osamu Nakao; and Jon Aday and Theodore (Ted) G. Tessier  Purchase 
    30 Years Of Wafer-Level Packaging For Microsystems: From Automotive To Mobile Electronics And Beyond Leland “Chip” Spangler, Ph.D.  Purchase 
    High-Speed Removal Of Thick Negative Photoresist In Advanced Packaging Applications Mani Sobhian, Arthur Keigler, Daniel Goodman; Patrick Kearney; and M. David Webster  Purchase 
    Multiple Wafer MEMS WLP Michael Shillinger  Purchase 
    Wafer Level Packaging For Ultraminiature/Low-Cost MEMS Accelerometers Noureddine Hawat, Zhiwei Duan, Yang Zhao, Ph.D.  Purchase 
    Microbump Lithography For 3D Stacking Applications Patrick Jaenen, John Slabbekoorn, Andy Miller; Warren W. Flack, Manish Ranjan, Gareth Kenyon, Robert Hsieh, Ha-Ai Nguyen  Purchase 
    A Process Level Comparative Analysis Between D2W Local And Collective 3D Bonding R. Daily, G. Capuz, T. Wang, P. Bex, H. Struyf, K. Rebibis  Purchase 
    Inspection And Metrology Solutions For Copper Pillar High Volume Manufacturing Rajiv Roy  Purchase 
    Single Wafer Resist Removal For Wafer-Level Packaging With Improved Process Integration Richard Peters, Travis Acra, Yuanmei Cao, Kimberly Pollard, Don Pfettscher, Meng Guo  Purchase 
    Low Warpage And Improved 2.5/3DIC Process Capability With A Low Stress Polyimide Dielectric Robert L. Hubbard and Bong-Sub Lee  Purchase 
    Novel Cheap Solutions For 3D Integration On Wafers With Thin Interposers Semyon D. Savransky, Ph.D.  Purchase 
    Overcoming the Productivity Challenges in Wafer Level Packaging Shekar Krishnaswamy and David F. Hanny  Purchase 
    Study Of The Electroless Plating Process For Special Materials Or Small Pads For UBM Formation Shigeo Hashimoto, Yukinori Oda, Shinji Ishimaru, Hiromu Inagawa; and Don Gudeczauskas  Purchase 
    Automating The Design And Layout Of Wafer Level Masks Steve DiBartolomeo  Purchase 
    Metal Inter-Diffusion And Eutectic Wafer Bonding Processes For Advanced Mems Packaging Sumant Sood, Robert Hergert; and Oliver Treichel  Purchase 
    Micro Ball Bumping Packaging For Wafer Level & 3-D Solder Sphere Transfer And Solder Jetting Thomas Oppert, Thorsten Teutsch, Ghassem Azdasht, Elke Zakel, Richard McKee  Purchase 
    Recent Results Using MET-Via TSV Interposer Technology As TMV Element in Wafer Level Through Mold Via Packaging of CMOS Biosensors Thorbjörn Ebefors, PhD, Jessica Fredlund, Erik Jung and Tanja Braun, PhD  Purchase 
    Choosing Lithography Equipment To Minimize The Cost Of Wafer Level Packaging Tim McCrone, Robert Hergert; and Ralph Zoberbier  Purchase 
    2.5D And 3D Packaging Platform For Next Generation RF And Digital Modules Using Through Glass Vias (TGV) Technology Tim Mobley and Sergio Cardona  Purchase 
    Reliable Interconnection With Electroplated Cu Pillars And SnAg Solder Caps Yi Qin, Jui-Ching Lin, Julia Woertink, Jonathan Prange, Pedro Lopez Montesinos, Inho Lee, Yil- Hak Lee, Masaaki Imanari, Erik Reddington, Mark Lefebvre, Jianwei Dong, Wataru Tachikawa, Jeffrey Calvert  Purchase 

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