SMTA International 2013 Proceedings

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    TITLE AUTHOR DOWNLOAD
    European Union RoHS Recast – Implication For Exemption And Substance Review Adam Wheeler, Jackie Adams, Marie Cole, Curtis Grosskopf, Jeff Lagler, Sophia Lau, Dale Wilhite, and Kurt Van der Herten  Purchase 
    New Directions In Electrical Test Scalability & Automation Alan Albee and Bobby Griffis  Purchase 
    Lead Tinning Requirements For The 21st Century Alan Cable and Roger Cox  Purchase 
    Demonstrated Process And Reliability Of 0.35 mm Pitch BGA Devices For Mobile Environment Alan Choi, Brian Roggeman and Mark Schwarz  Purchase 
    Nanomaterials And Printed Electronics Alan Rae  Purchase 
    Mining Electronics For Rare Earths Alan Rae  Purchase 
    Conformal Coating 101: General Overview, Process Development, And Control Methods Alex Zeitler  Purchase 
    Effect Of Mixed Alloy BGA Reballing On Board Level Drop Test Reliability Andrew Daya and S. Manian Ramkumar, Ph.D.  Purchase 
    Effect Of Sn Grain Morphology On Failure Mechanism And Reliability Of Lead-Free Solder Joints In Thermal Cycling Tests Babak Arfaei, Ph.D. and Martin Anselm, Ph.D.; Shantanu Joshi, Sam Mahin-Shirazi, Peter Borgesen, Ph.D. and Eric Cotts, Ph.D.; James Wilcox, Ph.D.; and Richard Coyle, Ph.D.  Purchase 
    Reliability Testing Of PWB Plated Through Holes Using Interconnect Stress Testing Thermal Cycling Before And After Pb-Free Reflow Preconditioning Bill Birch  Purchase 
    Materials Testing of PWB Substrates to Determine Survivability Through Lead Free Assembly Bill Birch and Jason Furlong  Purchase 
    Data Fusion For Augmented Electronic Counterfeit Detection Efficacy Bill Cardoso, Ph.D.  Purchase 
    Probe Technologies To Improve First Pass Yields Brian Crisp, Ken Snyder and Tom Merline; Brook Sandy-Smith  Purchase 
    Electrical Performance Evaluation Of High-Frequency Laminates As A Function Of Temperature And Humidity Brian Wright  Purchase 
    Optimizing Assembly Of QFNs Brook Sandy-Smith and Seth Homer  Purchase 
    Solder Assembly Solutions For 3DIC Packaging Charles G. Woychik Ph.D., Ellis Chau, Sitaram Arkalgud Ph.D., Andrew Cao Ph.D. and Vern Solberg  Purchase 
    Reliable Plated Through Via Design And Fabrication Cheryl Tulkoff and Craig Hillman, Ph.D.  Purchase 
    Best Practices For Improving The PCB Supply Chain: Performing The Process Audit Cheryl Tulkoff, Greg Caswell, and Craig Hillman, Ph.D.  Purchase 
    A Technology To Reduce Pad Cratering Defects And The Impact On Product Cost Chet A. Palesko, Amy J. Palesko; and Chris Hunrath, Ken Parent  Purchase 
    Improving Electronics Sustainability With A Novel Reusable, Unzippable, Sustainable Electronics (Reuse) Interconnect System Chris Hunt and Martin Wickham; Robin Pittson; and John Lewison  Purchase 
    Fine Tuning The Stencil Manufacturing Process And Other Stencil Printing Experiments Chrys Shea and Ray Whittier  Purchase 
    Gold Embrittlement In Lead-Free Solder Craig Hillman, Ph.D., Nathan Blattau, Joelle Arnold, Thomas Johnston, and Stephanie Gulbrandsen; Julie Silk; and Alex Chiu  Purchase 
    High I/O BGA Connector Solder Joint Integrity Investigation D. Hillman, R. Wilcoxon, K. Cho, J. Sailer, J. Waskow, J. Crawford, T. Wade  Purchase 
    Overcoming The Challenges Presented With Automated Selective Conformal Coating Of Advanced Electronic Assemblies By Employing Plasma Treatment Technology David Foote  Purchase 
    Copper Corrosion Effects From Cleaning Agent Entrapment David Thomas Lober and Mike Bixenman, D.B.A; and Linda Woody  Purchase 
    Impact Of Lead Free Assembly On Laminate Electrical Performance For High Layer Count And High Reliability PCB Deassy Novita, Ph.D., Gary Brist, and Gary Long  Purchase 
    A.R.E.A.- A Roadmap Of Technology And Reliability Characterization Denis Barbini, Ph.D. and Martin Anselm, Ph.D.  Purchase 
    ESD Concept – Person, Workplace, Machinery, Transportation Dipl.-Ing. Hartmut Berndt  Purchase 
    Is A High Phosphorus Content In The Nickel Layer A Root Cause For “Black Pad” On Enig Finishes? Dipl.-Ing. Mustafa Özkök, Joe McGurran, and Kenneth Lee, Ph.D.  Purchase 
    Ultra Fine Pitch Reballing –What Needs To Change? Don Naugler and Robert Wettermann  Purchase 
    Acceptance Testing Of Pb-Free Bar Solder Alloys Elizabeth Elias Benedetto, Aileen Allen, Kris Troxel, Jian Miremadi  Purchase 
    Case Study: Tools To Assure Compatibility Of Conformal Coatings And No-Clean Lead-Free Solder Pastes Emmanuelle Guéné and Céline Puechagut  Purchase 
    Understanding Electrical Leakage And Electrochemical Migration In Electronics Eric Camden  Purchase 
    Jetetch Cuprotect And Copper IC Inspection Erik Jordan  Purchase 
    Next Generation No-Clean Lead Free Solder Paste Evaluation For Fine Pitch Applications Fei Xie, Ph.D., Daniel F. Baldwin, Ph.D., Paul N. Houston, Brian J. Lewis, Han Wu  Purchase 
    Effect Of Variation In The Reflow Profile On The Microstructure Of Near Eutectic SnAgCu Alloys Francis Mutuku, Babak Arfaei, Ph. D. and Eric J. Cotts, Ph.D  Purchase 
    Effect Of Variation In The Reflow Profiles Of Pb Free Solder On Lifetimes In Room Temperature Fatigue Tests Francis Mutuku, Eric Cotts, Ph.D. and Babak Arfaei, Ph.D., Martin Anselm, Ph.D.  Purchase 
    Can Selective Soldering Meet Fine Pitch And Other Trends? Gerjan Diepstraten  Purchase 
    The Effect Of Coating And Potting On The Reliability Of QFN Devices Greg Caswell and Cheryl Tulkoff  Purchase 
    Investigations Of Sintering Technology For Power Electronics Hans-Jurgen Albrecht, N. Busche, J. Strogies, and K. Wilke  Purchase 
    A Multi-Level Finite Element Study To Analyze The Chippackage- Interaction For Cu/Low-K Interconnects Hardik Parekh, Fahad Mirza, Samip Shah, and Dereje Agonafer  Purchase 
    Fine Pitch Re-Ball And Reliability Harry Schoeller, Ph.D. and Michael Meilunas  Purchase 
    Soldering In Nitrogen Atmosphere – Do Quality Aspects Justify The Costs? Heike Schlessmann and Ronny Horn, Ph.D.  Purchase 
    Corrosion Resistance Of High Temperature Lead-Free BiAgX TM Paste HongWen Zhang, RunSheng Mao and Ning-Cheng Lee, Ph.D.  Purchase 
    High Reliability Pb-Free Halogen Free Solder Ian J. Wilding and Gavin J. Jackson  Purchase 
    A Pseudo-Stress, Pseudo-Strain Methodology To Predict Lead-Free Solder Joint Reliability Jean-Paul Clech  Purchase 
    Stencil Aperture Design Considerations For 0.3 CSP Ultra-Fine Pitch Printing Jeff Schake, Mark Whitmore and Clive Ashmore  Purchase 
    Improved Prediction of Compressive Forces Required in Thermal Interface Pad Applications Jeffrey Marcus Jennings  Purchase 
    Voiding Mitigation For Bottom Terminated Components Jennifer Nguyen, David Geiger and Murad Kurwa  Purchase 
    Developing A Knowledge Based Risk Identification System For Sophisticated SMT Assembly Design And Development Jingsong Xie, Ph.D.; Yu-Ming Ye and Ji-Fan Wang  Purchase 
    Conductive Anodic Filament (CAF) Performance Of PWB Materials Before And After Pb-Free Reflow Joe Smetana, Kim Morton, and Thilo Sack  Purchase 
    Strain Rate And Cyclic Dependencies Of PCBA Pad Crater Susceptibility John McMahon, Brian Standing, Michael Thomson, Jim Wilcox, Derek Robertson, and Matt Kelly  Purchase 
    Warpage Mitigation Processes In The Assembly Of Large Body Size Mixed Pitch BGA Coreless Packages For Use In High Speed Network Applications John Savic and Weidong Xie; Nokibul Islam, Park Gun Oh, Raj Pendse and KyungOe Kim  Purchase 
    Flex Based Embedded Die System In Package Modules Jon Aday, Theodore Tessier, and Kazuhisa Itoi  Purchase 
    High Density Assembly In PCB Cavities Jonas Sjoberg, Ranilo Aranda, David Geiger and Murad Kurwa  Purchase 
    New Requirements For SIR- Measurement Jörg Trodler and Mathias Nowottnick  Purchase 
    New Interconnection For High Temperature Application: HotPowCon (HPC) – Part 2 Jörg Trodler, Mathias Nowottnick, and Andreas Fix, Timo Herberholz  Purchase 
    Solder Joint Crack Investigations In Real Cases Jose M. Servin and Cynthia Gomez  Purchase 
    Effects Of Materials, Design And Process On Intermetallic Formation And Evolution In Solder Microbumps K. Schnabl, L. Wentlent, K. Mootoo, E. Perfecto, M. Lu, and P. Borgesen  Purchase 
    Alternative Lead-Free Alloys For SMT Assembly Karl F. Seelig  Purchase 
    Production Testing Of Ni-Modified SnCu Solder Paste Karl Seelig, Timothy O’Neill, Kevin Pigeon & Mehran Maaleckian; Andy Monson and Walter Machado; and Chrys Shea  Purchase 
    Legacy Management: Cross-Industry Sustaining Engineering And Managing Obsolescence Counterfeit Risk Kaye Porter  Purchase 
    Modified Hypereutectic Sn-Cu Pb-Free Solder For Power Semiconductor Die Attach Keith Sweatman, Motonori Miyaoka, Takatoshi Nishimura, Xuan Quy Tran, Stuart McDonald, and Kazuhiro Nogita  Purchase 
    In Search Of A Workable Counterfeit Risk Mitigation Strategy: Lessons Learned In Review Of The Current State Of The Electronics Industry As Regards Counterfeit Mitigation Requirements For Suppliers Kevin Sink  Purchase 
    Converting High Volume IC Manufacturing To Cu Wire Packaging Larry Bright  Purchase 
    Power Electronics Packages With Embedded Components – Recent Trends And Developments Lars Boettcher, Stefan Karaszkiewicz, Dionysios Manessis and Andreas Ostmann  Purchase 
    A Process For Improved QFN Reliability Lenora Toscano, John Ganjei, Ph.D, Richard Retallick, and Gu Hong, Ph.D  Purchase 
    Impact Of Component Bake On Solder Joint Quality Lilia May, Dudi Amir, Srinivasa R. Aravamudhan, Garrett D.Cogburn, Christopher Kovalchick, Rajen S. Sidhu, Suddhasattwa Nad, Wade Hezeltine  Purchase 
    Nanocopper As A Replacement For Solder -- A Question Of Reliability? Luke Wentlent, Karl Schnabl, S. Khasawneh, K. Mootoo, J. Owens, J. Jiang, A. A. Zinn, J. Beddow, R. Stoltenberg, J. Chang, E. Hauptfleisch, D. Blass, and Peter Borgesen, Ph.D.  Purchase 
    Investigation On Pad Crater Failure Of BGA Solder Joints Luo Daojun, Zou Yabin and He Guanghui  Purchase 
    Facilitating The Reduction Of Head-In-Pillow Defects And Improving Assembly Reliability & In-Line Productivity Using Nitrogen Reflow Maëva S. Tureau, Ph.D., Gregory K. Arslanian, Christine C. Dong, Ph.D.  Purchase 
    Fix The Process Not Just The Product Mary Elmallakh, M. Sc. and Paul Groome; and Andy Shelton  Purchase 
    Solder Joint Encapsulant Adhesive – Pop TMV High Reliability And Low Cost Assembly Solution Mary Liu, Ph.D. and Wusheng Yin, Ph.D.  Purchase 
    Silica Gel Coating For Thermal Management Of Electronic Components Mathias Nowottnick, Felix Bremerkamp and Dirk Seehase  Purchase 
    Plasma Stencil Treatments: A Statistical Evaluation Matt Kelly, P.Eng., William Green, Marie Cole, Ruediger Kellmann  Purchase 
    Accountability Structure In A Contract Manufacturing Engineering Department Michael E. Gerner  Purchase 
    Progression To 0.3 mm Pitched BGA SMT Assembly Michael Kochanowski, M.B.A.  Purchase 
    Enclosed Media Printing As An Alternative To Metal Blades Michael L. Martel  Purchase 
    Fine Pitch Reliability Comparisons Between Components Assembled On Motherboards Containing Filled Or Unfilled Microvia-In-Pad Michael Meilunas and Martin Anselm, Ph.D.  Purchase 
    QFN Design Considerations to Improve Cleaning Mike Bixenman, Dale Lee, Bill Vuono, and Steve Stach  Purchase 
    Electronic Assembly Misprint Cleaning Advancements Mike Bixenman, DBA and Dirk Ellis; Jody Saultz, Eric Becker, Greg Calvo and Jim Morris  Purchase 
    Eliminating Wave Soldering With Low Melting Point Solder Paste Mitch Holtzer and Tuck Weng Mok  Purchase 
    Low Temperature Alloy Development For Electronics Assembly – Part II Morgana Ribas, Ph.D., Sujatha Chegudi, Anil Kumar, Sutapa Mukherjee, Siuli Sarkar, Ph.D.; Ranjit Pandher, Ph.D., Rahul Raut, and Bawa Singh, Ph.D.  Purchase 
    Penetration Into An International Market: The Aspects Of Sales Channels Management Moshe Shavit, D.B.A. and Kewal K. Verma, Ph.D.  Purchase 
    A Study Of Lead-Free Low Silver Solder Alloys With Nickel Additions Munehiko Nakatsuma, Takehiro Wada, Kimiaki Mori, Koichi Shimokawa, Takeshi Shirai, Atsushi Irisawa, Roberto Garcia, Jasbir Bath  Purchase 
    Solder / Metallization Interdiffusion – Case Studies Nausha Asrar, Ph.D.  Purchase 
    Factors Impacting Solder Extrusion In Reworkable Underfills Neil Poole, Ph.D.  Purchase 
    Predicting The Reliability Of Package-On-Package Interconnections Using Computational Modeling Software Paul T. Vianco, Ph.D., Michael K. Neilsen, Jerome A. Rejent, J. Mark Grazier, and Alice C. Kilgo  Purchase 
    Benefit And Challenges Of Manufacturing With Printed Circuit Board Cavities Pedro J. Martinez, William O. Alger, Weston C. Roth, and Sanjay Goyal  Purchase 
    Capillary IC – A New Platform For Detection Of Ionic Compounds On Electronic Components Peter Bodsky  Purchase 
    Life Prediction Of Lead-Free Electronics Under Simultaneous Automotive Environments Of High Temperature And Vibration Pradeep Lall, Ph.D. and Geeta Limaye  Purchase 
    Process And Material Envelope For Allowable Package-On-Package Warpage Pradeep Lall, Ph.D., Kewal Patel, and Vikalp Narayan  Purchase 
    High Strain Rate Properties Of SAC105 And SAC305 Leadfree Alloys After Extended High Temperature Storage Pradeep Lall, Sandeep Shantaram; and David Locker  Purchase 
    Print Performance Studies Comparing Electroform And Laser-Cut Stencils Rachel Miller Short and William E. Coleman Ph.D.; and Joseph Perault  Purchase 
    Solderability And Oxide Thickness Measurement To Determine Long Term Storage Of BGA And QFP Rama Hegde, Ph.D. Terry Burnette and Andrew Mawer  Purchase 
    Design For Reliability With Computer Modeling Randy Schueller, Ph.D. and Cheryl Tulkoff  Purchase 
    Ultra-Flat And Almost No Profile ED-Copper Foils For High Speed Digital Pcbs And Chip Scale Packaging Raymond Gales  Purchase 
    Overview Of Industry Roadmaps For Printed Electronics Reza Ghaffarian, Ph.D.  Purchase 
    The Effect Of Pb Mixing Levels On Solder Joint Reliability And Failure Mode Of Backward Compatible, High Density Ball Grid Array Assemblies Richard Coyle, Raiyo Aspandiar, Vasu Vasudevan, Steve Tisdale, Iulia Muntele, Richard Popowich, Debra Fleming, and Peter Read  Purchase 
    Inemi Pb-Free Alloy Characterization Project Report: Part Vi – The Effect Of Component Surface Finish And Solder Paste Composition On Thermal Fatigue Of Sn100c Solder Balls Richard Coyle, Richard Parker, Babak Arfaei, Keith Sweatman, Keith Howell, Stuart Longgood, and Elizabeth Benedetto  Purchase 
    Inemi Pb-Free Alloy Characterization Project Report: Part V – The Effect Of Dwell Time On Thermal Fatigue Reliability Richard Coyle, Richard Parker, Michael Osterman, Stuart Longgood, Keith Sweatman, Elizabeth Benedetto, Aileen Allen, Elviz George, Joseph Smetana, Keith Howell, Joelle Arnold  Purchase 
    Thermal Cycle Fatigue Life Models For Wlcsp Solder Joints Robert Darveaux  Purchase 
    Smt Assembly Challenges And Proven Solutions For Improving Yields Robert Dervaes  Purchase 
    Stencil And Solder Paste Inspection Evaluation For Miniaturized SMT Components Robert Farrell and Chrys Shea  Purchase 
    Using Weibull Analysis To Interpret Failure Data In Electronics Assembly Stress Testing Ronald C. Lasky, Ph.D., P.E.  Purchase 
    01005 Passive Component Rework Ronald Wachter  Purchase 
    Evaluation of Solder Pastes for High Reliability Applications Scott J. Anson Ph.D., PE; Michael McLaughlin and Abner Argueta  Purchase 
    Characterization Of Solder Paste Wetting/Spreading Performance – Current Status In International Norms And Standards Sebastian Stengel and Prof. Dr.-Ing. Marcus Reichenberger; and Jörg Trodler and Albert Heilmann  Purchase 
    Characteristics Of EPIG Deposits For Fine Line Applications Shigeo Hashimoto, Katsuhisa Tanabe, Masayuki Kiso, Kota Kitajima, Tatsushi Someya, and Don Gudeczauskas and George Milad  Purchase 
    Lead Free Antimony – Based Alloy Characterization Siew Kee Lee, You Chye How, and YS Khoo  Purchase 
    Underfill Encapsulants And Edgebond Adhesives For Enhancing Of Board Level Reliability Simon Chang, Edward S. Ibe, and Karl I. Loh  Purchase 
    Impact Of Low Silver Solder Pastes On Area Array Solder Joint Quality Srinivasa Aravamudhan, Raiyo Aspandiar, Ph.D., Lilia May, Ph.D., Suddhasattwa Nad, Scott Mokler, and Dudi Amir  Purchase 
    International Counterfeit Avoidance Certification By The IEC IECQ Stanley H. Salot Jr.  Purchase 
    Lead-Free Laminate DMA And Tma Data To Develop Stress Versus Temperature Relationship For Predicting Plated Hole Reliability Stephanie Moran, Joseph Smetana Jr., and Michael Freda  Purchase 
    Transducer And System Dependency Of Scanning Acoustic Microscope Images For Plastic Encapsulated Microelectronics Stephen C. Hwang  Purchase 
    Effect Of Warpage On SMT Process Of Pop Package And Its Solution Stephen Guo, Fubin Song, Jeff Qi and James Huang; and Alex Chen  Purchase 
    Enhancing Mechanical Shock Performance Using Edgebond Technology Steven Perng, Tae-Kyu Lee, and Cherif Guirguis; and Edward S. Ibe  Purchase 
    Manufacturability Assessment Of Next-Generation PCB Surface Finishes Sue Teng, J. Oliver and Scott Priore  Purchase 
    Advanced Organic Substrate Technologies to Enable Extreme Electronics Miniaturization Susan Bagen, Dave Alcoe, Kim Blackwell, Frank Egitto, Steven Rosser, Rabindra Das, and Glen Thomas  Purchase 
    Impact Of FPC Fabrication Process On SMD Reliability Susie Johansson, John Dzarnoski, Yangjun Xing  Purchase 
    A Method For Quickly Evaluating Aluminum Pad Corrosion Terence Q. Collier  Purchase 
    Effect Of System Design And Test Conditions On Wafer Level Package Drop Test Reliability Tiao Zhou, Ph.D. and Xuejun Fan, Ph.D.  Purchase 
    Alloy And Process Optimization For Low Ag Solders Timothy Jensen and Edward Briggs  Purchase 
    Can Nano-Coatings Really Improve Stencil Performance? Tony Lentz  Purchase 
    Concentration Monitoring & Closed Loop Control – A Technological Advancement Umut Tosun, M.S.Chem.Eng., and Axel Vargas; and Bryan Kim, Ph.D.  Purchase 
    The Second Generation Shock Resistant And Thermally-Reliable Low Ag SAC Solder Doped With Mn Vahid Goudarzi, Matthew Brown, Weiping Lin, Ning-Cheng Lee, and Jeffrey Chang Bing Lee  Purchase 
    State-Of-The-Art Test Techniques Vaughan Carlson  Purchase 
    Manufacturability Assessments Of Board Level Adhesives On Fine Pitch Ball Grid Array Components Venmathy Rajarathinam, James Wade, Alan Donaldson, Raiyo Aspandiar, Devadoss Chelladurai, Scott Mokler  Purchase 
    Higher Density Pop Semiconductor Packaging Solution: Bridging The Infrastructure Gap Between Wire-Bond And TSV Interconnect Vern Solberg, Belgacem Haba Ph.D., Wael Zohni, Ilyas Mohammed Ph.D. and Charles Woychik Ph.D.  Purchase 
    Investigation Of The Root-Cause Of Solder Bubbles In A Via Wang Yang and Luo Daojun  Purchase 
    Comparing LGA And BGA Assemblies In Terms Of Solder Pad Cratering Y. Zeng, Pericles Kondos, J. Jiang, Martin Anselm and Peter Borgesen  Purchase 
    Voiding And Reliability Of Bga Assemblies With Sac And 57Bi42Sn1Ag Alloys Yan Liu, Joanna Keck, Erin Page, and Ning-Cheng Lee, Ph.D.  Purchase 
    Reliability Improvement Of Array QFN Package You-Chye How  Purchase 
    3-D Fracture Analysis Of The Beol Region Of A Flip Chip Package During Die Attach Process Zaeem Baig, Fahad Mirza, Hardik Parekh and Dereje Agonafer  Purchase 
    2D/3D X-Ray Inspection: Process Control And Developmet Tool Zhen (Jane) Feng, Ph. D., Tho Vu, Michael Xie, David A. Geiger, Murad Kurwa; Zohair Mehkri; and Evstatin Krastev, Ph. D.  Purchase 
    Long-Term Aging Effects on Reliability Performance of Lead-Free Solder Joints Zhou Hai, Jiawei Zhang, Chaobo Shen, John L. Evans, Ph.D. and M. J. Bozack  Purchase 

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