Pan Pacific Symposium 2013 Proceedings

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    TITLE AUTHOR DOWNLOAD
    2013 iNEMI TECHNOLOGY ROADMAP OVERVIEW Bill Bader and Chuck Richardson  Purchase 
    IMPACT OF LEAD-FREE COMPONENTS AND TECHNOLOGY SCALING FOR HIGH RELIABILITY APPLICATIONS Chris Bailey, Ph.D.  Purchase 
    Technical Communications: Strategies For Success Chrys Shea  Purchase 
    THE QUEST FOR RELIABILITY STANDARDS Dieter W. Bergman  Purchase 
    REQUIREMENTS ON A CLASS “0” EPA – BASICS, STANDARDS, ESD EQUIPMENTS AND MEASUREMENTS Dipl.-Ing. Hartmut Berndt  Purchase 
    Three Dimensional Integration Research Focusing on Device Embedded Substrate Hajime Tomokage  Purchase 
    MICROSTRUCTURE CONTROL OF UNI-DIRECTIONAL GROWTH OF ?-CU6SN5 IN MICROBUMPS ON (111) ORIENTED AND NANOTWINNED CU Han-wen Lin, Jia-ling Lu, Chien-min Liu, Chih Chen, King-ning Tu, Delphic Chen, and Jui-Chao Kuo  Purchase 
    ALTERNATIVES TO SOLDER IN INTERCONNECT, PACKAGING, AND ASSEMBLY Herbert J. Neuhaus, Ph.D., and Charles E. Bauer, Ph.D.  Purchase 
    JETTING FINE LINES FOR HIGH VISCOSITY FLUIDS ONTO 2D AND 3D ELECTRONIC PACKAGES Horatio Quinones  Purchase 
    DIELECTRICS FOR EMBEDDING ACTIVE AND PASSIVE COMPONENTS J. Kress, R. Park, A. Bruderer, and N. Galster; and SH Cho  Purchase 
    THE CHALLENGES OF LGA SERVER SOCKET TRENDS Jackson Chang, Michael Hung, Bono Liao, and Nick Lin; Andrew Gattuso; and Bob McHugh  Purchase 
    ACOUSTIC MICRO IMAGING ANALYSIS METHODS FOR 3D PACKAGES Janet E. Semmens  Purchase 
    3D INTEGRATION A THERMAL-ELECTRICAL-MECHANICAL-RELIABILITY STUDY K. Weide-Zaage, J. Schlobohm, H. Frémont, A. Farajzadeh, J. Kludt  Purchase 
    A NANO SILVER REPLACEMENT FOR HIGH LEAD SOLDERS IN SEMICONDUCTOR JUNCTIONS Keith Sweatman, Tetsuro Nishimura, and Teruo Komatsu  Purchase 
    3D-TSV VERTICAL INTERCONNECTION USING Cu/SnAg DOUBLE BUMPS AND NON-CONDUCTIVE FILMS (NCFs) Kyung-Wook Paik,Yongwon Choi, and Jiwon Shin  Purchase 
    2Advanced Semiconductor Engineering Test RD Martin Anselm, Ph.D., and Wayne Jones  Purchase 
    AEROSOL JET? PRINTING OF CONDUCTIVE EPOXY FOR 3D PACKAGING Michael J. Renn, Ph.D., and Kurt K. Christenson, Ph.D.; Donald Giroux; and Daniel Blazej, Ph.D.  Purchase 
    DESIGN AND FABRICATION OF ULTRA-THIN FLEXIBLE SUBSTRATE Ming-Kun Chen, Yu-Jung Huang, Yi-Lung Lin, and Shen-Li Fu  Purchase 
    A MECHANISTICALLY JUSTIFIED MODEL FOR LIFE OF SnAgCu SOLDER JOINTS IN THERMAL CYCLING P. Borgesen, L. Yang, A. Qasaimeh, L. Yin, and M. Anselm  Purchase 
    TAMPER PROOF, TAMPER EVIDENT ENCRYPTION TECHNOLOGY Phil Isaacs, Thomas Morris Jr., and Michael J. Fisher; and Keith Cuthbert  Purchase 
    LOW-COST AND HIGH PERFORMANCE SILICON INTERPOSERS AND PACKAGES (LSIP) – A NEW GEORGIA TECH PRC INDUSTRY CONSORTIUM Rao R. Tummala, Ph.D., Venkatesh Sundaram, Ph.D., Qiao Chen, Hao Lu, and Gokul Kumar  Purchase 
    Panel Level Packaging - A Manufacturing Solution For Cost-Effective Systems Rolf Aschenbrenner, K.-F. Becker, T. Braun, and A. Ostmann  Purchase 
    SILICON V-GROOVE ALIGNMENT BENCH FOR OPTICAL COMPONENT ASSEMBLY Terry Bowen  Purchase 
    Cleaning High Reliability Assemblies with Tight Gaps, a Detailed Analysis Thomas M. Forsythe  Purchase 
    A NEW MANUFACTURING MODEL FOR SUCCESSFULLY COMPETING IN HIGH LABOR RATE MARKETS Tom Borkes  Purchase 
    BVA: SOLUTION FOR NEXT GENERATION VERY FINE-PITCH PACKAGE-ON-PACKAGE (PoP) APPLICATIONS Vern Solberg and Ilyas Mohammed  Purchase 
    3D IC INTEGRATION TECHNOLOGY DEVELOPMENT IN CHINA Wei Koh, Ph.D.  Purchase 
    COMPUTED TOMOGRAPHY ON ELECTRONIC COMPONENTS BETTER WAYS TO DO FAILURE ANALYSIS PLUS 4D CT THE NEW FRONTIER Wesley F. Wren  Purchase 
    SIDE WALL WETTING INDUCED VOID FORMATION DUE TO SMALL SOLDER VOLUME IN MICROBUMPS OF Ni/SnAg/Ni UPON REFLOW Y. C. Liang, C. Chen, and K. N. Tu  Purchase 

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