South East Asia Technical Training Conference on Electronics Assembly Technologies 2013 Proceedings

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    TITLE AUTHOR DOWNLOAD
    New Underfill Materials Designed for Increasing Reliability of Fine-Pitch Wafer Level Devices Brian J. Toleno, Ph.D., Stanley Hu, Hoseung Yoo1, and Rong Zhang, Ph.D.  Purchase 
    A Second and Third Tier Supplier Control and Management Process Celine YC Chong, Kenneth Scea, Donald Thomas, Allen Miller, Stephen Chong, Lenz Pan WC  Purchase 
    Conformal Coating Process for Networking and Communication Devices in Harsh Environments Chuan Xia & Scott Priore  Purchase 
    Achieving High Reliability Low-Cost Lead-Free SAC Solder Joints Via MN Doping Dr. Ning-Cheng Lee, Dr. Weiping Liu, Ronald C.Lasky, PhD, PE, and Timothy Jensen  Purchase 
    Causes, Characterization and Mitigation of Non Wet Open Defects for Area Array Components Dudi Amir, Satyajit Walwadkar, Srinivasa Aravamudhan, Lilia May and Kok Kwan Tang  Purchase 
    Case Study: Development of a Low Temperature Tin-Bismuth-Silver Solder Paste Emmanuelle Guéné and Céline Puechagut  Purchase 
    3D Board Level X-Ray Inspection Via Limited Angle Computer Tomography Evstatin Krastev Ph.D., David Bernard Ph.D. & Dragos Golubovic Ph.D.  Purchase 
    Solder Voiding in Assemblies Using Via-In-Pad Ball Grid Array Design Gurudutt Chennagiri, Satyanarayan  Purchase 
    Sealing Dispensing Requirements To Meet MEMS Packaging and Throughput Impact Heakyoung Park  Purchase 
    Changing Paradigms in Interconnect, Packaging, and Assembly Herbert J. Neuhaus, Ph.D., and Charles E. Bauer, Ph.D.  Purchase 
    High Reliability High Melting Mixed Lead-Free BiAgX Solder Paste System HongWen Zhang and Ning-Cheng Lee  Purchase 
    Procurement Cost Impact Analysis Tool Jane Wu, Jason Zhang, Philip Cheng, Ryan Zheng, Ellen Xu, Celine Chong  Purchase 
    Assembly and Design Challenges for New Generation 0.4/0.4mm Pitch Package on Package (PoP) and 0.3mm Pitch Chip Scale Package (CSP) Jonas Sjoberg, Ranilo Aranda, David Geiger and Murad Kurwa  Purchase 
    Optimizing Solder Paste for Void Minimization With Vacuum Reflow Keith Sweatman, Takashi Nozu, Tetsuro Nishimura  Purchase 
    Material Set Compatibility Kevin Tan, Reynaldo Rio, Casey Ng  Purchase 
    Factors Affecting Stencil Aperture Design for Next Generation Ultra Fine Pitch Printing Mark Whitmore, Jeff Schake & Clive Ashmore  Purchase 
    Cleaning Flux Residue Under Bottom Termination Components in Batch Spray-In-Air Tools Mike Bixenman, Chelsea Jewell, Kevin Soucy, Jan Declercq and Jason Chan  Purchase 
    Counterfeit Components Construction Analysis Methodology Ng Eric Sr., Xue Feng, Curtis Grosskopf  Purchase 
    Jetting Solder Paste Opens Up New Possibilities in Your SMT Production Nico Coenen  Purchase 
    Heatsink Adhesive Bonding Investigation Smile Ling, Jim Bielick, Michk Huang, Wayne Zhang, Blue Wang, Xiaoyun Xia and Divas Liu  Purchase 
    Counterfeit Electronics Parts, Avoidance, Detection, Mitigation Stanley H Salot Jr  Purchase 
    The Effects Of Formulation On Reflow Solderability Of Water Soluble Solder Paste In Air And Nitrogen T. P. Li, J. Y. R. Tan, S. A. Khoo, C. D. Breach and A. Hawkins  Purchase 
    Determine Critical Cleaning Process Parameters for QFNs Umut Tosun, M.S. Chem. Eng., Naveen Ravindran, M.S. Chem. Eng., and Michael McCutchen, M.S. Chem.  Purchase 
    An Evaluation to QFN Thermal Pad Void and Improvement Wayne Zhang, PK Pu, Ranndy Shi and Wilson Zhen  Purchase 
    PCB Assembly Process Development and Characterization of 0.3mm µCSP Packages Wu WeiPing (Jonathan Wu), RestyFonte Familara, LM Lim, Mohd Yusuf, Hien Ly, Chrys Shea  Purchase 

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