SMTA International 2000 Proceedings

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    TITLE AUTHOR DOWNLOAD
    AREA ARRAY REWORK – MOVING INTO THE NEXT MILLENNIUM Aaron Unterborn & Don Adams  Purchase 
    REWORK OF "MIRROR IMAGED" AREA ARRAY ASSEMBLIES Abhijit Limaye  Purchase 
    BGA SOLDER JOINT VOID AND ITS EFFECT ON THERMAL FATIGUE Agata Doroszuk  Purchase 
    LGA vs. BGA: WHAT IS MORE RELIABLE? A 2ND LEVEL RELIABILITY COMPARISON Ahmer Syed and Robert Darveaux  Purchase 
    FLIP CHIP SMT ASSEMBLY PROCESS TRADE-OFF COST ANALYSIS Alan R. Reinnagel  Purchase 
    LEAD FREE SOLDER FLUX VEHICLE SELECTION PROCESS Andrew Butterfield  Purchase 
    AUTOMOTIVE PBGA ASSEMBLY AND BOARD-LEVEL RELIABILITY WITH LEAD-FREE VERSUS LEAD-TIN INTERCONNECT Andrew Mawer and Kim-Marie Levis  Purchase 
    EVALUATING AND IMPLEMENTING POST-PLACEMENT/PRE-REFLOW INSPECTION Andrew Yates  Purchase 
    ADVANTAGES OF NON-CONTACT DISPENSING IN SMT ASSEMBLY PROCESSES Anthony F. “Frank” Piracci  Purchase 
    A WAFER LEVEL CHIP SIZE PACKAGE FOR MICROMECHANICAL AND MICROLENSES APPLICATIONS Avner Badihi  Purchase 
    CAN X-RAY IMAGING SERVE AS A METROLOGY TOOL? B. S. Mani  Purchase 
    THE IMPACT OF LEAD-FREE REFLOW TEMPERATURES ON THE MOISTURE SENSITIVITY PERFORMANCE OF PLASTIC SURFACE MOUNT PACKAGES B.T. Vaccaro, R.L. Shook, D.L. Gerlach  Purchase 
    POST-SOLDER CLEANING OF LEAD-FREE SOLDER PASTE RESIDUES Beth A. Bivins  Purchase 
    MEASUREMENT OF LARGE SOLDER VOIDS USING X-RAY IMAGE ANALYSIS Bill Olson and Mark Cholewczynski  Purchase 
    CHALLENGES IN MEMS PACKAGING Bishnu Gogoi  Purchase 
    IMPLEMENTING SELECTIVE SOLDERING: A COST EFFECTIVE ALTERNATIVE TO TRADITIONAL MASS SOLDERING Bob Klenke  Purchase 
    'BLACK BOX' ELECTRONICS MANUFACTURING - A PARADIGM SHIFT IN PROCESS CONTROL Brian Coll  Purchase 
    FLIP CHIP ON FLEX (FCOF): A ONEPASS PROCESS FOR CLEAN PRODUCTS Bryan D. Roecker and Greg Christner  Purchase 
    A CONSTITUTIVE MODEL FOR Pb/Sn SOLDER ALLOYS C. Basaran  Purchase 
    MINI-WAVE SELECTIVE SOLDERING – A MANUFACTURING ALTERNATIVE FOR DOUBLE-SIDED SURFACE MOUNT ASSEMBLIES Charlie Davis  Purchase 
    DESIGNING DISPENSING EQUIPMENT FOR VERY HIGH SPEED Chris Lee and Craig Lazinsky  Purchase 
    DFM: WHAT DOES IT REALLY MEAN? Dale Lee  Purchase 
    EXPERIMENTAL VALIDATION OF THE IMPACT OF THERMAL EXPANSION OFPRINTED CIRCUIT BOARDS SOLDER JOINT RELIABILITY Dan Rose, Brian Hunter  Purchase 
    PRODUCTION APPLICATION OF FLAT SOLDERABLE TIN FINISHES: SOME PRACTICAL CONSIDERATIONS David H. Ormerod  Purchase 
    A TRUE NO CLEAN / NO RESIDUE SMT PROCESS Demetrios Hatzis  Purchase 
    NEGOTIATING THE CEM SEA CHANGE Dirk McCoy  Purchase 
    EVAUATION OF IMMERSION SILVER FINISH FOR AUTOMOTIVE ELECTRONICS Dongkai Shangguan  Purchase 
    COMBINING VISUAL AND X-RAY INSPECTION OF AREA ARRAY DEVICES Douglas J. Peck  Purchase 
    MEMS PACKAGING & ASSEMBLY ISSUES Dr. Ken Gilleo  Purchase 
    IMPACT OF HIGHER MELTING LEAD-FREE SOLDERS ON THE RELIABILITY OF PRINTED WIRING ASSEMBLIES Dr. Laura J. Turbini  Purchase 
    WAFER LEVEL INTERCONNECTS WITH LEAD-FREE AND LOW ALPHA SOLDERS Dr. Ning-Cheng Lee  Purchase 
    DESIGN OF EXPERIMENTS FOR LEAD FREE MATERIALS, SURFACE FINISHES AND MANUFACTURING PROCESSES OF PRINTED WIRING BOARDS Dr. Sammy Shina  Purchase 
    CAPACITOR INDUCED BGA ASSEMBLY FAILURES Dudi Amir  Purchase 
    HUMAN ERROR AND MISTAKE PROOFING IN ELECTRONICS MANUFACTURING Edwin B. Smith III  Purchase 
    PIN IN PASTE PROCESS FOR ODD FORM ASSEMBLY Eyal Epstein  Purchase 
    A COMPARISON OF IMMERSION AND ELECTROLYTIC GOLD AS A FINAL FINISH FOR PCBS George M. Dalich Ph.D.  Purchase 
    USING PRODUCTION DEFECT DATA TO IMPROVE AN SMT ASSEMBLY PROCESS Glen Leinbach  Purchase 
    INTEGRATED PROFILING FOR THE REFLOW PROCESS Greg Jones  Purchase 
    THE STATE OF COMPONENT LOCATING AND HANDLING FOR ODD-FORM ASSEMBLY Gregory W. Holcomb  Purchase 
    BOARD LEVEL RELIABILITY OF LEAD FREE SOLDERED INTERCONNECTIONS H.-J. Albrecht  Purchase 
    CSP BOARD LEVEL RELIABILITY, RESULTS H.-J. Albrecht  Purchase 
    IMPACT OF IMPROPER SELECTION AND THE MISUSE OF INSPECTION MACHINES ON MEASUREMENT DATA Harjinder Ladhar  Purchase 
    MICROSTRUCTURAL ANALYSIS OF ORGANIC LAMINATE SUBSTRATES J. Stephen Tsai  Purchase 
    FLIP CHIPS AND ACOUSTIC MICRO IMAGING: AN OVERVIEW OF PAST APPLICATIONS, PRESENT STATUS, AND ROADMAP FOR THE FUTURE Janet E. Semmens  Purchase 
    DRIVING CONTINUOUS PROCESS IMPROVEMENT: A SECOND LOOK AT THE WAVE-SOLDER PROCESS Jeff Kennedy  Purchase 
    FEA RELIABILITY ASSESSMENT METHODOLOGY INVESTIGATION TO IMPROVE PREDICTION ACCURACY Jeff Riebling, Mark Brillhart  Purchase 
    STENCIL DESIGN IMPROVEMENT FOR BUMPING WAFERS BY PRINTING SOLDER PASTE Jeffrey D. Schake  Purchase 
    ULTRA-THIN FLIP CHIP ON BOARD ASSEMBLY Jie Zhang  Purchase 
    IMPLEMENTING SOLID SOLDER DEPOSITS IN A MANUFACTURING ENVIRONMENT Joanne DeBlis  Purchase 
    SMT PROCESS CONTROL STRATEGIES USING AXI (AUTOMATED X-RAY INSPECTION) John P. Garvin  Purchase 
    0201” PROCESS CONSIDERATIONS FOR REDUCED DEFECTS Jon Medernach  Purchase 
    THE RELIABILITY ASSESSMENT OF WAFER-LEVEL CSP (Omega-CSP) Jong-Heon Kim  Purchase 
    DEVELOPMENTS IN ODD-FORM ASSEMBLY Joseph Morris  Purchase 
    THE TERNARY EUTECTIC OF Sn-Ag-Cu SOLDER ALLOYS K.-W. Moon  Purchase 
    THE IMPACT OF AUTOMATED OPTICAL INSPECTION Kevin A. Towle  Purchase 
    CAUTION! INTERNATIONAL SPEED BUMP AHEAD Kirk Douglass  Purchase 
    ELECTROLESS Ni-P/Pd/Au PLATING FOR SEMICONDUCTOR PACKAGE SUBSTRATE Kiyoshi Hasegawa  Purchase 
    CSPs FOR PORTABLE ELECTRONICS Kobi Spector  Purchase 
    UNDERFILL CHARACTERIZATION FOR FLIP CHIP BGA FEATURING USE OF A RIGID SUBSTRATE Kunio Sakamoto  Purchase 
    DEVELOPMENT OF A RELIABLE STACK PACKAGE: D2BLP (DOUBLE DENSITY BOTTOM LEADED PACKAGE) Kwang-Seong Choi  Purchase 
    AN EXTREMELY - THIN PROFILE, BALL GRID ARRAY STYLE CHIP SCALE PACKAGE Lee Smith  Purchase 
    WIRE BONDING AND RELIABILITY OF MULTI-LAYER COPPER INTERCONNECT STRUCTURES Lei Mercado  Purchase 
    ELIMINATING SMT BOTTLENECKS Leo van de Vall  Purchase 
    ENCAPSULATION PROCESSES FOR ADVANCED SEMICONDUCTOR APPLICATIONS Lisa Marie Ryan  Purchase 
    AIRBORNE RADAR EVALUATION OF PRINTED CIRCUIT CONDUCTIVE FILAMENT GROWTH Lon E. Chase  Purchase 
    COMPARISON OF AG, NI/AU, AND SOLDER PWB SURFACE FINISHES ON THE SECOND LEVEL RELIABILITY OF FINE PITCH AREA ARRAY ASSEMBLIES Lon E. Chase  Purchase 
    TEST AND INSPECTION: TOOLS TO IMPROVE PROCESS CONTROL Lynn Leone  Purchase 
    QUALITY COST MODELS AND THE METHOD “STATISTICAL PROCESS CONTROL” M. Oppermann  Purchase 
    DESIGN AND PROCESS EFFECTS ON THE RELIABILITY OF 1.0 MM PITCH CBGA Marie Cole  Purchase 
    2000 STATUS OF BGA / CSP STANDARDIZATION Mark Bird  Purchase 
    VECTORAL IMAGING … THE NEW DIRECTION IN AUTOMATED OPTICAL INSPECTION Mark J. Norris  Purchase 
    THE EVERCHANGING EMS BUSINESS MODEL Mark Lyell  Purchase 
    SOLDERING PROCESS USING LIGHT BEAM TECHNOLOGY Masaharu Takagi, Toshikazu Yamaji, Steve Bellavia  Purchase 
    CHALLENGES AND SOLUTIONS IN REWORK PROCESS FOR CERAMIC COLUMN GRID ARRAY PACKAGES Mei Wang, Alington Lewis, Sammy Yi  Purchase 
    3D VISION TECHNOLOGY APPLICATIONS FOR COMPONENT PLACEMENT Michael Cieslinski  Purchase 
    EVALUATION OF GAS CHEMISTRY EFFECTS ON WIRE BOND INTEGRITY AND PACKAGE INTERFACIAL ADHESION IN THE BGA PACKAGE Michael Leoni  Purchase 
    E-COMMERCE: NEW BUSINESS MODELS FOR ELECTRONICS MANUFACTURING AND SUPPLY CHAIN MANAGEMENT Michael S. Chester  Purchase 
    FAILURE ANALYSIS AND CLOSED-LOOP CORRECTIVE ACTION FOR PROCESS IMPROVEMENTS Michael Snider  Purchase 
    TWO-SCALE MODEL-BASED SIMULATION OF A SOLDER ALLOY Michael W. Woodmansee  Purchase 
    SPC FOR SMT – DETERMINATION AND IMPLEMENTATION OF PROCESS CONTROLS AND DATA COLLECTION IN ELECTRONICS ASSEMBLY Mike McMonagle  Purchase 
    AIRCRAFT FLIGHT TESTS AND RELIABILITY IMPROVEMENTS OF MEMS PRESSURE SENSOR ASSEMBLY N.P. Kim  Purchase 
    INVESTIGATION OF REPAIRABLE UNDERFILL MATERIALS FOR RELIABILITY ENHANCEMENTS Nael Hannan and Puligandla Viswanadham  Purchase 
    NOVEL LOCALIZABLE HDI-PCB SOLUTION Naoto Minari  Purchase 
    BALL MEMS TECHNOLOGY Nobuo Takeda  Purchase 
    THE ROLE OF QUALITY AND TEST MODELING IN THE MANUFACTURE OF COMPLEX ELECTRONIC ASSEMBLIES Paul A. Thistle  Purchase 
    THE BENEFITS OF TURNOVER AND WHAT YOU SHOULD DO TO PREVENT IT Paul E. Slobodian, Ed. D.  Purchase 
    LASER REWORK TECHNOLOGY ENERGY SOURCE PERFORMANCE AND PROCESS SPECIFIC CSP RELIABILITY STUDIES Paul E. Wang Ph.D,  Purchase 
    REAL-TIME FACTORY DATA COLLECTION AND WEB REPORTING Paul Limon and Craig Kirby  Purchase 
    FLIP CHIP ASSEMBLY WITH REFLOW ENCAPSULANTS Pericles A. Kondos, Ph.D.  Purchase 
    DEVELOPMENT OF HIGH DENSITY THIN FILM SUBSTRATES Preeti Pande, Bob Werner and Rao Mahidhara  Purchase 
    HIGH SPEED STENCIL PRINTING OF SOLDER PASTE A DOE FULL FACTORIAL EXPERIMENT Prof. S. Manian Ramkumar & Jason Lemery  Purchase 
    CERAMIC GRID ARRAY TECHNOLOGIES FOR ACPI APPLICATIONS Raj. N. Master and O. T. Ong  Purchase 
    THE WORLDWIDE OEM ELECTRONICS ASSEMBLY MARKET, 1999 Randall Sherman  Purchase 
    IMPACT OF PRINT PARAMETERS AND CSP PITCH AND I/O ON PASTE QUALITY AND VOLUME Reza Ghaffarian  Purchase 
    COMPARISON OF IC AND MEMS PACKAGING RELIABILITY APPROACHES Reza Ghaffarian, Ph.D.  Purchase 
    THERMAL CYCLING TEST RESULTS OF CSP AND RF PACKAGE ASSEMBLIES Reza Ghaffarian, Ph.D.  Purchase 
    X-RAY SOLDER SLICING USING TRANSMISSION X-RAY SYSTEMS AND STANDALONE SOFTWARE Richard B.Knight, Jr.  Purchase 
    CONTRACT MANUFACTURERS AND MEMS PRODUCT COMMERCIALIZATION Richard D. Olmsted, Ph.D.  Purchase 
    A PERSPECTIVE ON FLIP CHIP TECHNOLOGIES IN AUTOMOTIVE ELECTRONICS Richard D. Parker  Purchase 
    RELIABILITY OF AREA ARRAY SOLDER JOINTS IN BENDING Robert Darveaux  Purchase 
    EVAUATION OF IMMERSION SILVER FINISH FOR AUTOMOTIVE ELECTRONICS Robert Gordon  Purchase 
    eDFM – WEB BASED DESIGN FOR MANUFACTURABILITY Robert Rowland and Scott Buttars  Purchase 
    SMALL PROCESS IMPROVEMENTS EQUAL LARGE PROFITS Ronald C. Lasky, Ph.D., PE  Purchase 
    PREDICTION OF PCB THICKNESS FOR SELECTION OF A SUITABLE PCB MANUFACTURING TECHNOLOGY S. Pochareddy  Purchase 
    SNAP ARRAY CSP™ THE DEVELOPMENT OF SUPER THIN CSP WITH 0.5 mm TOTAL HEIGHT AND 3D STACKED CSP Seigo Matsuzono and Shoji Uegaki  Purchase 
    FLUXES FOR LEAD-FREE SOLDERS CONTAINING ZINC Semyon Vaynman, Morris E. Fine  Purchase 
    FLUORINATED SOLDERING TECHNOLOGY Stephen M. Bobbio  Purchase 
    CSP AND MICRO-BGA PROCESS AND DAMAGE ASSESSMENT WITH ACOUSTIC MICRO IMAGING (AMI) Steven R. Martell and J.E. Semmens  Purchase 
    YEAR 1999 DEFECT LEVEL AND FAULT SPECTRUM STUDY Stig Oresjo  Purchase 
    BOARD LEVEL RELIABILITY OF LEAD-FREE PACKAGES Swaminath Prasad  Purchase 
    PACKAGING THE MICRO-MACHINE T. P. Glenn  Purchase 
    SOLDER/SUBSTRATE INTERACTIONS BETWEEN LEAD-FREE SOLDERS AND CuNi ALLOYS T.M. Korhonen  Purchase 
    RELIABILITY OF LEAD FREE SOLDER JOINTS ON MANUFACTURING CONDITIONS Th. Herzog , K.-J. Wolter, Th. Zerna  Purchase 
    ATTACHMENT RELIABILITY OF CHIP SCALE PACKAGES WITH VARIOUS CONSTRUCTIONS Theo I. Ejim  Purchase 
    CHIP SCALE PACKAGE SOLDER ATTACH RELIABILITY OPTIMIZATION Thomas F. Long  Purchase 
    MOLDED UNDERFILL FOR FLIP CHIP IN PACKAGE Tim Chen  Purchase 
    “PRODUCING” THE DESIGN: DESIGNING ELECTRONIC PRODUCTS IN THE YEAR 2000 AND BEYOND Tom Borkes  Purchase 
    EFFECT OF THERMAL CYCLING RAMP RATES ON SOLDER JOINT FATIGUE LIFE V. S. Sastry, J. C. Manock, and T. I. Ejim  Purchase 
    RELIABLE AND LOW COST WAFER LEVEL PACKAGING Implementing the Wide Area Vertical Expansion (WAVE) Process Vern Solberg, David Light and Joseph Fjelstad  Purchase 
    A LOW COST, LOW I/O WAFER LEVEL CSP FOR ESD PROTECTION Vrej Barkhordarian Ph.D.  Purchase 
    STENCIL DESIGN GUIDELINES William E. Coleman  Purchase 
    FATIGUE DAMAGE ACCUMULATION IN 63Sn-37Pb SOLDER ALLOY Y. Wei and C. L. Chow  Purchase 

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