Pan Pacific Symposium 2005 Proceedings

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    TITLE AUTHOR DOWNLOAD
    DESIGN TECHNIQUES FOR DEVELOPING INTEGRATED ANTENNAS FOR WIRELESS SENSORS A. Gandelli, M. Mussetta, P. Pirinoli, and R. Zich  Purchase 
    NANOTECHNOLOGY AND LOW TEMPERATURE ELECTRONICS ASSEMBLY Alan Rae  Purchase 
    PARIDIGM SHIFT IN APPLYING UNDERFILL Alec J. Babiarz  Purchase 
    GENERAL APPROACH IN REDUCING EMI FOR 3D MICROELECTRONICS SENSORS Alessandro Gandelli et al.  Purchase 
    FLEXURAL STRENGTH OF BGA SOLDER JOINTS WITH ENIG SUBSTRATE FINISH USING 4-POINT BEND TEST Anurag Bansal, Sam Yoon, and Vadali Mahadev  Purchase 
    ASSEMBLY CONCERNS FOR TEST IN STRIP Bob Fenton  Purchase 
    OPTIMIZED FINAL MANUFACTURING FOR WAFER LEVEL PACKAGING Bob Fenton  Purchase 
    SELECTIVE SOLDER PASTE DEPOSITION RELIABILITY TEST RESULTS Bob Wettermann  Purchase 
    IMPROVEMENT OF THE ACCURACY OF HIGH SPEED MILLING ON SO-DIMM DEPANEL PROCESS OF PCA C.Y. Ho et al.  Purchase 
    ORIGINAL DESIGN MANUFACTURERS VIABLE ALTERNATIVE/DISTINCT BUSINESS PRACTICES Charlie Barnhart  Purchase 
    3D CHIP STACK WITH WAFER THROUGH HOLE TECHNOLOGY Chien-Wei Chien et al.  Purchase 
    MULTI-OBJECTIVE OPTIMIZATION IN MCM PLACEMENT Ching-Mai Ko, Yu-Jung Huang, and Shen-Li Fu  Purchase 
    BENEFITS AND CHALLENGES OF SYSTEM LEVEL INTEGRATION & MINIATURIZATION Craig S. Mitchell  Purchase 
    IMPLEMENTATION OF A LEAD FREE WAVE SOLDERING PROCESS: AN IN-DEPTH LOOK AT THE CRITICAL ISSUES Denis Barbini  Purchase 
    NEXT GENERATION INTERCONNECT TECHNOLOGIES FOR CHIP ON FLEXIBLE SUBSTRATES Dominique Numakura and Robert Turunen  Purchase 
    SUPPLY CHAIN IMPACT OF LEAD-FREE SOLDERING Dongkai Shangguan, Ph.D.  Purchase 
    ELECTRONICS PACKAGING & BOARD ASSEMBLY: TECHNOLOGY TREND AND IMPACT ON THE SUPPLY CHAIN Dongkai Shangguan, Ph.D.  Purchase 
    EFFECTS OF STORAGE ENVIRONMENTS ON THE SOLDERABILITY OF IMMERSION SILVER BOARD FINISHES WITH PB-BASED AND PB-FREE SOLDERS Edwin Lopez et al.  Purchase 
    "SEE NO DEFECT, SPEAK NO DEFECT, HEAR NO DEFECT" A PRODUCT QUALITY DEVELOPMENT PROGRAM BASED ON RANDOM DPA Eric Fremd  Purchase 
    LEAD-FREE SOLDER INSPECTION WITH X-RAY Friedhelm W. Maur  Purchase 
    A NOVEL LOW-COST, HIGH-PERFORMANCE THERMALLY AND ELECTRICALLY CONDUCTIVE ADHESIVE Fritz Byle and Jin Liu  Purchase 
    3-D DESIGN AND DATA COLLABORATION OF NEW TECHNOLOGY SIP Gordon Jensen and Masayuki Kayama  Purchase 
    PROCESS MATERIAL RELATED ADVANCED ASSEMBLY EQUIPMENT CRITERIA Guenter Schiebel  Purchase 
    UNDERFILL TECHNOLOGY FOR THE ENCAPSULATION OF LARGE, DENSELY POPULATED DIE WITH SMALL GAP FOR ADVANCED FLIP CHIP PACKAGING Guoyun Tian et al.  Purchase 
    LEAD-FREE PRODUCT AND PROCESS CONVERSION PHASE III - REFLOW PROCESS OPTIMIZATION* Hana Hsu et al.  Purchase 
    40GBS HIGH I/O PIN COUNT SURFACE MOUNTABLE CERAMIC PACKAGE Hui Wu et al.  Purchase 
    PLASMA TREATMENT FOR UNDERFILL PROCESS IN FLIP CHIP PACKAGING James D. Getty and Jack Zhao  Purchase 
    EVALUATION OF STACKED DIE PACKAGES USING ACOUSTIC MICRO IMAGING Janet E. Semmens  Purchase 
    IMBEDDED COMPONENT / DIE TECHNOLOGY: TECHNOLOGY REASSESSMENT & UPDATE Jason B. Gjesvold  Purchase 
    THE SNAGCU SOLDER JOINT INTEGRITY OF GREEN WLCSP IN LEAD FREE SMT Jeffrey C.B. Lee et al.  Purchase 
    REPORT ON FIELD TESTS OF A DEVELOPMENTAL FABRIC TECHNOLOGY FOR CLEANING FINE-PITCH STENCILS Kimberly F. Abbett, Ph.D. et al.  Purchase 
    THERMAL RC - NETWORKS FOR ACCURATE MODELING OF SYSTEM-IN-PACKAGE Kimmo Kaija and Eero Ristolainen  Purchase 
    ELECTROLESS NICKEL / IMMERSION GOLD PROCESS TECHNOLOGY FOR IMPROVED DUCTILITY OF FLEX AND RIGID-FLEX APPLICATIONS Kuldip Johal and Hugh Roberts et al.  Purchase 
    A STUDY ON RELIABILITY OF FLIP-CHIP SOLDER JOINTS USING PB-FREE SOLDERS AND ELECTROLESS Ni-P UBMS Kyung-Wook Paik et al.  Purchase 
    INFLUENCE OF DIELECTRIC MATERIALS AND VIA GEOMETRY ON THE THERMOMECHANICAL BEHAVIOR OF SILICON THROUGH INTERCONNECTS Mario Gonzalez et al.  Purchase 
    STENCIL PRINTING WITH LEAD-FREE SOLDER PASTE Mark J. Curtin  Purchase 
    ALIGNED WAFER BONDING FOR 3D INTERCONNECT TECHNOLOGIES Matthias Thorsten et al.  Purchase 
    A NOVEL ADHESIVE FOR IC PACKAGING Michael Kropp, PhD. and Andrew Behr  Purchase 
    SN-ZN LEAD-FREE SOLDERING TECHNOLOGIES FOR PERSONAL COMPUTERS Motoji Suzuki et al.  Purchase 
    CONSIDERATIONS FOR HEAT SPREADER ATTACH OPTIMIZATION ON HIGH PERFORMANCE FLIP CHIP BGA PACKAGES Mukul Joshi, Kumar Nagarajan, and Nael Zohni  Purchase 
    OVERVIEW OF ANISOTROPIC CONDUCTIVE ADHESIVES FOR FLAT PANEL DISPLAYS AND SEMICONDUCTOR PACKAGING APPLICATIONS Myung Jin Yim and Kyung-Wook Paik  Purchase 
    EFFECT OF BAKING TIME AND TEMPERATURE ON LEAD FREE SECOND LEVEL INTERCONNECT SOLDER JOINT MICROSTRUCTURES, MICROHARDNESS AND IMC MORPHOLOGY Norman J. Armendariz and Vasu Vasudevan  Purchase 
    RELIABILITY ANALYSIS OF SOME CERAMIC LEAD-FREE SOLDER ATTACHMENTS Olli Salmela et al.  Purchase 
    RESIDUAL STRESS CORRELATION TO ATC RELIABILITY SCALE IN THE µPGA-SOLDER JOINT-PCB PAD SYSTEM* Paul P.E. Wang, Ph.D. et al.  Purchase 
    MANUFACTURING OPTIMIZATION AND RELIABILITY OF LARGE SOLDERED DAUGHTER MODULES FOR HIGH PERFORMANCE COMMUNICATION APPLICATIONS R. Scott Priore, S. Camerlo, and M. Brillhart  Purchase 
    THERMAL MANAGEMENT OF HEAT-SENSITIVE COMPONENTS IN THE REFLOW AND REWORK PROCESSES Rahul Raut et al.  Purchase 
    HIGH PERFORMANCE, HIGH POWER, HIGH I/O CHIPS FIRST BUILD-UP TECHNOLOGY Ray Fillion / Charles E. Bauer, Ph.D.  Purchase 
    REALIZING LOW COST AND HIGH RELIABILITY IN CSP PACKAGES WITH SURFACE TREATMENT AND MATERIAL TECHNOLOGY Ryota Furukawa  Purchase 
    CONTINUED EVALUATION OF THE EFFECTS OF PROCESSING CONDITIONS AND AGING TREATMENTS ON PB-FREE SHEAR STRENGTH AND MICROSTRUCTURE S. Bukhari, D. Santos, L. Lehman, and E. Cotts  Purchase 
    ANALYSIS OF TESTING RESULTS OF SURFACE MOUNTED LEAD FREE SOLDERING MATERIALS AND PROCESSES Sammy Shina et al.  Purchase 
    MATERIAL DESIGN FOR THE NEXT GENERATION LOW-K/CU FLIP-CHIP PACKAGES Sarathy Rajagopalan and Kishor Desai et al.  Purchase 
    THE STATUS OF PACKAGING INDUSTRY IN TAIWAN Shen-Li Fu, Ph.D. et al.  Purchase 
    DIE ATTACH PROCESSES FOR HIGH RELIABILITY CHIP-ON-BOARD (COB) MANUFACTURING Steve Sytsma & Dan Lynch  Purchase 
    SHORT RANGE RADIO FREQUENCY ISSUES FOR SENSORS INSTALLED IN A HOME ENVIRONMENT T. Dishongh, Ph.D., B. Needham, and K. Rhodes  Purchase 
    DEVELOPMENT OF LOW DIELECTRIC CONSTANT AND LOW DIELECTRIC LOSS TANGENT FILM USED IN A HIGH FREQUENCY RANGE Taku Fujino  Purchase 
    SMT DEVELOPMENT AND INDUSTRY TRAINING Tanxi Wang and Yuming Wang  Purchase 
    RF & MICROPROCESSOR CIRCUITS FOR MEMS SENSOR PACKAGING Thomas Jorgensen et al.  Purchase 
    CLEANING IMPLICATIONS OF LEAD-FREE ASSEMBLY AND PACKAGING Thomas M. Forsythe  Purchase 
    HIGH-K INSULATION MATERIAL FOR EMBEDDED CAPACITOR Toshihisa Nonaka  Purchase 
    SEMICONDUCTOR PACKAGING TECHNOLOGY DEVELOPMENT TRENDS IN CHINA Wei Koh, Ph.D. and Sarah Shen et al.  Purchase 
    ASSEMBLY OF A SERIAL LINK TEST VEHICLE USING FLIP-CHIP, SMT, AND BGA ATTACH PROCESSES: A CASE STUDY Wendy Wilkins, Barry Gilbert, and Erik Daniel  Purchase 

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