SMTA International 2004 Proceedings

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    TITLE AUTHOR DOWNLOAD
    EFFECT OF LEAD-FREE SOLDER COMPOSITION ON VOIDING AT MICROVIA A. Dasgupta, Ph.D., B. Huang, Ph.D., Dr. N.-C. Lee  Purchase 
    BOARD LEVEL RELIABILITY OF QFP AND QFN TYPE PACKAGES WITH MATTE SN LEAD FINISH Ahmer Syed et al.  Purchase 
    HOT AIR LEAD-FREE REWORK OF BGA PACKAGES & SOCKETS Alan Donaldson and Raiyo Aspandiar  Purchase 
    THE ROLE OF TEMPERATURE EXTREMES IN THERMAL SHOCK ON FAILURE RATES FOR FLIP CHIPS ASSEMBLED WITH FILLED NO-FLOW UNDERFILLS Ananth Prabhakumar et al.  Purchase 
    COMPARISON OF BUMP AND SUBSTRATE TECHNOLOGIES FORFLIP CHIP BGA Andrew Mawer, Diane Hodges Popps, Tom Koschmieder  Purchase 
    INSPECTION OF LEAD-FREE SOLDER JOINTS ON PRINTED CIRCUIT ASSEMBLIES USING AUTOMATED INSPECTION TECHNIQUES Andrew Pollock  Purchase 
    EFFECT OF ASSEMBLY PROCESS CONDITIONS ON SYSTEM-LEVEL PERFORMANCE OF THERMAL INTERFACE MATERIALS Arun Gowda et al.  Purchase 
    MECHANICAL AND THERMAL CHARACTERIZATION OF LEAD FREE SOLDER Arv Sinha and Joe Kuczynski  Purchase 
    PROCESSING HEAT-SENSITIVE COMPONENTS IN LEAD-FREE AND OTHER CONDITIONS B. Lewis, P. Chouta, A. Singer et al.  Purchase 
    POTENTIAL FOR WHISKER FORMATION IN LEAD-FREE ELECTROPLATED CONNECTOR FINISHES B. Rickett and P. Elmgren et al.  Purchase 
    PLASTIC BALL GRID ARRAY PACKAGE WARPAGE AND IMPACT ON TRADITIONAL MSL CLASSIFICATION FOR PB-FREE ASSEMBLY B.T. Vaccaro et al.  Purchase 
    EFFECT OF LEAD-FREE ALLOY COMPOSITION ON TOMBSTONING Benlih Huang, Ph.D. and Ning-Cheng Lee, Ph.D.  Purchase 
    THE SUPPLY CHAIN ENGINEERING SOLUTION Bill Coker  Purchase 
    ACTIVE COMPONENT COOLING DURING PROCESSING Brian Lewis, Prashant Chouta, and Adam Singer  Purchase 
    FLIP-CHIP UNDERFILL AND FLUX RESIDUE INTERACTION IN A Pb-FREE PROCESS Brian Toleno, Ph.D. et al.  Purchase 
    A NEW MODEL FOR OUTSOURCING COMPLEX ASSEMBLIES Bruce W. Hueners  Purchase 
    EFFECT OF SOLDER PASTE VOLUME ON THERMOMECHANICAL RELIABILTY Chris Achong and Dennis Krizman  Purchase 
    OPTIMIZING STENCIL DESIGN FOR LEAD-FREE SMT PROCESSING Chrys Shea and Ranjit S Pandher  Purchase 
    HYBRID RF MEMS CIRCUIT PACKAGING Daniel J. Hyman, Ph.D.  Purchase 
    THE INTERACTION OF PWB SURFACE FINISHES AND 0201 COMPONENTS Dave Hillman and Jennifer Waskow  Purchase 
    IMPACT OF UNDERFILL AND SOLDER JOINT ALLOY SELECTION ON FLIP CHIP SOLDER JOINT RELIABILITY Dave Hillman and Ross Wilcoxon  Purchase 
    DOES PCB PAD FINISH AFFECT VOIDING LEVELS IN LEAD-FREE ASSEMBLIES? David Bernard and Keith Bryant  Purchase 
    USE OF DIGITAL X-RAY IMAGING AS A PROCESS CONTROL TOOL FOR LEAD-FREE PWB ASSEMBLY David Bernard et al.  Purchase 
    X-RAY INSPECTION OF AREA ARRAY PACKAGES USING TIN-LEAD AND LEAD-FREE SOLDERS David Geiger, Todd Castello, Dr. Dongkai Shangguan  Purchase 
    EFFECTS OF SUBSTRATE DESIGN ON UNDERFILL VOIDING FOR FLIP CHIP PROCESSING USING NO-FLOW UNDERFILL MATERIALS David Milner, Chetan Paydenkar, Dr. Daniel Baldwin  Purchase 
    SELECTIVE SOLDER PLATFORM JUSTIFICATION David Philips and Jeff Pekas  Purchase 
    0201 ASSEMBLY & MATERIALS CONSIDERATIONS David Suraski  Purchase 
    CONTROLLING COPPER BUILD UP IN AUTOMATIC SOLDERING EQUIPMENT USING LEAD-FREE SOLDER David Suraski and Karl Seelig  Purchase 
    ASSESSING THE MANUFACTURABILITY & RELIABILITY OF FINE PITCH ARRAY PACKAGES: AN IN-DEPTH STUDY Dennis Krizman, Chris Achong, Scott Waters  Purchase 
    THE EFFECTS OF IMMERSION SILVER CIRCUIT BOARD SURFACE FINISH ON ELECTROCHEMICAL MIGRATION Donald P. Cullen  Purchase 
    A HOLISTIC APPROACH TO LEAD-FREE TRANSITION AND ENVIRONMENTAL COMPLIANCE Dongkai Shangguan, Ph.D.  Purchase 
    EFFICIENT LINE CHANGEOVER: THE KEY TO LEAN MANUFACTURING Douglas Farlow  Purchase 
    WHY CLEAN A NO-CLEAN? Douglas Watson  Purchase 
    THE NORTH AMERICAN ELECTRONICS MARKET: THE CURRENT OUTLOOK AND POSITIONING FOR THE FUTURE Eric Miscoll  Purchase 
    EFFECT OF THE REFLOW PROFILE ON BGA VOIDING IN A LEAD-FREE PROCESS Felix Bruno and Frank Grano et al.  Purchase 
    MATERIAL CONTROL FOR LEAD-FREE MANUFACTURING François Monette  Purchase 
    INTRUSIVE REFLOW USING A LEAD-FREE PROCESS Frank Grano and Felix Bruno  Purchase 
    PCB DESIGN AND ASSEMBLY PROCESS STUDY OF 01005 SIZE PASSIVE COMPONENTS USING LEAD-FREE SOLDER Fredrik Mattsson et al.  Purchase 
    SELECTIVE SOLDERING - AN OVERVIEW OF THE PROCESS, THE EQUIPMENT AND THE ASSOCIATED BOARD DESIGN REQUIREMENTS Gary Dick  Purchase 
    A HISTORY OF TIN WHISKER THEORY: 1946 TO 2004 George T. Galyon  Purchase 
    BOARD DESIGN AND PROCESS OPTIMIZATION FOR PASTE-INHOLE USING LEAD-FREE SOLDER Gerhard Pfennich and Harald Fockenberger et al.  Purchase 
    PERFORMANCE MODELING OF A VME RIGID/FLEX ASSEMBLY Greg Bartlett and Robert Larmouth et al.  Purchase 
    SAC AND SnPb SOLDER JOINT THERMAL STRESS AND STRAIN CHARACTERIZATION FOR RESISTOR PACKAGES Guihua Shi, Ming Zhou and Hua Lu  Purchase 
    INTERFACE DESCRIPTION AND FAILURE MECHANISM OF SNAGCU SOLDERS IN BGA PACKAGES H.-J. Albrecht  Purchase 
    EVALUATING THE MANUFACTURABILITY AND RELIABILITY OF NEW CONNECTOR DESIGNS Heather McCormick, George Riccitelli, Jullie Tran  Purchase 
    3D X-RAY TESTS AND ANALYSES OF LEAD-FREE PBGA (PLASTIC BALL GRID ARRAY) PACKAGE SOLDER JOINTS J. Lau et al.  Purchase 
    TIN WHISKER MITIGATION: APPLICATION OF POST MOLD NICKEL UNDERPLATE ON COPPER BASED LEAD FRAMES AND EFFECTS OF BOARD ASSEMBLY REFLOW J. W. Osenbach et al.  Purchase 
    A CHARACTERIZATION OF COMPONENT RELIABILITY ON METALBACKED SUBSTRATES FOR USE IN HARSH AUTOMOTIVE ENVIRONMENTS James R. Thompson et al.  Purchase 
    LEAD-FREE AND TIN-LEAD REWORK DEVELOPMENT ACTIVITIES WITHIN THE NEMI LEAD-FREE ASSEMBLY AND REWORK PROJECT Jasbir Bath et al.  Purchase 
    IMBEDDED COMPONENT / DIE TECHNOLOGY: A HIGH RELIABILITY PACKAGING SOLUTION Jason B. Gjesvold  Purchase 
    SHOP FLOOR INFORMATION SYSTEMS EMERGING AS COMMERCIAL, OFF-THE-SHELF TECHNOLOGY Jason Spera  Purchase 
    AN OBSTACLE-CONTROLLED CREEP MODEL FOR SN-PB AND SN-BASED LEAD-FREE SOLDERS Jean-Paul Clech  Purchase 
    AOI PROCESS IMPROVEMENT Jeff Danner  Purchase 
    DEFENSE & AEROSPACE ELECTRONICS MANUFACTURING OUTSOURCING - REALITIES & TRENDS Jeff Kaylor  Purchase 
    STENCIL PRINTING SOLDER PASTE AND TRANSFER EFFICIENCY - ESTABLISHING THE BASELINE Jeffrey D. Schake / Mark A. Whitmore  Purchase 
    UV LASER-BASED MEMS AND MOEMS MICROMACHINING Jeffrey P. Sercel  Purchase 
    A COMPONENT LEVEL PREDICTIVE RELIABILITY MODELING METHODOLOGY Jennifer V. Muncy and Daniel F. Baldwin  Purchase 
    LEAN CULTURE STRATEGY DRIVES COST SAVINGS FOR EMS PROVIDERS Jim Lanigan  Purchase 
    REWORK EQUIPMENT: LASER VERSUS HOT GAS COMPARISON John Davis, Charlie Fieselman, Kris Slesinger  Purchase 
    UPDATE OF GLOBAL TRENDS IN LEAD-FREE SOLDERING John Lau and Katrina Liu (Beijing Normal Univers.)  Purchase 
    VOLUME CT (COMPUTED TOMOGRAPHY) OFFERS 3D INFORMATION ON DEFECTS IN MANUFACTURING Jon Dupree  Purchase 
    ASSEMBLY PROCESS AND PACKAGE DESIGN FOR HIGH PERFORMANCE FLIP CHIP Jon G. Aday, Danny T. Brady, David McCann  Purchase 
    INFORMATION SYSTEM DESIGN PROCESSES FOR ELECTRONICS MANUFACTURING SYSTEMS Joseph C. Su et al.  Purchase 
    LEADFRAME BASED NEAR CHIPSCALE PACKAGE WITH HIGHER NUMBER OF INPUT-OUTPUT TERMINALS K. Ramakrishna  Purchase 
    CHARACTERIZATION AND RELIABILITY PERFORMANCE OF AN ADVANCED UNDERFILL ENCAPSULANT FOR LEAD-FREE FLIP CHIP INTERCONNECTION Kalyan Ghosh et al.  Purchase 
    INTEGRATION OF QFD AND DOE METHODOLOGIES FOR NEW PRODUCT INTRODUCTION IN THE ELECTRONICS MANUFACTURING ARENA Kaustubh Nagarkar and K. Srihari, Ph.D.  Purchase 
    CONFORMAL COAT IMPACT ON AREA ARRAY PACKAGE SOLDER JOINT RELIABILITY Keith Kirchner and David Nelson  Purchase 
    THE EFFECTS OF PLATING MATERIALS, BOND PAD SIZE AND BOND PAD GEOMETRY ON SOLDER BALL SHEAR STRENGTH Keith Rogers and Craig Hillman  Purchase 
    THE TIME IS RIGHT FOR INJECTION-MOLDED PACKAGES Ken Gilleo, Ph.D. et al.  Purchase 
    MICROSCOPIC MODEL OF ELECTRONICS ASSEMBLY PROCESS USING NEXT EVENT SIMULATION Ketan Shah and Kenneth Ebeling  Purchase 
    ELECTROLESS NICKEL / ELECTROLESS PALLADIUM / IMMERSION GOLD PROCESS FOR MULTI-PURPOSE ASSEMBLY TECHNOLOGY Kuldip Johal and Hugh Roberts et al.  Purchase 
    DEVELOPMENT OF 3D-REDISTRIBUTION AND BALLING TECHNOLOGIES FOR FABRICATION OF VERTICAL POWER DEVICES Lars Boettcher et al.  Purchase 
    CONDUCTIVE ANODIC FILAMENT FORMATION - EFFECT OF FEATURE SIZES ON PRODUCT RELIABILITY Lavanya Gopalakrishnan, Mason Hu, Mark Brillhart  Purchase 
    JOINING TECHNOLOGY WITH LOW MELTING SOLDERS AND HEAT RESISTANT ADHESIVES M. Nowottnick, W. Scheel, K. Wittke, U. Pape  Purchase 
    USAGE & INTERPRETATION OF RELIABILITY PREDICTIONS Manthos Economou  Purchase 
    FOUR STAGES OF AOI IMPLEMENTATION! Mark J. Norris  Purchase 
    LEAD CONTAMINATION RISKS IN LEAD FREE SOLDER JOINTS FOR HIGH TEMPERATURE APPLICATIONS Mark Privett et al.  Purchase 
    AUTOMATIC OPTICAL INSPECTION OF CIRCUIT ASSEMBLIES IN A HIGH MIX/LOW VOLUME ENVIRONMENT Matthew T. Holzmann  Purchase 
    LEAD-FREE SOLDER PASTE EVALUATION Michael Havener / Robert Farrell  Purchase 
    PROCESS WINDOW STUDY DETERMINING THE DEFECT-FREE PROCESSING WINDOW FOR SMALL SURFACE MOUNT COMPONENTS USING A RESPONSE SURFACE DESIGN OF EXPERIMENT Michael Johnston  Purchase 
    LOW COST AIR CAVITY LCP (LIQUID CRYSTAL POLYMER) PACKAGING Mike Zimmerman  Purchase 
    THE IMPACT OF THERMAL CYCLE REGIME ON THE SHEAR STRENGTH OF LEAD-FREE SOLDER JOINTS Milos Dusek, Martin Wickham and Christopher Hunt  Purchase 
    BGA WARPAGE AND ASSEMBLY CHALLENGES Mradul Mehrotra et al.  Purchase 
    WHITE RESIDUE FORMATION ON PRINTED CIRCUIT BOARD ASSEMBLIES Mulugeta Abtew et al.  Purchase 
    SUB 100 nm SILICON - THE IMPACT ON NEXT GENERATION IC PACKAGING Nick Pearne  Purchase 
    METHODOLOGY FOR PROGNOSTICATION OF ELECTRONICS AND MEMS PACKAGING P. Lall, N. Islam, K. Rahim, J. Suhling  Purchase 
    DEFECT TRACKING AND YIELD ENHANCEMENTS THROUGH IMPROVED DATA COLLECTION SYSTEMS IN AN ELECTRONICS MANUFACTURING ENVIRONMENT P. Sathyanarayanan et al.  Purchase 
    A COMPARISON OF EPOXY AND CYANATE ESTER UNDERFILLS FOR FCOB ASSEMBLY Paul Morganelli, Ph.D.  Purchase 
    LEAD-FREE PROCESS AND PRODUCT TRANSITION * Phase II. Paste Characteristic Study by Response Assessment and Printing Optimization by Taguchi Method Paul P.E. Wang, Ph.D. et al.  Purchase 
    AN INVESTIGATION INTO LEAD-FREE BGA REWORK WITH CONSIDERATION TO PROFILE REQUIREMENTS OF IPC/JEDEC J-STD-020B Peter Verbiest  Purchase 
    0.8 MM BGA SOLDER JOINT RELIABILITY UNDER FLEXURAL LOAD Phil Geng et al.  Purchase 
    MODELS FOR SOLDER-JOINT RELIABILITY OF COMPONENTS ON METAL-BACKED PRINTED CIRCUIT BOARDS Pradeep Lall et al.  Purchase 
    SHOCK-INDUCED FAILURE PREDICTION MODEL FOR FINE-PITCH BGAs AND CSPs Pradeep Lall et al.  Purchase 
    SURFACE MOUNT CHALLENGES WITH LEAD-FREE REFLOW Prawin Paulraj and Norman J Armendariz  Purchase 
    ACCELERATED TESTING OF FLIP CHIP UNDERFILLS AND THE EFFECT OF MOISTURE AND TEMPERATURE ON THE AGING OF UNDERFILLS R. Chaware et al.  Purchase 
    A NEW HIGH PERFORMANCE ORGANIC SUBSTRATE R. Gorrell, D. Le-Huu, S. Qu, D. Banks, D. Hanson  Purchase 
    EFFECT OF SOLDER PASTE AND SURFACE FINISH ON 0201 ASSEMBLY PROCESS DEFECTS Rahul A. Newasekar and S. Manian Ramkumar et al.  Purchase 
    QUALIFICATION AND RELIABILITY FOR MEMS AND IC PACKAGES Reza Ghaffarian, Ph.D.  Purchase 
    DESIGNING EMBEDDED RESISTORS Richard Snogren  Purchase 
    CAMERA MODULE PACKAGING TECHNOLOGY Robert Darveaux et al.  Purchase 
    LEAD-FREE PROCESS TRANSITION-PHASE II: PASTE PERFORMANCE ASSESSMENT BY SURFACE FINISH AND MECHANICAL STRENGTH CORRELATION Robert Farrell et al.  Purchase 
    COMPARATIVE STUDY BETWEEN FOAM AND SPRAY FLUXING OF NO CLEAN FLUX FOR CONVENTIONAL WAVE SOLDERING MACHINE Rodolfo del Mundo Jr.  Purchase 
    TIN PEST: A FORGOTTEN ISSUE IN LEAD-FREE SOLDERING? Ronald C. Lasky, Ph.D., PE  Purchase 
    OPTIMIZING CLEANING ENERGY IN BATCH AND INLINE SPRAY SYSTEMS Steve Stach / Mike Bixenman  Purchase 
    JET DISPENSING UNDERFILLS FOR STACKED DIE APPLICATIONS Steven J. Adamson  Purchase 
    JEDEC DROP TEST PREPARATIONS FOR QUALIFICATION OF CERAMIC LGAs Steven O. Dunford and Juscelino H. Okura  Purchase 
    WHEN GLOBAL SOURCING ISN’T WORLD CLASS - OVERCOMING SOURCING CHALLENGES IN EMERGING MARKETS Susan E. Mucha  Purchase 
    INVESTIGATIONS OF THE MICROSTRUCTURE OF LEAD-FREE SOLDER JOINTS AND RELIABILITY BEHAVIOR BY THE EXAMPLE OF CHIP RESISTANCE COMPONENTS Th. Herzog, K.-J. Wolter  Purchase 
    SOLDER PASTE EVALUATION TECHNIQUES TO SIMPLIFY THE TRANSITION TO PB-FREE Timothy Jensen  Purchase 
    LEADFREE (NO-CLEAN) - UNHEATED CLEANING? Umut Tosun / Dirk Ellis  Purchase 
    SELECTIVE SOLDERING WITH SN3.9AG0.6CU: PROCESS DEVELOPMENT Ursula G. Marquez et al.  Purchase 
    EFFECT OF HEAT TREATMENT ON TIN WHISKER GROWTH Y. Fukuda, T. Fang, M. Pecht, and M. Osterman  Purchase 

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