SMTA International 2012 Proceedings

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    TITLE AUTHOR DOWNLOAD
    Novel Processing Methods For Electronic Materials Alan Rae, Ph.D.  Purchase 
    Re-Shoring: Total Cost Of Ownership, A Contract Manufacturing Guide Alex Zeitler  Purchase 
    Influence Of Alloy Combination and PCB Location On Package On Package (PoP) Component Assembly Drop Test Andrew Daya and S. Manian Ramkumar, Ph.D.  Purchase 
    Overview of Copper Wire Bonding Technology Andrew Mawer, Chu-Chung (Stephen) Lee, Tu Anh Tran and Les Postlethwait  Purchase 
    Plasma Polymerization: A Versatile and Attractive Process For Conformal Coating Andy Brooks, Siobhan Woollard, Gareth Hennighan, and Tim von Werne, Ph.D.  Purchase 
    Process Control Utilizing Component Risk Mitigation Test Plans Andy Buchan, Rachel Garcia, Clifton Aldridge, Jimmy Lucero and Mark Northrup  Purchase 
    Board Level Reliability Cyclic Bend Test Study On WCSP Packages Andy Zhang, Siva Gurrum, and Vikas Gupta  Purchase 
    Latest Developments In Testing Pb-Free Electronic Assemblies: A Report On The Revision A Update To GEIA-STD-0005-3 Anthony J. Rafanelli  Purchase 
    Dependable Electronics with Lead-Free Components/Systems - Overview Anthony J. Rafanelli  Purchase 
    Dependable Electronics with Lead-Free Components/Systems - Test and Reliability Anthony J. Rafanelli  Purchase 
    Simple, Fast High Reliability Rework of Leadless Devices Bob Wettermann  Purchase 
    New Underfill Materials Designed For Increasing Reliability Of Fine-Pitch Wafer Level Devices Brian J. Toleno, Ph.D., Stanley Hu, Hoseung Yoo, and Rong Zhang, Ph.D.  Purchase 
    Electrical Performance Evaluation of High-Frequency Laminates as a Function of Temperature Brian Wright  Purchase 
    Corrosion Mechanisms of Lead-Free PCB Surface Finishes in Corrosive Environments C. Xu, W.D. Reents, Jr., D.A. Fleming, J.P. Franey, G.E. Derkits Jr., P. Ahern, B. Wright, K. Demirkan, R. L. Opila, K. Hannigan, M. Reid, J. Punch, and M.N. Collins  Purchase 
    Influence Of Printer Settings On Step Stencil Design Carmina Läntzsch and Georg Kleemann  Purchase 
    Shared Resource Technology Centers: Industry Focused Development Resources for the Electronics Manufacturing and Microsystems Industry Chris Mather  Purchase 
    Providing Trained Technical Workforce to the Electronics Manufacturing Industry- New College Approaches Chris Mather  Purchase 
    The Evolving Nature of Offshore/Onshore Options Curtis Campbell  Purchase 
    GEIA-HB-0005-3 Rework/Repair Handbook to Address the Implications of Lead-Free Electronics and Mixed Assemblies in Aerospace and High Performance Electronic Systems Dave Hillman  Purchase 
    BGA Thermal Cycle Solder Joint Integrity Using a Nonconcentric Microvia in Pad Structure Dave Hillman, Dave Adams, Tim Pearson, and Ross Wilcoxon  Purchase 
    Types of Conformal Coatings, Applications and Process Issue Mitigation David Allen, EMBA, BSEET  Purchase 
    3D Board Level X-Ray Inspection Via Limited Angle Computer Tomography David Bernard, Ph.D., Dragos Golubovic, Ph.D., and Evstatin Krastev, Ph.D.  Purchase 
    Compliant Pin Interconnect Challenging and Reliability After January/1/2012 RoHS Exemption David He, Yu Xiang, DF Chung, Paul Wang, Ph.D., Livia Hu, Bobby Dayal, Karl Sauter, Tim Norman, and Jorge Martinez-Vargas  Purchase 
    Understencil Wiping: Does It Benefit Your Process? David Lober, Mike Bixenmen, D.B.A, Chrys Shea, and Ed Nauss  Purchase 
    Lead-Free and Supply Chain Management For High Reliability Systems David Pinsky  Purchase 
    Tin Whisker Risk Management For High Reliability Systems David Pinsky  Purchase 
    Investigations Into 0.3mm Pitch Assembly and Reliability Denis Barbini, Ph.D., and Michael Meilunas  Purchase 
    The Effect of Thermal Pad Patterning on QFN Voiding Derrick Herron, Yan Liu, Ph.D., and Ning-Cheng Lee, Ph.D.  Purchase 
    The Challenges Of Non Wet Open BGA Solder Defect Dudi Amir, Satyajit Walwadkar, Srinivasa Aravamudhan, and Lilia May  Purchase 
    Considerations For Reduced Cost Micro Array Component Rework Edward Zamborsky  Purchase 
    The Effects Of Preforms In Paste On Voiding Under Large Area Surface Mount (BTC) Components Ellen Tormey, Jerry Sidone, Westin Bent, Karen Tellefsen, Paul Koep, and Rahul Raut  Purchase 
    Case Study: Development Of A Low Temperature Tin-Bismuth-Silver Solder Paste Emmanuelle Guéné and Céline Puechagut  Purchase 
    Cleaning No-Clean Flux and Related Reliability Issues Eric Camden  Purchase 
    Effect of Solder Paste and Flux Type On Board Level Reliability of a 3D Wafer Level Chip Scale Package Fei Xie, Ph.D., Daniel F. Baldwin, Ph.D., Paul N. Houston, and Brian J. Lewis  Purchase 
    SnZn Solder Alternative For Low-Cost Pb-Free Surface Mount Assemblies Gavin J. Jackson, Ian J. Wilding, Richard Boyle, Maurice N. Collins, Eric Dalton, Jeff Punch, Puwei Liu and Matthew Holloway  Purchase 
    Assessing The Impact On Temperature Cycling Reliability Of High Levels Of Voiding In BGA Solder Joints Grace Qin, Ph.D., Lei Nie, Ph.D., Francis Toth Jr, Raiyo Aspandiar, Ph.D., and Ian Williams  Purchase 
    iNEMI Pb-Free Alloy Characterization Project Report: Part I - Program Goals, Experimental Structure, Alloy Characterization, and Test Protocols For Accelerated Thermal Cycling Gregory Henshall, et al.  Purchase 
    Investigation of Factors That Influence Creep Corrosion on Printed Circuit Boards - Part 2 Haley Fu, Cherie Chen, Prabjit Singh, Jing Zhang, Anil Kurella, Xu Chen, Xiaodong Jiang, Jennifer Burlingame, and Simon Lee  Purchase 
    Improving Supply Chain Velocity Through Six-Sigma Application and Tools Harsh Kohli  Purchase 
    Reliability Of BiAgX Solder As A Drop-In Solution For High Temperature Lead-Free Die-Attach Applications HongWen Zhang, Ph.D. and Ning-Cheng Lee, Ph.D.  Purchase 
    3D Packaging For High Computing With Wide IO Processor-Memory Interface Ilyas Mohammed, Ron Zhang and Rajesh Katkar  Purchase 
    Surface Flatness and Bond Thickness Measurement Methods Using The Acoustic Microscope Janet E. Semmens  Purchase 
    Leveraging Manufacturing Solutions in FMEA Jay Gorajia  Purchase 
    Optimizing PTH Hole-Fill Using Lead-Free Wave Soldering Jennifer Nguyen, David Geiger, and Murad Kurwa  Purchase 
    No-Clean Flux Residue and Reliability - An EMS Perspective Jennifer Nguyen, David Geiger, Dennis Willie, and Murad Kurwa  Purchase 
    Isothermal Aging Effects on the Harsh Environment Performance of Lead-Free Solder Joints Jiawei Zhang, Zhou Hai, Sivasubramanian Thirugnanasambandam, John L. Evans, M. J. Bozack, and Richard Sesek  Purchase 
    Aging Effects On Creep Behaviors Of Lead-Free Solder Joints And Reliability Of Fine-Pitch Packages Jiawei Zhang, Zhou Hai, Sivasubramanian Thirugnanasambandam, John L. Evans, M. J. Bozack, Richard Sesek, Yifei Zhang, and J. C. Suhling  Purchase 
    Comparative Cleaning Study To Showcase The Effective Removal of OA Flux Residues Jigar Patel, Umut Tosun, and Michael McCutchen  Purchase 
    Lead-Free SMT Connector Process Exposure, Reliability, Quality, and Yield Assessment For High Thermal Mass Assemblies Jimmy Chow, John McMahon, Heather McCormick, Russell Brush, Vejeyathaas Thambipillai, Kok Wei Khoo, Matt Kelly and Marie Cole  Purchase 
    Reliability Assessment of a SMT Assembly With Prediction of Its Board-Level Interconnect Life Distribution Jingsong Xie, Ph.D., Haiyu Qi, Ph.D., Jun-Ke Zhang, Feng-Hua Zhou, Chun-Yong Tang, Jaccy Wang, Ding-Jun Xie, Li-Li Chen, and Chang Wang  Purchase 
    Mechanical Reliability: Updated Results From A Spherical Bend Test Program John McMahon, P.Eng., and Brian P. Standing  Purchase 
    Assembly And Design Challenges For New Generation 0.4/0.4mm Pitch Package On Package (PoP) And 0.3mm Pitch Chip Scale Package (CSP) Jonas Sjoberg, Ranilo Aranda, David Geiger and Murad Kurwa  Purchase 
    Reliability of Passive and Active Components With Differences According To Lead-Free Paste Characterization Jörg Trodler, Heinz Wohlrabe, Ph.D., and Rüdiger Knofe  Purchase 
    New Interconnection For High Temperature Application: HotPowCon (HPC) Jörg Trodler, Mathias Nowottnick, Andreas Fix, and Timo Herberholz  Purchase 
    Increase of SMT Process Robustness Through the Right Selection of Solder Pastes Jose M. Servin and Cynthia Gómez  Purchase 
    Designing A Silicone System To Reduce Permeability To Moisture Julie Harber and Michelle Velderrain  Purchase 
    Lead-Free Alloy Development Karl F. Seelig  Purchase 
    iNEMI Pb-Free Alloy Characterization Project Report: Part III - Thermal Fatigue Results For Low-Ag Alloys Keith Sweatman, et al.  Purchase 
    Optimizing Solder Paste For Void Minimization With Vacuum Reflow Keith Sweatman, Takashi Nozu, and Tetsuro Nishimura  Purchase 
    The Stability of Cu6Sn5 in the Formation and Performance of Lead-Free Solder Joints Keith Sweatman, Tetsuro Nishimura, and Kazuhiro Nogita  Purchase 
    Development of Embedded Power Electronics Modules For Automotive Applications Lars Boettcher, Stefan Karaszkiewicz, Dionysios Manessis, and Andreas Ostmann  Purchase 
    Board Level Reliability And Assembly Process Of Advanced QFN Packages Li Li, Brian Smith, Joe Smetana, David Geiger, Chris Katzko, Jeffrey ChangBing Lee, Richard Coyle, and Alex Chan  Purchase 
    Review of the Lead Free Control Plan Requirements Linda Woody  Purchase 
    3D Technology - A Promising Approach in The Field of Smart System Integration M. Juergen Wolf and Klaus-Dieter Lang  Purchase 
    Overcoming Head-In-Pillow Defects In Hybrid LGA Socket Assembly Marie Cole, Theron Lewis, Jim Bielick, PK Pu, Stephen Hugo, Phil Isaacs, Eddie Kobeda, Matt Kelly, Su Bing, Alex Chen, James Huang, Kevin Liu, John McMahon, Brian Standing  Purchase 
    Alternative Testing Methods For Electronic Assemblies Mathias Nowottnick, Andrej Novikov, Dirk Schade, and Bob Sykes  Purchase 
    Water-Soluble Lead-Free Process Chemistry For High Voltage And High Reliability Hardware Requirements Matt Kelly, Mitchell Ferrill, Wai Ma, Nandu Ranadive, and Cheikhou Ndiaye, Simin Bagheri and Prakash Kapadia  Purchase 
    The IPC-B-52 Sir Test Vehicle: A Discussion Of The Current Test Vehicle Design and Possible Modifications For The Future Mitchell Ferrill, Matt Kelly, Wai Ma, Nandu Ranadive, Cheikhou Ndiaye, Jim Bielick, and Simin Bagheri  Purchase 
    Ag-Au-Ge Alloys For High Temperature Geothermal and Oil Well Electronics Applications P. T. Vianco, R. Grant, J. A. Rejent, T. B. Crenshaw, and A. C. Kilgo  Purchase 
    Development and Optimization of Through Silicon Via Interposers Pejman Monajemi, Michael Newman, Cyprian Uzoh, Charles Woychik, Lina Ayat, and Terrence Caskey  Purchase 
    Epoxy Fluxes: Dip Assembly Process Issues and Reliability Pericles A. Kondos, Ph.D., Michael Meilunas, and Martin Anselm, Ph.D.  Purchase 
    Can RoHS Conversion Actually Reduce Product Cost? Philip DiVita, David Steele, John Kanavel, and Chrys Shea  Purchase 
    SnAgCu Lead-Free Electronics Reliability Under Combined Temperature and Vibration Environments Pradeep Lall and Geeta Limaye  Purchase 
    Area-Array Electronics Models and Survivability Under 50,000G Shock Loads Pradeep Lall, Kewal Patel, Ryan Lowe, Mark Strickland, Dave Geist, Randall Montgomery, and Jim Blanche  Purchase 
    Method For Determination Of Accrued Damage And Remaining Life During Field-Usage In Lead-Free Electronics Pradeep Lall, Mahendra Harsha, and Kai Goebel  Purchase 
    Process Development For Micro-Electronics Packaging With Direct Printed Additive Manufacturing R. X. Rodriguez and K. Church, Ph.D., X. Chen  Purchase 
    Fine Pitch (0.4 mm) TMV Package On Package Assembly In Air Rafael Padilla, Yutaka Hashimoto, Satoru Akita, Derek Daily, Tokuro Yamaki, Takayuki Yoshida, and Masato Shimamura  Purchase 
    Copper Wire Bond Failure Mechanisms Randy Schueller, Ph.D.  Purchase 
    Which New Stencil Technologies Provide The Best Paste Printing Performance? Rich Brooks, John Carr, and Marty Carr  Purchase 
    iNEMI Pb-Free Alloy Characterization Project Report: Part IV - Effect Of Isothermal Preconditioning On Thermal Fatigue Life Richard Coyle, et al.  Purchase 
    Interconnection Reliability of Interposer and Reballing Options For Ball Grid Array Backward Compatibility Richard Coyle, Michael Meilunas, Richard Popowich, Martin Anselm, Peter Read, Mike Oswald, and Debra Fleming  Purchase 
    Thermal Fatigue Reliability And Microstructural Characterization Of A Large, High Density Ball Grid Array With Backward Compatible Assembly Richard Coyle, Raiyo Aspandiar, Vasu Vasudevan, Steve Tisdale, Iulia Muntele, Richard Popowich, Peter Read, and Debra Fleming  Purchase 
    iNEMI Pb-Free Alloy Characterization Project Report: Part II - Thermal Fatigue Results For Two Common Temperature Cycles Richard Parker, et al.  Purchase 
    Force Multiplication-Supporting Complex Customer Requirements at a Regional Level Rick Herndon  Purchase 
    Solder Alloy Creep Constants For Use in Thermal Stress Analysis Robert Darveaux and Corey Reichman  Purchase 
    If You Can't Take The Heat (There Are Options) Robert M. Simon  Purchase 
    A New Approach To Void-Free Reflow Soldering Rolf Diehm, Prof. Dr.-Ing. Mathias Nowottnick, and Uwe Pape  Purchase 
    A Focus on Productivity and Profitability: Several Case Studies Ronald Lasky, Ph.D., P.E.  Purchase 
    LGAs VS. BGAs - Lower Profile And Better Reliability S. Joshi, B. Arfaei, A. Singh, M. Gharaibeh, M. Obaidat, A. Alazzam, M. Meilunas, L. Yin, M. Anselm, and P. Borgesen  Purchase 
    Should Intermetallic Thickness Measurements Be Needed To Determine Solder Joint Reliability Scott K Buttars, Chonglun Fan, and Raiyo F. Aspandiar  Purchase 
    Bottom Termination Component Land Pattern Design and Assembly For High Reliability Electronic Systems Scott Nelson  Purchase 
    Evaluation Of Phase Change Thermal Interface Materials By In-Situ Methods and Their Application Dependent Performance Parameters Scott T. Allen  Purchase 
    Drop Reliability Test On Different Dimensional Lead-Free Wafer Level Chip Scale Packages Sivasubramanian Thirugnanasambandam, Namo Vijayakumar, Jiawei Zhang, John Evans, Ph.D., Fei Xie, Ph.D., and Daniel F. Baldwin, Ph.D.  Purchase 
    Heatsink Adhesive Bonding Investigation Smile Ling, Jim Bielick, Michk Huang, Wayne Zhang, Blue Wang, Xiaoyun Xia, and Divas Liu  Purchase 
    Using SPI, AXI, and CT X-Ray Data To Improve SMT Process with QFN Devices Stephen Chen, Tho Vu, Hung Le, Alan Chau, Elliott Le, Phuong Chau, Hao Cui, Raymond Tran, Roy Chung, Bryan Goble, Nadarajan M Singaram, Golden Xu, Zhen (Jane) Feng, Ph.D., David A. Geiger, Murad Kurwa, and Evstatin Krastev, Ph.D.  Purchase 
    High Speed Cleaning In A Reduced Manufacturing Footprint Steve Stach, Mike Bixenman, and Dale Lee  Purchase 
    Precision Height Stand-Off Block with Inline High Speed Placement Machine Steven Perng, Weidong Xie, and Nguyet Anh Nguyen  Purchase 
    Automated Site Redress Method Application For Pb-Free Rework Sven Peng, Wayne Zhang, PK Pu, Phil Isaacs, William Uy and Henley Zhou  Purchase 
    Low Cost Process Optimization in High Mix, Low Rate Manufacturing Environment Thomas A. Seitz, Brian Asti, Brandon Kidney and William Presley  Purchase 
    Integration of Electronic Components Into PCB For Electromobility Application Thomas Hofmann and Stefan Gottschling  Purchase 
    Embedding and Reliability of Discrete Capacitors Into Build Up Layers of Printed Circuit Boards Thomas Löher, Joao Marques, Martin Haubenreisser, Andreas Ostmann, and Norbert Bauer  Purchase 
    Material And Process Optimization For HiP Defect Elimination Timothy Jensen, Ronald Lasky, Ph.D., PE, and Sehar Samiappan  Purchase 
    Lessons Learned in Developing and Optimizing a Select Solder Process for Thermally Challenging Boards Tom Gervascio  Purchase 
    xFD: A Very Thin Two and Four Die Package Solution for High Performance DDR SDRAM Vern Solberg, Simon McElrea, and Wael Zohni  Purchase 
    Development Of Processing Parameters For Soldering Lead-Free Ball Grid Arrays Using Tin-Lead Solder W. Fox, B. Gumpert, and L. Woody  Purchase 
    Systematic Investigation of Impact of SMT Parameters, Isothermal Aging and Alloy Microstructure on Lead-Free BGA Solder Joint Reliability Weidong Xie, Tae-Kyu Lee, and Steven Perng  Purchase 
    Flux Reservoir Stencil Printing William E. Coleman, Ph.D.and Matthew S. Read  Purchase 
    PCB Assembly Process Development and Characterization Of 0.3mm µCSP Packages Wu WeiPing (Jonathan), Restyfonte Familara, L.M. Lim, Mohd Yusuf, Hien Ly, and Chrys Shea  Purchase 
    Non-Isocyanate, Non-Mercury Polyurethane Encapsulation Resins Xiaoping Lei, Ph.D., and Darren Hodson  Purchase 
    On The Fatigue Life Of Microelectronic Interconnects In Cycling With Varying Amplitudes Y. Jaradat, J. E. Owens, A. Qasaimeh, B. Arfaei, L. Yin, M. Anselm, and P. Borgesen  Purchase 
    Voiding Behavior In Mixed Solder Alloy System Yan Liu, Ph.D., Derrick Herron, Joanna Keck, and Ning-Cheng Lee, Ph.D.  Purchase 
    Electroless Ni/Pd/Au Plating For Cu Wire Bonding Yoshinori Ejiri, Takehisa Sakurai, Yoshiaki Tsubomatsu, Kiyoshi Hasegawa  Purchase 

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