1998 Chip Scale Packaging Proceedings

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    TITLE AUTHOR DOWNLOAD
    GOOD CONTACT DESIGN LEADS TO IMPROVED TEST PERFORMANCE IN BGA/CSP APPLICATIONS Bert H. Brost  Purchase 
    THE FUTURE OF VACUUM DISPENSING FOR CHIP SCALE PACKAGE MANUFACTURING Chris Lawing  Purchase 
    CSP INFLUENCE ON EVOLUTIONARY DESIGNS Dale E. Lee  Purchase 
    BURN-IN SOCKET REQUIREMENTS FOR CSP David Pfaff  Purchase 
    CHIP SCALE PACKAGING DESIGN OR AEROSPACE AND MILITARY APPLICATIONS Emmanuel J. Siméus  Purchase 
    X-RAY STRATEGIES FOR INSPECTION OF BGA DEVICES Frank Silva  Purchase 
    THERMAL DYNAMICS and BGA BALL REFLOW Greg Ayers  Purchase 
    REMOVABLE CHIP MODULE (RCM TM) James Rathburn  Purchase 
    ACHIEVING HIGHER PERFORMANCE FROM DISCRETE SILICON DEVICES USING MSMT CSPS John Richards  Purchase 
    CSP CLEANING APPLICATIONS BY THE Megacleaner ™ PROCESS Jose A. Berbel  Purchase 
    MANUFACTURING METHODOLOGIES FOR HIGH DENSITY INTERCONNECT STRUCTURES (HDIS) KATHLEEN NARGI-TOTH  Purchase 
    IMPLEMENTATION OF A SUCCESSFUL REWORK PROCESS FOR CHIP-SCALE PACKAGES Mario J. Gislao  Purchase 
    THE FACE-UP CHIP, A NEW FLIP-CHIP PACKAGE OPTION Phil Marcoux  Purchase 
    FLUX-FREE PROCESS FOR PLACEMENT AND ATTACH OF SOLDER BALLS TO WAFERS, FLIP CHIPS AND ALL BGA PACKAGES Richard Ramos  Purchase 
    HIGH THERMAL CONDUCTIVITY GREASES FOR USE IN CSP, FLIP CHIP AND NEAR CSP PACKAGES Ron Hunadi  Purchase 
    CSPs IN JAPANESE PORTABLE PRODUCTS Thomas Goodman  Purchase 

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