South East Asia Technical Training Conference on Electronics Assembly Technologies 2012 Proceedings

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    TITLE AUTHOR DOWNLOAD
    Solder Paste Residue Corrosivity Assessment: Bono Test Céline Puechagut, Anne-Marie Laügt, Emmanuelle Guéné, Richard Anisko  Purchase 
    Discussion on Cu Dissolution in Pb-Free PTH Rework Chuan Xia, May Yan, Scott Priore, and Kangeyan K.Ramachandran  Purchase 
    Reliability Study on the Polymer Core Solder Balls under Multiple Reflow and HTS Stress Tests Dr. Yap Boon Kar, Tan Cai Hui, Dr. Agileswari, and Calvin Lo  Purchase 
    A Study of Surface Finishes for IC Substrates and Wire Bond Applications Ernest Long PhD and Lenora Toscano  Purchase 
    Investigation of Oxidation on Electronic Connector Leads Through Multiple Heat Cycles F.Che Ani, A.S Harun, S. E Lim  Purchase 
    DI-Water Vs. Chemistry: Comparative Cleaning Study to Showcase The Effective Removal of OA Flux Residues Harald Wack, Ph.D., Umut Tosun, M.S., Jigar Patel, M.S., Joachim Becht, Ph.D., and Ravi Parthasarathy, M.S.  Purchase 
    Two Different Ways of Resolving BGA Head-In-Pillow Defects Henley Zhou, William Uy, Jumbo Huang  Purchase 
    Data Center Woes: Reliability Issues Plague RoHS-Compliant Electronics Henri Seng and Chris Muller  Purchase 
    The Influence of Solder Paste Formulation on Control and Elimination of Defects in SMT Assembly J. Z. Hussain, S. A. Khoo, J. Bondarowicz, C. D. Breach, and A. Hawkins  Purchase 
    Benefits of Inert Gas Soldering for Printed Circuit Board Assembly Processes Jerry Wu, Ph.D., Gregory K. Arslanian, and Emily Tan  Purchase 
    The Ease of Doing Business within the Malaysian E&E Sector with Emphasis on: Excess Inventory Disposition, Customs Issues, Trade Facilitation, Sourcing, Quality Assurance, Storage, Distribution, Inventory Management, Fulfillment... Jeyasingam Ratnasingam  Purchase 
    Entek OM, an OSP Alternative High Performance Final Finish Jim Kenny, Karl Wengenroth, John Fudala, Melanie Rischka, Dr. Yung Herng Yau  Purchase 
    0.3mm Pitch Chip Scale Package (CSP) Process Development and Printed Circuit Board (PCB) Design Jonas Sjoberg, Ranilo Aranda, and David Geiger  Purchase 
    The Status of Low-Halogen Material Usage in Supply Chain Electronic Components Juley Lissy Rajan, Curtis Grosskopf, Feng Xue, Jackie Adams  Purchase 
    Overcoming the Challenges of the QFN Package Karl Seelig and Kevin Pigeon  Purchase 
    Underfill and Flux Compatibility from a Curing Perspective Kevin Tan, Juan Sun, Pong Yew Kong, Casey Ng  Purchase 
    Silver Plated Copper Filler Die Attach Adhesive Characterization on LQFP Package for Automotive Device Application Khoo Ly Hoon, Nor Shafika Mashuri, Anis Aridah Abd Razak, Yap Boon Kar  Purchase 
    Surface Mounted Oleo-Sensor on System Boards for Early Detection of Burning or Over Heated Chips Marie S. Cole, Francisco D. Liwa, Glynn Farrow, Megan ML Tay  Purchase 
    A Qualification Tool for Component Package Environmental Feasibility in the Electrical and Electronic Equipment Matti Rahko  Purchase 
    Preventing White Residue By Controlling Upstream and Downstream Process Conditions Mike Bixenman, D.B.A., Jason Chan, and Ram Wissel  Purchase 
    Flux Cleaning Process for Ceramic Flip Chip Ball Grid Array (FCCBGA) Noor Azrina Talik, C.S Foong, B.K Yap, C.Y Tan  Purchase 
    Flip Chip Assembly Process Optimizations and Material Selections Through Validated Simulations Ron Zhang, Rajesh Katkar, Michael Huynh, and Laura Mirkarimi  Purchase 
    Alternate Alloys to SAC305 for Pb-Free SMT Assembly Timothy Jensen, Ronald Lasky, Ph.D., PE, Sehar Samiappan  Purchase 
    Material and Process Optimization for HiP Defect Elimination Timothy Jensen, Ronald Lasky, Ph.D., PE, Sehar Samiappan  Purchase 
    Pad Cratering Susceptibility Wong Boon San and Julie Silk  Purchase 

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