International Conference on Soldering & Reliability 2012 Proceedings

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    TITLE AUTHOR DOWNLOAD
    Terminal Solder Dip Testing For Chip Ceramic and Tantalum Capacitors Alexander Teverovsky  Purchase 
    Evaluating Solderability Of Surface Finishes Bev Christian, Numaira Obaid and Adam Westwood  Purchase 
    Solder Paste Dipping With 0.4mm Pitch PoP Packages Christopher Nash & Maria Durham  Purchase 
    The Last Will And Testament Of The Lead-Free BGA Void David Hillman, David Adams, Tim Pearson, Ross Wilcoxon, Bev Christian, Brandon Smith, and Mario Scalzo  Purchase 
    Quality Control Methods Used To Insure The Production Of Reliable Assemblies David Lober, John M. Williamson, Mike Bixenman  Purchase 
    Process Guidelines To Ensure Optimal SMT Electronics Assembly Ed Briggs and Ron Lasky  Purchase 
    Graphite Nanofiber Composite Thermal Interface Material Eric Dalton, Amy Fleischer, Maurice N. Collins, Jing Tao, Kafil M. Razeeb, Jeff Punch  Purchase 
    Conformal Coating Protection Of Surface Mount Resistors In Harsh Environments Eric Dalton, Maurice Collins, Michael Reid, Jeff Punch  Purchase 
    Assembly Feasibility and Property Evaluation of Low Ag, Bi-Containing Solder Alloys Eva Kosiba, Simin Bagheri, Zohreh Bagheri, Polina Snugovsky, and Doug Perovic  Purchase 
    The Effect Of Coating And Potting On The Reliability Of QFN Devices Greg Caswell and Cheryl Tulkoff  Purchase 
    Implementation Of Package-On-Package Assembly In Manufacturing Ishrat Hasan and Adrian Hirceaga  Purchase 
    Evaluating The Electrical And The Mechanical Reliability Of Soldering Materials Karen Tellefsen, Ph.D. and Mitch Holtzer  Purchase 
    Lead Free Alloy Development Karl F. Seelig  Purchase 
    The Stability Of Cu6Sn5 in The Formation and Performance of Lead-Free Solder Joints Keith Sweatman, Tetsuro Nishimura, and Kazuhiro Nogita  Purchase 
    Corrosion Study Of Lead-Free Solders Exposed To Artificial Sweat Laura Sloboda, Thomas Kennedy, Julie Liu, Deepchand Ramjattan, and Laura Turbini  Purchase 
    Fundamentals Of The Non-Wet Open BGA Solder Joint Defect Formation Lilia Kondrachova, Srini Aravamudhan, Rajen Sidhu, Dudi Amir and Raiyo Aspandiar  Purchase 
    Lead-Free Assembly Design For Manufacturability Considerations Matt Kelly and Mark Hoffmeyer  Purchase 
    Accelerated Temperature Cycling and Microstructural Analysis of SnZn Solder In Surface Mount Assemblies Maurice N. Collins, Gavin J. Jackson, Eric Dalton, Hector Steen, Puwei Liu, Matthew Holloway and Jeff Punch  Purchase 
    Design And Construction Affects On PWB Reliability Paul Reid  Purchase 
    Improving Product Reliability Using Accelerated Stress Testing Peter Arrowsmith and Bojan Randjelovic  Purchase 
    New Generation Of Pb-Free Solder Alloys: Possible Solution To Solve Current Issues With Main Stream Pb-Free Soldering Polina Snugovsky, Simin Bagheri, Marianne Romansky, Doug Perovic, Leonid Snugovsky, John Rutter  Purchase 
    Pre-Stacking Of Package On Package Mitigating The Effects Of Warpage Robert Farrell, Paul Bodmer, Doug Sommer, and Binh Pham  Purchase 
    Materials For High Performances Solder Joint Reliability Sang Ho Jeon, Yeong Gyeong Yang, Sun Young Kim, Kyu Yul Ahn, Sang Jun Bae, Yong Chul Chu  Purchase 
    Tin Whisker Testing: Low Stress Conditions Stephan Meschter, Polina Snugovsky, Jeff Kennedy, Zohreh Bagheri, and Eva Kosiba  Purchase 
    A Novel Approach To 3D Chip Stacking Sukhi Binapal, Ron Csermak, and Mark Vandermeulen  Purchase 
    To Clean or Not To Clean - Both Sides of the Story Tim Luke  Purchase 
    Maintaining OSP Coating Integrity During The Cleaning Process Umut Tosun, M.S.Chem.Eng., Naveen Ravindran, M.S.Chem.Eng., Michael McCutchen, M.S.Chem.  Purchase 
    Reverting Back To Convection Reflow From Vapor Phase Reflow For High End Server Printed Circuit Board Assembly Wai Mon Ma  Purchase 
    The Performance Of Fluxes And Lead-Free Solder Alloys In Soldering Of Aluminum William F. Avery and Philip A. Baskin  Purchase 

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