International Wafer-Level Packaging Conference 2010 Proceedings

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    TITLE AUTHOR DOWNLOAD
    ENABLING COMPREHENSIVE AND EFFICIENT TEST OF 3D CHIPS BY STANDARDIZING THE TEST ACCESS ARCHITECTURE Al Crouch  Purchase 
    THE MEMS APPROACH FOR MAKING A LOW COST, HIGH SENSITIVITY MAGNETIC SENSOR Alan S. Edelstein, Greg A. Fischer, James E. Burnette and William F. Egelhoff, Jr.  Purchase 
    SCALABLE INTERCONNECT TECHNOLOGY THAT ENABLES HIGH DENSITY, HIGH PERFORMANCE AND LOW PROFILE CONNECTIVITY FOR BOARD TO BOARD, PACKAGE TO BOARD AND BOARD TO FLEX APPLICATIONS Amit Varma, Ming Wu and Charlie Stevenson  Purchase 
    WAFER LEVEL PROCESSING AND INTEGRATION TECHNIQUES FOR CMOS IMAGE SENSOR MODULE MANUFACTURING Bioh Kim, Thorsten Matthias, Gerald Kreindl, Viorel Dragoi, Markus Wimplinger, and Paul Lindner  Purchase 
    INTEGRATION OF ELECTROGRAFTED LAYERS FOR THE METALLIZATION OF DEEP TSVS C. Truzzi, S. Lerner, F. Raynal, V. Mevellec, N. Frederich, D. Suhr, I. Bispo and B. Couturier  Purchase 
    COST COMPARISON FOR FLIP CHIP, WIRE BOND, AND WAFER LEVEL PACKAGING Chet A. Palesko, Amy J. Palesko, and E. Jan Vardaman  Purchase 
    DEPTH MEASUREMENT OF THROUGH SILICON VIA BY USING IR CONFOCAL MICROSCOPE Deh-Ming Shyu, Wei-Te Hsu and Yi-Sha Ku  Purchase 
    WAFER BONDING PROCESS SELECTION E. Pabo, T. Tang, V. Dragoi, and T. Matthias  Purchase 
    MICROSPRINGS FOR INTEGRATED TEST AND PACKAGING Eugene M. Chow, Ph.D.  Purchase 
    NONDESTRUCTIVE CHARACTERIZATION OF CRITICAL FAILURES IN 3D INTEGRATIONS USING COMPUTED TOMOGRAPHY Gyujei Lee, Kang-won Lee, Hyun-joo Kim, Suk-woo Jeon, Kwang-yoo Byun, and Hae-bong Park  Purchase 
    WAFER LEVEL EMBEDDED SYSTEM IN PACKAGE (WL-ESiP) FOR 3D SiP SOLUTION In-Soo Kang, Gi-Jo Jung, Byoung-Yool Jeon, Jae-Hyouk Yoo and Byeung-Gee Kim  Purchase 
    LOW COST, HIGH DENSITY CHIP-LAYER VIAS FOR CHIPS-FIRST STACKED PACKAGES James E. Kohl, Ph.D., Charles W. Eichelberger, S. Keith Phillips, and Nancy G. Perkins  Purchase 
    COST EFFECTIVE WAFER LEVEL ENCAPSULATION FOR MEMS AND OTHER CIRCUIT ELEMENTS Jay Mitchell, Sangwoo Lee, Warren Welch, and Khalil Najafi  Purchase 
    FINE PITCH 3D DISPENSABLE ELECTRICAL INTERCONNECTS FOR SYSTEM IN PACKAGE SOLUTIONS Jeff S. Leal, Suzette K. Pangrle, Charles Whyte, Keith Barrie, Jeff Leff, Scott McGrath and Gerardo Ayala  Purchase 
    Cu PILLAR ELECTROPLATING PROCESS CONTROL FOR WAFER LEVEL PACKAGING Jim Zhang, Richard Hollman, Zhenqiu Liu and Arthur Keigler  Purchase 
    Wafer Bumping The Low Cost and Reliable Solution to Production Wafer Packaging John Mackay and Roger Gaw  Purchase 
    DEVELOPMENT OF AN EIGHT-DIE NAND LSOP PACKAGE Ke Xiao, Junfeng Zhao, Lefei Zhang, Mao Guo, Yong She, Yinglong Song, Eagle Lin, Dennis Chang, and MJ Chen  Purchase 
    FLIP CHIP DIE BONDING: AN ENABLING TECHNOLOGY FOR 3DIC INTEGRATION Keith A. Cooper, Michael D. Stead, Gilbert Lecarpentier, and Jean-Stephane Mottet  Purchase 
    HIGH VOLUME MANUFACTURING SOLUTION FOR WAFER LEVEL LENS MOLDING AND STACKING Kien Mun Lau, Michael Kast, Gerald Kreindl, Markus Wimplinger, Dominik Treiblmayr, Robert Breyer and Thorsten Matthias  Purchase 
    EXPLORATION OF MIGRATION AND STRESS EFFECTS IN POPS CONSIDERING INHOMOGENEOUS TEMPERATURE DISTRIBUTION L. Meinshausen and K. Weide-Zaage  Purchase 
    3D WAFER LEVEL PACKAGING OF MICRO CAMERA DEVICES Martin Wilke, Kai Zoschke, Julia Röder, Veronika Glaw, Michael Töpper, Ingrid Kuna, Karin Samulewicz, Oswin Ehrmann, Klaus-Dieter Lang and Herbert Reichl  Purchase 
    WAFER LEVEL PACKAGING: A FOUNDRY PERSPECTIVE Michael Shillinger  Purchase 
    DEMONSTRATION OF ULTRA-THIN SI GRINDING PROCESS CONTROLLED BY IN-SITU NON-CONTACT GAUGE FOR 3D STACKED IC (3D-SIC) Ming Zhao, Greet Verbinnen, Anne Jourdain, Eric Beyne, Bart Swinnen, Leonardus Leunissen, Tomotaka Tabuchi, Shinji Yoshida, and Susumu Hayakawa  Purchase 
    DESIGN METHODS FOR 3D IC INTEGRATION Peter Schneider, Sven Reitz, Jörn Stolle, Roland Martin, Andy Heinig and Andreas Wilde  Purchase 
    MECHANICAL BEHAVIOR MEASUREMENT OF SI WAFER Po-Yi Chang and Yi-Sha Ku  Purchase 
    TECHNOLOGY SOLUTIONS FOR A DYNAMIC AND DIVERSE WLCSP MARKET Ravi Chilukuri  Purchase 
    SINGLE SIDED WAFER THINNING FOR 3D INTEGRATION Ricardo I. Fuentes, Ph.D.  Purchase 
    SITE-SPECIFIC ANALYSIS OF ADVANCED PACKAGING ENABLED BY FOCUSED ION BEAMS (FIB) Richard J. Young, Chad Rue, Michael Schmidt, Ruud Schampers and David Wall  Purchase 
    MINIATURIZED WLP FOR MEMS Risto Mutikainen, Ph.D., Sami Nurmi, Ph.D., Tapani Alander, Ph.D., Esko Sirén, Lic. Tech. and Heikki Kuisma, M.Sc.  Purchase 
    ELECTRICAL, THERMAL AND MECHANICAL CHARACTERIZATION OF eWLB (EMBEDDED WAFER LEVEL BGA) Seung Wook Yoon, Meenakshi Prashant, Gaurav Sharma, Roger Emigh, Kai Liu, Sin Jae Lee, Ray Coronado, Yeong J. Lee, and Rajendra Pendse  Purchase 
    DEVELOPMENT OF NEXT GENERATION eWLB (EMBEDDED WAFER LEVEL BGA) PACKAGING Seung Wook Yoon, Yaojian Lin, Pandi Chelvam Marimuthu, Rajendra Pendse, Ganesh V. P, Andreas Bahr, Thorsten Meyer, Yonggang Jin, and Xavier Baraton  Purchase 
    RELIABILITY ANALYSIS OF 3D DISPENSABLE INTERCONNECTS FOR A SYSTEM IN A PACKAGE SOLUTION Suzette Pangrle, Jeff Leal, Scott McGrath, Grant Villavicencio, Keith Barrie, DeAnn Melcher, Sartaj Ajrawat, John Bray, Elizabeth Hankes, Jeff Leff, Elmer DelRosario, Marc Robinson, Sunil Kaul, Ken Holcomb, Catherine Shearer, Mark Kowalski, Anna Hall  Purchase 
    LAMINATE BASED FAN-OUT EMBEDDED DIE TECHNOLOGIES: THE OTHER OPTION Theodore (Ted) G. Tessier, Mark Dhaenens, David Clark, Tanja Karila, Tuomas Waris  Purchase 
    EWLB SYSTEM IN PACKAGE - POSSIBILITIES AND REQUIREMENTS Thorsten Meyer, Gerald Ofner, Christian Geissler and Klaus Pressel  Purchase 
    THE ENCAPSULATION OF MEMS/SENSORS AND THE REALIZATION OF MOLDED VIAS ON PACKAGE LEVEL AND WAFER LEVEL WITH FILM ASSISTED MOLDING Ton van Weelden and Lingen Wang  Purchase 
    3D SUBSTRATE INNOVATION FOR VERY FINE PITCH FLIP-CHIP APPLICATIONS Vern Solberg and Vage Oganesian  Purchase 
    EMBEDDED ACTIVE DEVICE PACKAGING TECHNOLOGY FOR REAL DDR2 MEMORY CHIPS Yin-Po Hung, Tao-Chih Chang, Ching-Kuan Lee, Yuan-Chang Lee, Jing-Yao Chang, Chao-Kai Hsu, Shu-Man Li, Jui-Hsiung Huang, Fang-Jun Leu, Yu-Wei Huang, Ren-Shin Cheng and Tai-Hong Chen  Purchase 

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