South East Asia Technical Conference on Electronics Assembly Technologies 2011 Proceedings

While abstracts in the Knowledge Base are accessible to all visitors, the full articles (PDF format) are FREE FOR SMTA MEMBERS to download:

  • Already a member? Log in to download articles.
  • Not a member? Pay just $10 per article or become a member today!
  • < Back to Conferences List



    TITLE AUTHOR DOWNLOAD
    LAND AND SOLDER GRID ARRAY SMT ASSEMBLY CHALLENGES Dudi Amir  Purchase 
    BIG CLEANING JOB VS. SMALL CLEANERS THE ADVANTAGES AND PITFALLS OF GOING SMALL Eric Camden  Purchase 
    A STUDY OF THE ENEPIG IMC FOR EUTECTIC AND LF SOLDERS G. Milad, D. Gudeczauskas, G. O’Brien, and A. Gruenwald  Purchase 
    LOW-SILVER BGA ASSEMBLY PHASE II – RELIABILITY ASSESSMENT SIXTH REPORT: THERMAL CYCLING RESULTS FOR UNMIXED JOINTS Gregory Henshall, Michael Fehrenbach, Chrys Shea, Quyen Chu, Girish Wable, Ranjit Pandher, Ken Hubbard, and Ahmer Syed  Purchase 
    FLUID FLOW MECHANICS: KEY TO LOW STANDOFF CLEANING Harald Wack, Ph.D., Umut Tosun, Naveen Ravindran, Sylvain Chamousset, Joachim Becht, Ph.D., and Steve Stach  Purchase 
    ELECTROSTATIC DISCHARGE (ESD), FACTORY ISSUES, MEASUREMENT METHODS AND PRODUCT QUALITY Hartmut Berndt  Purchase 
    COMPARISON OF VARIOUS METROLOGIES TO MEASURE VOIDS IN X-RAY IMAGES OF HIGH DENSITY BGA PACKAGE SOLDER BALLS Ife Hsu and Raiyo Aspandiar, Ph.D.  Purchase 
    A COUNTERFEIT PART PROTECTION PLAN AND MANAGEMENT PROCESS Jacklin Adams, John Quick, *Celine Chong, Teresa Yu, Anthony Spielberg, Stephen Chong  Purchase 
    MOISTURE-CURE POLYURETHANES – LATEST DEVELOPMENTS IN VOC-FREE CONFORMAL COATINGS Jade P. Bridges  Purchase 
    PROCESS DEVELOPMENT AND RELIABILITY STUDY WITH ANISOTROPIC CONDUCTIVE FILM BONDING WITH MULTIPLE TYPES OF PCB SURFACE FINISHES Jenson Lee, David Geiger, and Dongkai Shangguan, Ph.D.  Purchase 
    LEAD-FREE PTH BARREL FILL CHALLENGE FOR HIGH THERMAL MASS COMPONENTS Jinda Songninluck, Juthathip Fangkangwanwong ,Teng Hoon Ng  Purchase 
    Studies on a Newly Discovered White Whiskers Causing Battery Leakage Karuna Chinniah, Ph.D  Purchase 
    FLUX SPATTER DURING REFLOW SOLDERING Kevin Tan, Casey Ng, and Dennis Lim  Purchase 
    EVALUATION OF LEAD FREE SURFACE FINISHES Khaw Mei Ming  Purchase 
    FAILURE ANALYSIS OF “BLACK PAD” DEFECT AND ITS PREVENTION Kong Hui Lee, Ph.D. and Todd Broome  Purchase 
    LEAD-FREE MISPRINT BOARD CLEANING STUDIES Kong Hui Lee, Ph.D., George Oxx, & Mike Bixenman, Ph.D.  Purchase 
    IMPLEMENTING SILVER SURFACE FINISHING FOR BROADER SEGMENTS OF ELECTRONICS Lenora Toscano, John Swanson, Ernest Long PhD and John Ganjei PhD  Purchase 
    HARSH ENVIRONMENT IMPACT ON RESISTOR RELIABILITY Marie Cole, Lenas Hedlund, George Hutt, Tibor Kiraly, Levente Klein, Steve Nickel, Prabjit Singh, and Tim Tofil  Purchase 
    LATEST TECHNIQUES IN STENCIL PRINTING FOR HETEROGENEOUS ASSEMBLY Mark Whitmore and Clive Ashmore  Purchase 
    CLEANING FLUX RESIDUES UNDER LOW COMPONENT GAPS Mike Bixenman, DBA  Purchase 
    THE BENEFITS OF PURE PD LAYERS IN ENEP AND ENEPIG SURFACE FINISHES Mustafa Oezkoek, Gustavo Ramos, Rahmat Budiardjo, Hugh Roberts  Purchase 
    PRESS-FIT INTERCONNECTION ASSEMBLY CHALLENGES AND SOLUTIONS Phil Isaacs, Sven Peng, HM Chan, Wai Mun Lee, and Alex Chen  Purchase 
    ROOM TEMPERATURE LED AND D-PAK TYPE COMPONENT-ATTACH AND RELIABILITY TESTING T. Acchione and M. Scalzo  Purchase 
    LONG-TERM RELIABILITY ASSESSMENT OF A NEW LEAD-FREE AREA ARRAY CONNECTOR SYSTEM Takashi Kikuchi, Gnyaneshwar Ramakrishna, Quyen Chu, Hien Ly, Sundar Sethuraman, Chrys Shea, and Jean-Paul Clech  Purchase 
    NEW SOLDER ATTACH IN AREA ARRAY CONNECTOR: ASSESSING THE RELIABILITY OF SOLDER CHARGE SMT ASSEMBLY Theeraphong Kanjanupathum, Teng Hoon Ng, and Adam Stanczak  Purchase 
    SELECTION OF DIP TRANSFER FLUXES AND SOLDER PASTES FOR POP ASSEMBLY Yan Liu, Ph.D., Pamela Fiacco, Derrick Herron, and Ning-Cheng Lee, Ph.D.  Purchase 

    SMTA Headquarters
    6600 City West Parkway, Suite 300
    Eden Prairie, MN 55344

    Phone 952.920.7682
    Fax 952.926.1819
    Home
    Site Map
    Update Your Info
    Related Links
    Send Us Feedback
    Contact Us
    Privacy Policy
    ↑ Top