SMTA International 2010 Proceedings

While abstracts in the Knowledge Base are accessible to all visitors, the full articles (PDF format) are FREE FOR SMTA MEMBERS to download:

  • Already a member? Log in to download articles.
  • Not a member? Pay just $10 per article or become a member today!
  • < Back to Conferences List



    TITLE AUTHOR DOWNLOAD
    THERMAL WARPAGE OF FLIP-CHIP PLASTIC BALL GRID ARRAY COMPONENT: EXPERIMENT AND MODELING A. Shirazi, H. Lu, and A. Varvani-Farahani  Purchase 
    SMT CHALLENGES IN ALTERNATIVE ENERGY Alan Rae  Purchase 
    UNDERSTANDING DIFFERENCES BETWEEN DEFENSE OEM/CEM AND TRADITIONAL CEM BUSINESS MODELS Allan B. Day  Purchase 
    DEVELOPMENT OF A PACKAGING SYSTEM FOR CLINICAL EVALUATION OF A NANOCOMPOSITE-BASED NEURAL ELECTRODE ARRAY FABRICATED FROM A CHEMORESPONSIVE POLYMER SUBSTRATE Andrew Barnes, Allison Hess, Christian Zorman; Mondhita Diewvilai  Purchase 
    THE Pb-FREE IN ELECTRONICS RISK MITIGATION (PERM)CONSORTIUM Anthony J. Rafanelli, Ph.D., P.E.  Purchase 
    NEW DEVELOPMENTS IN HIGH-TEMPERATURE, HIGH-PERFORMANCE LEAD-FREE SOLDER ALLOYS Anton-Zoran Miric  Purchase 
    EVALUATION OF DEFECTS IN LEAD-FREE BGA SOLDER JOINTS UNDER RANDOM VIBRATION STRESS Anurag Bansal, Kuo-Chuan Liu, and Jie Xue  Purchase 
    HOW TO DEAL WITH PROBLEM AREAS FOR SELECTIVE CONFORMAL COATING Arjen Koppens; Ad van Dinter  Purchase 
    USING X-RAY SYSTEMS TO DETECT COUNTERFEIT AND REWORKED ELECTRONIC COMPONENTS Art Ogg  Purchase 
    BIOCOMPATIBLE POLYMER COMPOSITE MATERIAL FOR HIGHLY SENSITIVE POINT OF CARE BIOMEMS MICROCANTILEVER SENSORS Arvind Sai Sarathi Vasan, Ravi Doraiswami, Ph.D., Michael G. Pecht, Ph.D.  Purchase 
    RELIABILITY TESTING OF LINEAR IMAGE SENSOR DEVICES Awni Qasaimeh, Mridula Gosavi, Frank Andros, Susan Lu, Bahgat Sammakia; Mike Joyner, Mike Sullivan, Jeff Zarnowski  Purchase 
    Mixed Flowing Gas Test Procedures for Creep Corrosion and How To Minimize Its Occurrence Barry S. Hindin, Ph.D., P.E.  Purchase 
    MECHANICAL FAILURES IN Pb-FREE PROCESSING: SELECTED MITIGATION TECHNIQUES FOR PAD CRATER DEFECTS Brian Gray, P. Eng., John McMahon, P. Eng.  Purchase 
    Applications of Solder Fortification with Preforms Carol Gowans and Ronald C. Lasky, Ph.D., P.E.  Purchase 
    ZERO-DEFECT STRATEGIES WITH COMBINED OPTICAL AND X-RAY INSPECTION (AOI/AXI) Carsten Salewski and Jesper Lykke  Purchase 
    READING THE FINE PRINT: CHALLENGES AND OUTLOOK FOR PRINTED ELECTRONICS Charles E. Bauer, Ph.D., Herbert J. Neuhaus, Ph.D.  Purchase 
    CHALLENGES OF PACKAGING Cd-Zn-Te (CZT) DETECTORS Charles G. Woychik, Ph.D., Brian D. Yanoff, Ph.D., James E. Simpson, Ph.D., Jay Cao, Ph.D., Ian M. Spinelli, Vincent S. Smetkowski, Ph.D.; James Adriance, Lawrence Harvilchuck, Brian Roggeman, George Westby  Purchase 
    PROCESS CONTROL-BASIS FOR A COST-EFFECTIVE SELECTIVE SOLDERING PROCESS Christian Ott, Heike Schlessmann, Reiner Zoch  Purchase 
    COMBINATORIAL EFFECTS OF ELECTROMIGRATION AND LOW CYCLE FATIGUE Christopher Hunt, Davide Di Maio, Charles Murdock, Owen Thomas  Purchase 
    ULTRAVIOLET CONFORMAL COATING PROCESS DEVELOPMENT Corey Peterson  Purchase 
    HIGH COMPLEXITY LEAD-FREE WAVE AND REWORK: THE EFFECTS OF MATERIAL, PROCESS AND BOARD DESIGN ON BARREL FILL Craig Hamilton, John McMahon, Jose Traya, Wang Yong Kang, Khoo Kok Wei; Matthew Kelly, Marie Cole  Purchase 
    VALIDATION OF A NEW R.O.S.E. CLEANLINESS TEST METHOD Curtis Hart; Steve Stach; Mike Bixenman, DBA  Purchase 
    NASA-DoD COMBINED ENVIRONMENTS TESTING RESULTS Cynthia Garcia  Purchase 
    APPLICATIONS METHODS AND MATERIAL SETS FOR PRINTED ELECTRONICS Daniel Fenner  Purchase 
    HOW EFFICIENT IS YOUR HIGH MIX EMS SUPPLIER Dave Cesar; Roy Starks  Purchase 
    NASA DoD -55°C TO +125°C THERMAL CYCLE TEST RESULTS Dave Hillman, Tim Pearson, Ross Wilcoxon  Purchase 
    ORGANIC AND PRINTED ELECTRONICS-A VIEW FROM THE TRADITIONAL MARKET PLACE David Baron, Frank Bruening, Ph.D., Robin Taylor  Purchase 
    Specification Limits Review for Solder Paste Stencil Print Inspection (SPI) David Sbiroli, Ed Briggs, and Chris Anglin  Purchase 
    iNEMI LEAD FREE WAVE SOLDERING PROJECT: AN INVESTIGATION OF THROUGH-HOLE ELECTRICAL INTERCONNECTS Denis Barbini; Denis Jean; Stuart Longgood; Keith Howell; Jian Miremadi  Purchase 
    LAND AND SOLDER GRID ARRAY SMT ASSEMBLY CHALLENGES Dudi Amir  Purchase 
    BIG CLEANING JOB VS. SMALL CLEANERS THE ADVANTAGES AND PITFALLS OF GOING SMALL Eric Camden  Purchase 
    A New Surface Finish for the Electronics Industry Ernest Long, Ph.D., and Lenora Toscano  Purchase 
    REAL LIFE X-RAY INSPECTION FOR BGAs, QFNs, COUNTERFEIT COMPONENTS AND 3D PACKAGES Evstatin Krastev and David Bernard  Purchase 
    Supporting Component Self-Alignment by Forced Oscillation During Reflow Soldering Florian Schüßler, Michael Pfeffer, Stefan Härter, and Prof. Dr.-Ing. Jörg Franke  Purchase 
    SELECTIVE SOLDERING TECHNOLOGY SELECTION Francisco Fernandez, Eddie Tang, Feng Lu, Ph.D.  Purchase 
    Experiences in Transferring Recipes from an Eight Zone Reflow Oven to A Ten Zone Oven - Unexpected Savings Fred Dimock  Purchase 
    A Study of the ENEPIG IMC for Eutectic and LF Solders G. Milad, D. Gudeczauskas, G. O'Brien, and A. Gruenwald  Purchase 
    AOI IN AN 01005 WORLD Galen Alexander, Cathy Combet and Ming-Ming Chang  Purchase 
    How to Implement Good Test Coverage and Eliminate Escapes for Printed Circuits Board Assembly Operation Gaosen Li, An Qi Zhao, Andrew Ho, Wei Wen, Zhen (Jane) Feng, Ph. D., and Murad Kurwa; Haolee Yang and Liang Chen  Purchase 
    CLEAN “NO-CLEAN” OR USE A WATER WASH SOLDER PASTE? Gerjan Diepstraten; Tim Lawrence, Ph.D.  Purchase 
    HOW CLEAN IS CLEAN Graham Naisbitt  Purchase 
    LOW-SILVER BGA ASSEMBLY PHASE II – RELIABILITY ASSESSMENT SIXTH REPORT: THERMAL CYCLING RESULTS FOR UNMIXED JOINTS Gregory Henshall, Michael Fehrenbach; Chrys Shea; Quyen Chu,Girish Wable; Ranjit Pandher; Ken Hubbard, Gnyaneshwar Ramakrishna; Ahmer Syed  Purchase 
    BENCHMARK STUDY: pH-NEUTRAL VS. ALKALINE CLEANING AGENTS Harald Wack, Ph.D., Umut Tosun, M.S.; John Neidermann; John Radmann  Purchase 
    METHODS USED IN THE DETECTION OF COUNTERFEIT ELECTRONIC COMPONENTS Harold “Woody” Hewett  Purchase 
    PCB Creep Corrosion and Board Design Considerations He Jingqiang, Gao Feng, Tu Yunhua, and Liu Sang  Purchase 
    PROCESS CONTROL - MEASUREMENT SYSTEM ANALYSIS Herb Robbins  Purchase 
    COMPARISON OF VARIOUS METROLOGIES TO MEASURE VOIDS IN X-RAY IMAGES OF HIGH DENSITY BGA PACKAGE SOLDER BALLS Ife Hsu and Raiyo Aspandiar, Ph.D.  Purchase 
    BALL GRID ARRAY COMPONENT FAILURE ANALYSIS FOR HIGH RELIABILITY ELECTRONIC SYSTEMS J. Scott Nelson  Purchase 
    MOISTURE-CURE POLYURETHANES – LATEST DEVELOPMENTS IN VOC FREE CONFORMAL COATINGS Jade P. Bridges  Purchase 
    OVERVIEW OF NEW DoD RELIABILITY REVITALIZATION INITIATIVES James G. McLeish, CRE  Purchase 
    Silver Corrosion in High Sulfur Environments James S. Tonge  Purchase 
    PCB PAD SITE DRESS METHODS ON BGA AND SOCKET PAD ARRAYS James Wade and Raiyo Aspandiar; Don Naugler and Terry Leahy  Purchase 
    AN INVESTIGATION INTO THE DEVELOPMENT OF LEAD-FREE SOLDER PASTE FOR PACKAGE ON PACKAGE (PoP) COMPONENT MANUFACTURING APPLICATIONS Jasbir Bath, Manabu Itoh, Gordon Clark, Masatoshi Fuji, Hajime Takahashi, and Roberto Garcia  Purchase 
    An Investigation into the Development of Tin-Lead and Lead-Free Solder Pastes to Reduce Voiding in Large Contact Area Power Transistor/ QFN Type Components Jasbir Bath, Manabu Itoh, Gordon Clark, Noriyoshi Uchida, Hajime Takahashi, and Roberto Garcia  Purchase 
    AN EVALUATION OF SEALANTS USED IN PHOTOVOLTAIC (PV) MODULE MANUFACTURE Jasbir Bath, Mike Moreau, Martin Gershenson, Cathy He, Yinbai Li, Miaosheng Zheng  Purchase 
    SURFACE MOUNT PERFORMANCE OF 0.4mm-PITCH SOLDER JOINTS WITH FOCUS ON STACKING MATERIALS AND PROCESSES FOR PACKAGE-ON-PACKAGE APPLICATIONS Jason Brand, Myung Jin Yim, Nanette Quevedo, Maria Ospina, Ravikumar Adimula, and Cenon Dayawon  Purchase 
    PROCESS DEVELOPMENT AND RELIABILITY STUDY WITH ANISOTROPIC CONDUCTIVE FILM BONDING WITH MULTIPLE TYPES OF PCB SURFACE FINISHES Jenson Lee, David Geiger, and Dongkai Shangguan, Ph.D.  Purchase 
    ODM OR EMS: WHICH CHOICE IS BEST FOR YOUR PROJECT? Jim Chen  Purchase 
    Electroless Palladium as a PCB Surface Finish - The Re-Introduction Jim Trainor  Purchase 
    QUAD FLAT NO LEAD (QFN) PACKAGE PROCESSING IN HIGH THERMAL MASS ASSEMBLY Jinda Songninluck, Theeraphong Kanjanupathum, and Teng Hoon Ng  Purchase 
    EVALUATION OF THERMAL INTERFACE MATERIAL PERFORMANCE IN A CYCLIC STRAIN ENVIRONMENT Joe Doman, Eddie Kobeda, Ph.D., Jim Bielick, Joe Kuczynski, Tim Tofil, and Mike Vaughn  Purchase 
    Reliability Issues Caused by Bending HDI Flexible Circuits John Dzarnoski and Kexia Sun  Purchase 
    A Standardized Method to Evaluate Process Material Compatibility with In-Circuit Test in High Complexity Assembly John McMahon, P.Eng., Simin Bagheri, and Lynn Klev  Purchase 
    INTERACTIVE PAPERLESS WORK INSTRUCTIONS USED FOR PROCESS MANAGEMENT John Stimadorakis  Purchase 
    ITAR COMPLIANCE: CHALLENGES AND BENEFITS IN AN OUTSOURCED RELATIONSHIP Joseph F. O’Neil  Purchase 
    FABRICATION OF LOW COST FLEXIBLE SOLAR CELLS USING SOLUTION-BASED COATING TECHNIQUES SOLUTION-BASED COATING TECHNIQUES Joseph Weiss, Peter Kariuki, Jasper Chiguma, Jessica Gendron, Babak Arfaei, Peter Borgesen, and Wayne Jones  Purchase 
    LEAD-FREE WAVE SOLDERING FOR PROCESS AND PRODUCT DESIGN IMPROVEMENT IN SnCu ALLOYS Juthathip Fangkangwanwong, Mongkhol Phuhattsuan, and Teng Hoon Ng  Purchase 
    CHARACTERISATION OF THERMAL-ELECTRICAL AND MECHANICAL BEHAVIOUR OF POP K. Weide-Zaage, L. Meinshausen; H. Frémont  Purchase 
    THE DEVELOPMENT OF AN IMPROVED TIN-ZINC SOLDER Keith Sweatman, Takashi Nozu, Tetsuro Nishimura  Purchase 
    STENCIL TECHNOLOGIES FOR SMALL APERTURE PRINTING Kevin Liticker, MS, CSSBB  Purchase 
    NASA-DoD LEAD-FREE ELECTRONICS PROJECT:OVERVIEW Kurt Kessel  Purchase 
    MOISTURE AND CONTAMINATION CONSIDERATIONS FOR LONG TERM STORAGE OF END OF LIFE ELECTRONIC COMPONENTS Lee Melatti  Purchase 
    PRINTED ELECTRONICS FOR FLEXIBLE SOLID STATE LIGHTING Marc Chason  Purchase 
    HARSH ENVIRONMENT IMPACT ON RESISTOR RELIABILITY Marie Cole, Lenas Hedlund, George Hutt, Tibor Kiraly, Levente Klein, Steve Nickel, Prabjit Singh, Tim Tofil  Purchase 
    COUNTERFEIT COMPONENTS – THE 800 POUND GORILLA Mark Pasdon  Purchase 
    NEW DEVELOPMENTS IN BROADBAND PRINTING TECHNIQUES Mark Whitmore, Clive Ashmore  Purchase 
    HEAD-IN-PILLOW: ALARM STILL RINGING? A CONTINUATION STUDY ON KNOWN CHEMICAL AND MECHANICAL FACTORS IN BGA NON-WET Masato Shimamura and Tomoko Nonaka; Tetsuya Okuno, Satoru Akita, and Derek Daily  Purchase 
    LEAD-FREE HASL: BALANCING BENEFITS AND RISKS FOR HIGH COMPLEXITY HIGH RELIABILITY SERVER AND STORAGE HARDWARE Matthew Kelly, Jeffrey Taylor, Brett Krull, Marie Cole, Tom Truman  Purchase 
    Four Ways to Reduce Voids in BGA/CSP Package to Substrate Connections Michael A. Previti, Mitch Holtzer, and Tom Hunsinger  Purchase 
    New Copper Electrolytes for Blind Microvia Filling Michael Dietterle, Ph.D.  Purchase 
    CHARACTERISTICS AND POTENTIALS OF NANO-COATED STENCILS FOR STENCIL PRINTING OPTIMIZATION Michael Rösch, Prof. Dr.-Ing. Jörg Franke; Carmina Läntzsch, Georg Kleemann  Purchase 
    NiPdAu PLATING QUALIFICATION OF RF-IC PACKAGES Mumtaz Y. Bora  Purchase 
    The Benefits of ENEPIG with Pure Pd for Gold Wire Bonding Mustafa Oezkoek, Gustavo Ramos, Dieter Metzger, and Hugh Roberts  Purchase 
    RESISTANCE OF COMMON PWB SURFACE FINISHES AGAINST CORROSION IN HARSH ENVIRONMENTS Mustafa Özkök, Mario Gensicke, Guenter Heinz; Hugh Roberts, Joe McGurran  Purchase 
    BRIDGING SUPPLY CHAIN GAP FOR EXEMPT HIGH-RELIABILITY OEM’S Nicholas Leonardi  Purchase 
    THERMAL CYCLING RELIABILITY OF PACKAGE ON PACKAGES ASSEMBLED BY ONE-PASS AND TWO-PASS TECHNIQUES Nicholas Williard, Preeti Chauhan, Vikram Srinivas, Michael Osterman, and Michael Pecht; Robert Farrell  Purchase 
    DROP TEST ASSESSMENT OF A MEDIUM COMPLEXITY ASSEMBLY FOR HIGH RELIABILITY APPLICATIONS P. Snugovsky; J. Bragg, Z. Bagheri, M. Romansky; A. Ganster; W. Russell; J. P.Tucker and C. A. Handwerker; D. D. Fritz  Purchase 
    TEMPERATURE CYCLING OF Pb-FREE AND MIXED SOLDER INTERCONNECTIONS USED ON A PACKAGE-ON-PACKAGE TEST VEHICLE P. T. Vianco, J. M. Grazier, J. A. Rejent, and A.C. Kilgo; F. Verdi and C. Meola  Purchase 
    EFFECTS OF COMPONENT WARPAGE ON BOARD ASSEMBLY DEFECTS AND EFFECTIVE MITIGATION MEASURES Peng Su and Guhan Subbarayan  Purchase 
    PRESS-FIT INTERCONNECTION ASSEMBLY CHALLENGES AND SOLUTIONS Phil Isaacs, Sven Peng; HM Chan, Wai Mun Lee, Alex Chen  Purchase 
    RESIDUAL-LIFE ESTIMATION OF LEAD-FREE ELECTRONICS IN SHOCK AND VIBRATION USING KALMAN FILTER MODELS Pradeep Lall and Ryan Lowe; Kai Goebel  Purchase 
    SURVIVABILITY ASSESSMENT OF ADVANCED INTERCONNECTS AND LEAD-FREE ELECTRONICS SUBJECTED TO SHOCK AND VIBRATION WITH XFEM AND CZM Pradeep Lall, Mandar Kulkarni, and Arjun Angral  Purchase 
    INTERROGATION OF DAMAGE-STATE IN LEAD-FREE ELECTRONICS UNDER SEQUENTIAL EXPOSURE TO THERMAL AGING AND THERMAL CYCLING Pradeep Lall, Rahul Vaidya, Vikrant More; Kai Goebel  Purchase 
    IONIC CONTAMINATION EXTRACTION EFFECTIVENESS AND CORRELATION OF ANALYSIS METHODS Pravin Sequeira, Kantesh Doss, Arnold Hogrefe, Minh Nguyen  Purchase 
    ENVIRONMENT-FRIENDLY VAPOR PHASE CONFORMAL INSULATION OPTIONS FOR RELIABILITY IMPROVEMENT OF ELECTRONICS Rakesh Kumar  Purchase 
    A COST-EFFECTIVE PROCESS FOR EDGE PROTECTION OF WAFERS Ramachandran K. Trichur, Gary J. Brand, Curtis Planje, Xie Shao  Purchase 
    Considerations for Selecting a Printed Circuit Board Surface Finish Randy Schueller, Ph.D.  Purchase 
    ANALYSIS OF THE INFLUENCE OF REFLOW PROFILE PARAMETERS ON PACKAGE ON PACKAGE (PoP) COMPONENT ASSEMBLY Rangaraj Dhanasekaran, Harish Gadepalli, and S. Manian Ramkumar, Ph.D.  Purchase 
    A PROCEDURE TO DETERMINE HEAD-IN-PILLOW DEFECT AND ANALYSIS OF CONTRIBUTING FACTORS Ranjit Pandher, Rahul Raut, Michael Liberatore, Navendra Jodhan, and Karen Tellefsen  Purchase 
    EFFECT OF MULTIPLE REFLOW CYCLES ON SOLDER JOINT FORMATION AND RELIABILITY Ranjit Pandher; Ashok Pachamuthu  Purchase 
    ISSUES AND CONCERNS IN CLEANING UNDER LOW PROFILE COMPONENTS Rich Brooks, Mike Bixenman, D.B.A.  Purchase 
    SOLDER JOINT RELIABILITY OF Pb-FREE TIN-SILVER-COPPER CERAMIC BALL GRID ARRAY (CBGA) PACKAGES AS A FUNCTION OF COOLING RATE AND SILVER CONTENT Richard Coyle, Peter Read, Debra Fleming, Richard Popowich, Iulia Muntele; Robert Kinyanjui, Jonathon Shirey, Mulugeta Abtew, John Manock  Purchase 
    RELIABILITY COMPARISON OF SAC305 AND SAC105 PLASTIC BALL GRID ARRAYS ASSEMBLED WITH BACKWARD COMPATIBLE SOLDERING PROCESSES Richard Coyle, Peter Read, Richard Popowich, Debra Fleming; Heather McCormick; John Osenbach  Purchase 
    THE INFLUENCE OF SOLDER VOID LOCATION ON BGA THERMAL FATIGUE LIFE Richard Coyle, Peter Read, and Richard Popowich; Heather McCormick; John Osenbach  Purchase 
    THE EFFECT OF SILVER CONTENT ON THE SOLDER JOINT RELIABILITY OF A Pb-FREE PBGA PACKAGE Richard Coyle, Peter Read, Richard Popowich, Debra Fleming; Heather McCormick; John Osenbach; John Manock  Purchase 
    PRACTICAL ISSUES AND SOLUTIONS FOR HANDLING PLASTIC ENCAPSULATED MICROCIRCUITS (PEMs) Rick Iodice  Purchase 
    Evaluation of Nano-Coated Stencil for Ultra Fine Pitch Component Assembly Rita Mohanty, Ph.D., Rajiv Iyer, Sharan Hoogar and Daryl Santos, Ph.D.  Purchase 
    HARSH ENVIRONMENTS AND VOLATILES IN SEALED ENCLOSURES Robert K. Lowry; Richard C. Kullberg; Daniel J. Rossiter  Purchase 
    PACKAGING HIGH DENSITY CAPACITIVE MICRO-MACHINED ULTRASONIC TRANSDUCERS (CMUT) SENSOR ARRAYS USING HYPERBGA® TECHNOLOGY – PART II Robert Wodnicki, Charles G. Woychik, Kai Thomenius; Glen Thomas, Irv Memis, Ulises Penaherrera, Barry Bonitz, Todd Davies  Purchase 
    POLYIMIDE-OVER-UBM PROCESS: THE CHALLENGES AND SOLUTIONS ON PLATING BUMP PROCESS Roden Topacio  Purchase 
    Use of Non Etching Adhesion Promoters in Advanced PCB Applications Roger Massey and Adrian Zee  Purchase 
    HIGH TEMPERATURE ELECTRONICS PACKAGING TECHNOLOGY FOR SIGNAL CONDITIONING AND PROCESSING CIRCUITS S. T. Riches; C. Johnston, M. Sousa, P. Grant, D. Shepherd  Purchase 
    OUTSOURCING LED PCB MANUFACTURE Scott Mauldin  Purchase 
    NEXT GENERATION BOARD LEVEL UNDERFILL (BLUF) FOR FINE PITCH BGA AND POP Siang Miang Yeo, Cheng Siew Tay, Ching Ching Chong, and Jin Siang Beh  Purchase 
    OVERCOMING COMPLEX MANUFACTURING ISSUES WITH RF MMIC PRODUCTS: A CASE STUDY Steve Greathouse, Jennifer Davisson, Gary Catlin, Jared Stockett, Teri Whipple, Richard Garcia, Steve Abrahamson, Jim Spinuzzi  Purchase 
    CHALLENGES IN LEAD-FREE WAVE SOLDERING Sunil Gopakumar, Francois Billaut, Eric Fremd; Chris Chu, K.Y.Tsai, Chu Lin, Toyma Lee; Jasbir Bath  Purchase 
    ROOM TEMPERATURE LED AND D-PAK TYPE COMPONENT-ATTACH AND RELIABILITY TESTING T. Acchione and M. Scalzo  Purchase 
    LONG-TERM RELIABILITY ASSESSMENT OF A NEW LEAD-FREE AREA ARRAY CONNECTOR SYSTEM Takeshi Saito, Nobuhiro Tamai, Takashi Kikuchi; Gnyaneshwar Ramakrishna; Chrys Shea; Jean-Paul Clech  Purchase 
    HIGH RELIABILITY BOND PADS Terence Collier, Bal Benavidez, Indira Gubeljic  Purchase 
    NEW SOLDER ATTACH IN AREA ARRAY CONNECTOR:ASSESSING THE RELIABILITY OF SOLDER CHARGE SMT ASSEMBLY Theeraphong Kanjanupathum, Teng Hoon Ng; Adam Stanczak  Purchase 
    NASA-DOD LEAD-FREE ELECTRONICS PROJECT: MECHANICAL SHOCK TEST Thomas A. Woodrow, Ph.D.  Purchase 
    NASA-DoD LEAD-FREE ELECTRONICS PROJECT: VIBRATION TEST Thomas A. Woodrow, Ph.D.  Purchase 
    Latest Developments in Surface Finishing of PCBs Using Plasma Deposition Tim von Werne, Ph.D., Andy Brooks, and Siobhan Woollard  Purchase 
    ELECTRONIC PRODUCT ASSEMBLY IN THE GLOBAL MARKETPLACE: THE MATERIAL PIECE OF THE COMPETITIVE PUZZLE Tom Borkes  Purchase 
    THE ENCAPSULATION OF MEMS/SENSORS ON PACKAGE LEVEL AND WAFER LEVEL WITH FILM ASSISTED MOLDING TECHNOLOGY Ton van Weelden and Lingen Wang  Purchase 
    STENCIL ENABLING PROCESSES FOR SMALL AREA RATIO’S William E. Coleman Ph.D.  Purchase 
    EFFECT OF PCB SURFACE FINISHES ON LEAD-FREE SOLDER JOINT RELIABILITY Xu Zheng, Hongfeng Ran, Lei Wang, Hao Kou, Yexiang Ning, Bei Wang, Xian Lin, and Zuyao Liu  Purchase 
    SELECTION OF DIP TRANSFER FLUXES AND SOLDER PASTES FOR POP ASSEMBLY Yan Liu, Ph.D., Pamela Fiacco, Derrick Herron, and Ning-Cheng Lee, Ph.D.  Purchase 
    TESTING AND PREVENTION OF HEAD-IN-PILLOW Yan Liu, Ph.D., Pamela Fiacco, M.S., and Ning-Cheng Lee, Ph.D.  Purchase 
    Pb-FREE REFLOW PROCESS STUDY FOR HIGH YIELD, HIGH RELIABILITY FLIP CHIP ON SILICON SUBSTRATE ASSEMBLY Zhaozhi Li, Sangil Lee, Brian J. Lewis, Paul N. Houston, Daniel F. Baldwin, Gene Stout, Ted Tessier and John L. Evans  Purchase 

    SMTA Headquarters
    6600 City West Parkway, Suite 300
    Eden Prairie, MN 55344

    Phone 952.920.7682
    Fax 952.926.1819
    Home
    Site Map
    Update Your Info
    Related Links
    Send Us Feedback
    Contact Us
    Privacy Policy
    ↑ Top