Pan Pacific Symposium 2000 Proceedings

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    TITLE AUTHOR DOWNLOAD
    FLUXLESS SUBMICRON FLIP CHIP BONDING TECHNOLOGY USING SOLDER BUMPS Akira Yamauchi  Purchase 
    AUTOMATING UNDERFILL FOR NON-TRADITIONAL PACKAGES, SECONDARY CSP UNDERFILL, STACKED DIE, AND NO-FLOW UNDERFILL Alec J. Babiarz  Purchase 
    SHIELDING DESIGN OPTIMIZING EMC CHARACTERISTICS IN ADVANCED MCM PACKAGING Alessandro Gandelli  Purchase 
    LOW ALPHA PARTICLE EMITTING SILICONE MATERIALS FOR MICROELECTRONICS Ann Norris  Purchase 
    ENCAPSULATED, MAGNETIC-SEMICONDUCTOR DEVICE FOR POWER CONVERSION APPLICATIONS Ashraf Lotfi  Purchase 
    ULTRA VIA SUBSTRATE FOR ADVANCED BGA APPLICATIONS Bill Chou  Purchase 
    SOC (SUBSTRATE ON CHIPS) MOLD COMPOUND EVALUATION C.L. Chung  Purchase 
    BOARD-LEVEL THERMAL DESIGN MAPS FOR HQFP Ching-Bai Hwang  Purchase 
    MINIATURE SYSTEMS DRIVE CHIP-SCALE ASICS Dale Lee  Purchase 
    DEVELOPMENT AND QUALIFICATION OF HIGH COMPLEXITY PCB Daniel Chienhung Lai  Purchase 
    IMMERSION TIN AS A HIGH PERFORMANCE SOLDERABLE FINISH FOR FINE PITCH PWBS David Ormerod  Purchase 
    1X BROADBAND WAFER STEPPER FOR BUMP AND WAFER LEVEL CHIP SCALE PACKAGING (CSP) APPLICATIONS Doug Anberg  Purchase 
    HIGH DENSITY ELECTRONICS PACKAGING ASSESSMENT Emmanuel J. Siméus  Purchase 
    THREE-DIMENSIONAL INTELLECTUAL SENSORS OF MAGNETIC FIELD ON THE BASE OF HALL EFFECT Fuad Kasimov  Purchase 
    AUTOMATED OPTICAL INSPECTION OF PRINTED CIRCUIT CARD ASSEMBLIES Guy A. Eckroth  Purchase 
    RELIABILITY ISSUES ON THE 128M TSOP II 54L DUAL CHIP PACKAGE James Fan  Purchase 
    SIMULATED SCANNING FOR EFFICIENT SCANNING ACOUSTIC MICROSCOPY James McKeon  Purchase 
    EVALUATION OF UNDERFILL IN FLIP CHIP AND BGA ON PC BOARDS USING 3V RECONSTRUCTION AND THROUGH- TRANSMISSION IMAGING Janet Semmens  Purchase 
    RELIABILITY AND FAILURE ANALYSIS OF NO-CLEAN FLIP CHIP ASSEMBLY Jen-Chieh Chang  Purchase 
    WETTABILITY ANALYSIS FOR C4 OLGA PACKAGE Jinlin Wang  Purchase 
    SOLID SOLDER DEPOSITS FOR ADVANCED MICROELECTRONIC APPLICATIONS Joanne DeBlis  Purchase 
    NOVEL PACKAGE DESIGNS TO ENHANCE LEADFRAME BASED PACKAGES John Briar  Purchase 
    Advancements in Stacked Chip Scale Packaging (S-CSP), Provides System-in-a-Package Functionality for Wireless and Handheld Applications Kada Smith  Purchase 
    OUTSOURCING AS A STRATEGIC TOOL Kewal K. Verma  Purchase 
    LASER STRUCTURING AS AN ENABLING TECHNOLOGY FOR HDI AND PSGA Leo Higgins  Purchase 
    ASSESSMENT OF LIQUID ENCAPSULATED AND TRANSFER MOLDED WIREBONDED CAVITY FILLED PACKAGES Lisa Ryan  Purchase 
    FUNDAMENTALS OF BGA BALL ATTACH REFLOW PROCESS Michael Ko  Purchase 
    EVALUATION OF KEY UNDERFILL FORMULATION PARAMETERS ON THE PERFORMANCE OF FLIP-CHIP DEVICES Michael Todd  Purchase 
    ADVANCEMENTS IN STACKED CHIP SCALE PACKAGING (S-CSP), PROVIDES SYSTEM-IN-A-PACKAGE FUNCTIONALITY FOR WIRELESS AND HANDHELD APPLICATIONS Morihiro Kada  Purchase 
    ADVANCEMENTS IN STACKED CHIP SCALE PACKAGING (S-CSP), PROVIDES SYSTEM-IN-A-PACKAGE FUNCTIONALITY FOR WIRELESS AND HANDHELD APPLICATIONS Morihiro Kada  Purchase 
    AUTOMATION & CONTROL OF THE SURFACE MOUNT PROCESS Neil Douglas  Purchase 
    APPLICATION SPECIFIC FLIP CHIP PACKAGES: CONSIDERATIONS AND OPTIONS IN USING FCIP Paul Mescher  Purchase 
    WORLD WIDE DEPLOYMENT OF CSP ASSEMBLY PROCESS CSP STRESS/STRAIN ENERGY DISTRIBUTION MODELING AND FATIGUE RESISTANCE STUDY Paul P.E. Wang  Purchase 
    CSP SMT AND SOLDER JOINT RELIABILITY Pei-Ying Shieh  Purchase 
    HIGH TCE BALL GRID ARRAY FOR SINGLE CHIP CERAMIC PACKAGING Raj N. Master  Purchase 
    ARE OEMS BECOMING OBSOLETE AS MANUFACTURERS? Randall Sherman  Purchase 
    INTEGRATED LIQUID COOLING SYSTEM FOR THE THERMAL MANAGEMENT IN LTCC MULTILAYER Reinhard Bauer  Purchase 
    A STUDY ON MULTI-CHIP PACKAGE TECHNOLOGY – DUAL CHIP IN TSOP II 54L PACKAGE Richard Lu  Purchase 
    ADVANCED HEAT PIPE THERMAL SOLUTIONS FOR HIGHER POWER NOTEBOOK COMPUTERS Robert DeHoff  Purchase 
    IN SITU THERMAL CHARACTERIZATION OF MICRO-ELECTRONIC COMPONENTS AND SYSTEMS Roger Emigh  Purchase 
    NOVEL TRANSFER MOLDING TECHNIQUE FOR ENCAPSULATING PBGA PACKAGES Ron Molnar  Purchase 
    PBGA REWORK PROCESS WITH MINIMUM VOID FORMATION Rupert Kreuzkamp  Purchase 
    DIE-CRACKING RISKS IN ADDING A HEATSLUG TO A QFP PACKAGE S. H.-K. Lee  Purchase 
    DIE-CRACKING RISKS IN ADDING A HEATSLUG TO A QFP PACKAGE Samuel Ip  Purchase 
    PROCESS 'OPTIMIZATION' USING DESIGNED EXPERIMENTS IN AN EMS PROVIDER'S FACILITY Sandeep Tonapi  Purchase 
    THERMAL AND ELECTRICAL PERFORMANCE FOR STACK CHIP PACKAGE Sang Wook Park  Purchase 
    LOW COST, HIGH VOLUME PRODUCTION OF A FINE PITCH DCA ASSEMBLY Scott Joslin  Purchase 
    INLINE FLUX VOLUME MEASUREMENT FOR CSP PROCESS CONTROL Stacy Kalisz  Purchase 
    DEVELOPMENT OF MICROELECTRONIC GRADE SILICONE MATERIALS FOR CHIP SCALE PACKAGES Stanton Dent  Purchase 
    LEAD-FREE SOLDERING SOLUTION FOR OVERMOLDED HYBRID MCM-L PACKAGES Steve Liang  Purchase 
    KEY PROPERTIES AND REQUIREMENTS FOR MATERIALS USED IN CHIP SCALE PACKAGING Steven W. Wilson  Purchase 
    REQUIREMENTS FOR MOISTURE AND THERMAL-SHOCK RESISTANCE OF A PLASTIC BGA PACKAGE Teo Poi Siong  Purchase 
    A VISION OF ELECTRONICS IN THE 21st CENTURY Toru Ishida  Purchase 
    APPLICATION OF MICROELECTRONIC DEVICES FOR PACKAGE-INDUCED STRESS MEASUREMENT Tung-Sheng Chen  Purchase 
    FLEX, RIGID, AND CERAMIC CSP - LIFETIME BEHAVIOR W.H. Müller  Purchase 
    SILICONE, CHIP SCALE PACKAGE, AND ITS RELIABILITY Yeong J. Lee  Purchase 
    A SIMPLE FLEX-CSP AND ITS RELIABILITY Yii-Tay Chiou  Purchase 

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