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Amkor

Tropical Stencil

Pan Pacific Symposium 2000 Proceedings
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    TITLE AUTHOR VIEW DOWNLOAD
    FLUXLESS SUBMICRON FLIP CHIP BONDING TECHNOLOGY USING SOLDER BUMPS   Akira Yamauchi  Abstract Purchase 
    AUTOMATING UNDERFILL FOR NON-TRADITIONAL PACKAGES, SECONDARY CSP UNDERFILL, STACKED DIE, AND NO-FLOW UNDERFILL   Alec J. Babiarz  Abstract Purchase 
    SHIELDING DESIGN OPTIMIZING EMC CHARACTERISTICS IN ADVANCED MCM PACKAGING   Alessandro Gandelli  Abstract Purchase 
    LOW ALPHA PARTICLE EMITTING SILICONE MATERIALS FOR MICROELECTRONICS   Ann Norris  Abstract Purchase 
    ENCAPSULATED, MAGNETIC-SEMICONDUCTOR DEVICE FOR POWER CONVERSION APPLICATIONS   Ashraf Lotfi  Abstract Purchase 
    ULTRA VIA SUBSTRATE FOR ADVANCED BGA APPLICATIONS   Bill Chou  Abstract Purchase 
    SOC (SUBSTRATE ON CHIPS) MOLD COMPOUND EVALUATION   C.L. Chung  Abstract Purchase 
    BOARD-LEVEL THERMAL DESIGN MAPS FOR HQFP   Ching-Bai Hwang  Abstract Purchase 
    MINIATURE SYSTEMS DRIVE CHIP-SCALE ASICS   Dale Lee  Abstract Purchase 
    DEVELOPMENT AND QUALIFICATION OF HIGH COMPLEXITY PCB   Daniel Chienhung Lai  Abstract Purchase 
    IMMERSION TIN AS A HIGH PERFORMANCE SOLDERABLE FINISH FOR FINE PITCH PWBS   David Ormerod  Abstract Purchase 
    1X BROADBAND WAFER STEPPER FOR BUMP AND WAFER LEVEL CHIP SCALE PACKAGING (CSP) APPLICATIONS   Doug Anberg  Abstract Purchase 
    HIGH DENSITY ELECTRONICS PACKAGING ASSESSMENT   Emmanuel J. Siméus  Abstract Purchase 
    THREE-DIMENSIONAL INTELLECTUAL SENSORS OF MAGNETIC FIELD ON THE BASE OF HALL EFFECT   Fuad Kasimov  Abstract Purchase 
    AUTOMATED OPTICAL INSPECTION OF PRINTED CIRCUIT CARD ASSEMBLIES   Guy A. Eckroth  Abstract Purchase 
    RELIABILITY ISSUES ON THE 128M TSOP II 54L DUAL CHIP PACKAGE   James Fan  Abstract Purchase 
    SIMULATED SCANNING FOR EFFICIENT SCANNING ACOUSTIC MICROSCOPY   James McKeon  Abstract Purchase 
    EVALUATION OF UNDERFILL IN FLIP CHIP AND BGA ON PC BOARDS USING 3V RECONSTRUCTION AND THROUGH- TRANSMISSION IMAGING   Janet Semmens  Abstract Purchase 
    RELIABILITY AND FAILURE ANALYSIS OF NO-CLEAN FLIP CHIP ASSEMBLY   Jen-Chieh Chang  Abstract Purchase 
    WETTABILITY ANALYSIS FOR C4 OLGA PACKAGE   Jinlin Wang  Abstract Purchase 
    SOLID SOLDER DEPOSITS FOR ADVANCED MICROELECTRONIC APPLICATIONS   Joanne DeBlis  Abstract Purchase 
    NOVEL PACKAGE DESIGNS TO ENHANCE LEADFRAME BASED PACKAGES   John Briar  Abstract Purchase 
    Advancements in Stacked Chip Scale Packaging (S-CSP), Provides System-in-a-Package Functionality for Wireless and Handheld Applications   Kada Smith  Abstract Purchase 
    OUTSOURCING AS A STRATEGIC TOOL   Kewal K. Verma  Abstract Purchase 
    LASER STRUCTURING AS AN ENABLING TECHNOLOGY FOR HDI AND PSGA   Leo Higgins  Abstract Purchase 
    ASSESSMENT OF LIQUID ENCAPSULATED AND TRANSFER MOLDED WIREBONDED CAVITY FILLED PACKAGES   Lisa Ryan  Abstract Purchase 
    FUNDAMENTALS OF BGA BALL ATTACH REFLOW PROCESS   Michael Ko  Abstract Purchase 
    EVALUATION OF KEY UNDERFILL FORMULATION PARAMETERS ON THE PERFORMANCE OF FLIP-CHIP DEVICES   Michael Todd  Abstract Purchase 
    ADVANCEMENTS IN STACKED CHIP SCALE PACKAGING (S-CSP), PROVIDES SYSTEM-IN-A-PACKAGE FUNCTIONALITY FOR WIRELESS AND HANDHELD APPLICATIONS   Morihiro Kada  Abstract Purchase 
    ADVANCEMENTS IN STACKED CHIP SCALE PACKAGING (S-CSP), PROVIDES SYSTEM-IN-A-PACKAGE FUNCTIONALITY FOR WIRELESS AND HANDHELD APPLICATIONS   Morihiro Kada  Abstract Purchase 
    AUTOMATION & CONTROL OF THE SURFACE MOUNT PROCESS   Neil Douglas  Abstract Purchase 
    APPLICATION SPECIFIC FLIP CHIP PACKAGES: CONSIDERATIONS AND OPTIONS IN USING FCIP   Paul Mescher  Abstract Purchase 
    WORLD WIDE DEPLOYMENT OF CSP ASSEMBLY PROCESS CSP STRESS/STRAIN ENERGY DISTRIBUTION MODELING AND FATIGUE RESISTANCE STUDY   Paul P.E. Wang  Abstract Purchase 
    CSP SMT AND SOLDER JOINT RELIABILITY   Pei-Ying Shieh  Abstract Purchase 
    HIGH TCE BALL GRID ARRAY FOR SINGLE CHIP CERAMIC PACKAGING   Raj N. Master  Abstract Purchase 
    ARE OEMS BECOMING OBSOLETE AS MANUFACTURERS?   Randall Sherman  Abstract Purchase 
    INTEGRATED LIQUID COOLING SYSTEM FOR THE THERMAL MANAGEMENT IN LTCC MULTILAYER   Reinhard Bauer  Abstract Purchase 
    A STUDY ON MULTI-CHIP PACKAGE TECHNOLOGY – DUAL CHIP IN TSOP II 54L PACKAGE   Richard Lu  Abstract Purchase 
    ADVANCED HEAT PIPE THERMAL SOLUTIONS FOR HIGHER POWER NOTEBOOK COMPUTERS   Robert DeHoff  Abstract Purchase 
    IN SITU THERMAL CHARACTERIZATION OF MICRO-ELECTRONIC COMPONENTS AND SYSTEMS   Roger Emigh  Abstract Purchase 
    NOVEL TRANSFER MOLDING TECHNIQUE FOR ENCAPSULATING PBGA PACKAGES   Ron Molnar  Abstract Purchase 
    PBGA REWORK PROCESS WITH MINIMUM VOID FORMATION   Rupert Kreuzkamp  Abstract Purchase 
    DIE-CRACKING RISKS IN ADDING A HEATSLUG TO A QFP PACKAGE   S. H.-K. Lee  Abstract Purchase 
    DIE-CRACKING RISKS IN ADDING A HEATSLUG TO A QFP PACKAGE   Samuel Ip  Abstract Purchase 
    PROCESS 'OPTIMIZATION' USING DESIGNED EXPERIMENTS IN AN EMS PROVIDER'S FACILITY   Sandeep Tonapi  Abstract Purchase 
    THERMAL AND ELECTRICAL PERFORMANCE FOR STACK CHIP PACKAGE   Sang Wook Park  Abstract Purchase 
    LOW COST, HIGH VOLUME PRODUCTION OF A FINE PITCH DCA ASSEMBLY   Scott Joslin  Abstract Purchase 
    INLINE FLUX VOLUME MEASUREMENT FOR CSP PROCESS CONTROL   Stacy Kalisz  Abstract Purchase 
    DEVELOPMENT OF MICROELECTRONIC GRADE SILICONE MATERIALS FOR CHIP SCALE PACKAGES   Stanton Dent  Abstract Purchase 
    LEAD-FREE SOLDERING SOLUTION FOR OVERMOLDED HYBRID MCM-L PACKAGES   Steve Liang  Abstract Purchase 
    KEY PROPERTIES AND REQUIREMENTS FOR MATERIALS USED IN CHIP SCALE PACKAGING   Steven W. Wilson  Abstract Purchase 
    REQUIREMENTS FOR MOISTURE AND THERMAL-SHOCK RESISTANCE OF A PLASTIC BGA PACKAGE   Teo Poi Siong  Abstract Purchase 
    A VISION OF ELECTRONICS IN THE 21st CENTURY   Toru Ishida  Abstract Purchase 
    APPLICATION OF MICROELECTRONIC DEVICES FOR PACKAGE-INDUCED STRESS MEASUREMENT   Tung-Sheng Chen  Abstract Purchase 
    FLEX, RIGID, AND CERAMIC CSP - LIFETIME BEHAVIOR   W.H. Müller  Abstract Purchase 
    SILICONE, CHIP SCALE PACKAGE, AND ITS RELIABILITY   Yeong J. Lee  Abstract Purchase 
    A SIMPLE FLEX-CSP AND ITS RELIABILITY   Yii-Tay Chiou  Abstract Purchase 


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