International Conference on Soldering & Reliability 2009 Proceedings

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    TITLE AUTHOR DOWNLOAD
    EVALUATION OF THERMAL STRESS IN A FLIP CHIP PACKAGE BY HYBRID EXPERIMENTAL-ANALYTICAL METHOD A.Shirazi, H.Lu and A.Varvani-Farahani  Purchase 
    WATER JET CUTTING FOR CROSS SECTIONING AND DE-PANELLING APPLICATIONS Alex Kaldor, A.C. Rinella and Bev Christian  Purchase 
    HIGH QUALITY REFLOW SOLDERING WITH VAPOR PHASE THE NEW APPROACH OF VAPOR PHASE TECHNOLOGY Andreas Flechtmann and Andreas Thumm  Purchase 
    CONFESSIONS OF A NEOPHYTE IN TEMPERATURE PROFILING A BATCH REFLOW OVEN Bev Christian  Purchase 
    FINE FEATURE STENCIL PRINTING 0.3MM PITCH COMPONENTS Chris Anglin, et al.  Purchase 
    VAPOURPHASE VACUUM-SOLDERING: A NEW PROCESS TECHNOLOGY OPENS TREMENDOUS PRODUCTION CAPABILITIES WHEN REFLOW-SOLDERING Claus Zabel and Allen Duck  Purchase 
    RELIABILITY ASSESSMENT OF ALTERNATIVE LEAD-FREE ALLOYS USED DURING WAVE AND REWORK Craig Hamilton, et al.  Purchase 
    RELIABILITY OF SAC305 AND SN3.5AG SOLDERS UNDER HIGH TEMPERATURE THERMAL CYCLING Elviz George, et al.  Purchase 
    MOVING TOWARDS A STABLE PROCESS: MINIMIZING VARIATION IN SOLDER PASTE PRINTING George Babka  Purchase 
    NANOBOND® ASSEMBLY – A RAPID, ROOM TEMPERATURE SOLDERING PROCESS Greg Caswell  Purchase 
    EFFECT OF ASSEMBLY VARIATIONS ON PACKAGE ON PACKAGE RELIABILITY IN THERMAL CYCLING Heather McCormick, et al.  Purchase 
    GUIDELINES FOR ESTABLISHING A LEAD-FREE WAVE SOLDERING PROCESS FOR HIGH-RELIABILITY APPLICATIONS J. Scott Nelson  Purchase 
    ELECTROPLATE BUMPING WITHOUT PHOTORESIST AND SI DICE STACKING WITH TSV FOR 3D PACKAGING Jiheon Jun, Inrak Kim, Younggon Lee and Jae Pil Jung  Purchase 
    HOT AIR SOLDER LEVELLING – A SOLUTION TO LEAD-FREE SOLDERABILITY PROBLEMS Keith Howell and Keith Sweatman  Purchase 
    Control Of Spalling in SAC Pb-Free Solder Alloys When Used with a Ni Substrate L. Snugovsky, et al.  Purchase 
    ADDRESSING THE CHALLENGE OF HEAD-IN-PILLOW DEFECTS IN ELECTRONICS ASSEMBLY Mario Scalzo, CSMTPE  Purchase 
    LEAD-FREE ASSEMBLY OF SERVER CLASS PCBAs: QUALIFICATION TRIAL RESULTS Matthew Kelly, et al.  Purchase 
    THERMAL CYCLE TESTING OF PWBS – METHODOLOGY Michael Freda and Paul Reid  Purchase 
    PROCESS CHALLENGES AND SOLUTIONS FOR EMBEDDING CHIP-ON-BOARD INTO MAINSTREAM SMT ASSEMBLY Mukul Luthra  Purchase 
    THE USE OF SEGREGATED HYDROFLUOROETHERS AS CLEANING AGENTS IN ELECTRONICS PACKAGING APPLICATIONS Philip G. Clark, Erik D. Olson, and Hiromi Kofuse  Purchase 
    EFFECT OF SILVER IN COMMON LEAD-FREE ALLOYS Ranjit Pandher and Tom Lawlor  Purchase 
    PROBABILISTIC ASSESSMENT OF COMPONENT LEAD-TO-LEAD TIN WHISKER BRIDGING S. McCormack and S. Meschter  Purchase 
    SOLDER JOINT MICROSTRUCTURE AND RELIABILITY STUDY OF PLASTIC BALL GRID ARRAY (PBGA196) AND MICRO LEAD FRAME (MLF) COMPONENTS IN LEAD FREE PROCESSES Simin Bagheri, et al.  Purchase 
    FLUID FLOW MECHANICS - NEW ADVANCES IN LOW STANDOFF CLEANING Sinisa Aleksic, Ph.D., et al.  Purchase 
    PREDICTING THE STRENGTH OF SOLDER JOINTS USING COHESIVE ZONE MODELING Siva P. V. Nadimpalli and Jan K. Spelt  Purchase 
    SOLDERING CHALLENGES IN A HALOGEN-FREE PCB ASSEMBLY PROCESS Timothy Jensen, Ronald Lasky and Amanda Hartnett  Purchase 
    IMPACT OF REWORK ON RELIABILITY OF PLASTIC BALL GRID ARRAYS SUBJECTED TO MECHANICAL BEND TEST Vikram Srinivas, et al.  Purchase 
    RoHS2 and REACH: The Next Steps for Restricted Substances Solutions and services for Environmental Compliance Walter Jager  Purchase 
    CREEP FRACTURE MECHANISM OF PLATED-THROUGH-HOLE(PTH) SOLDER JOINTS BASED ON PHYSICS-OF-FAILURE(PoF) Won Sik Hong, et al.  Purchase 

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