SMTA International 2009 Proceedings

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    TITLE AUTHOR DOWNLOAD
    REINTRODUCTION OF VAPOR PHASE SOLDERING TECHNOLOGY FOR LEAD FREE APPLICATION Adzahar Samat and KL Chia  Purchase 
    EFFECTS OF REFLOW ATMOSPHERE AND FLUX ON TIN WHISKER GROWTH OF Sn-Ag-Cu SOLDER Alongheng Baated, et al.  Purchase 
    THERMAL SHOCK AND DROP TEST PERFORMANCE OF LEAD-FREE ASSEMBLIES WITH NO-UNDERFILL AND CORNER-UNDERFILL Bankeem Chheda, S. Manian Ramkumar, Ph.D., and Reza Ghaffarian, Ph.D.  Purchase 
    THE CHALLENGES OF PACKAGE ON PACKAGE (POP) DEVICES DURING ASSEMBLY AND INSPECTION Bob Willis and David Bernard  Purchase 
    RELIABILITY INVESTIGATION of Sn/Cu/Ni SOLDER JOINTS Brian Roggeman, Ursula Marquez de Tino and Denis Barbini  Purchase 
    ENHANCING RELIABILITY OF PB-FREE SOLDER JOINTS IN AREA ARRAY PACKAGES Brian Toleno, Tom White, Rong Zhang, and Jeff Bowin  Purchase 
    THERMO-MECHANICAL SIMULATION AND OPTIMIZATION ANALYSIS FOR WARPAGE-INDUCED PBGA SOLDER JOINT FAILURES Caiying He, Ph.D. and Zuyao Liu, et al.  Purchase 
    IMBEDDED COMPONENT/DIE TECHNOLOGY (IC/DT®): IS IT READY FOR MAIN STREAM DESIGN APPLICATIONS? Casey H. Cooper, Mark T. McMeen, and Jim D. Raby  Purchase 
    MERGER AND ACQUISITION OPPORTUNITIES IN THE SOLAR ENERGY MARKET Chaim Lubin  Purchase 
    JOINT PROPERTIES OF Sn-3.5Ag SOLDER BALLS WITH SURFACE EMBEDDED CARBON NANOTUBE Chang-Woo Lee, Young-Ki Ko, Jung-Hwan Bang, and Sehoon Yoo  Purchase 
    CHALLENGES OF SOLDER BUMPING CAPACITIVE MICRO-MACHINED ULTRASONIC TRANSDUCER (cMUT) TRENCHED DEVICES Charles G. Woychik, et al.  Purchase 
    PACKAGING HIGH DENSITY CAPACTIVE MICRO-MACHINED ULTRASONIC TRANSDUCER (cMUT) SENSOR ARRAYS USING HYPERBGA TECHNOLOGY Charles G. Woychik, et al.  Purchase 
    THE COMING Charles S. Leech Jr.  Purchase 
    IMPLEMENTATION AND RELIABILITY ISSUES WITH LEAD-FREE SOLDERS Christopher Hunt  Purchase 
    LOW-SILVER BGA ASSEMBLY PHASE II – REFLOW CONSIDERATIONS AND JOINT HOMOGENEITY FOURTH REPORT: SENSITIVITY TO PROCESS VARIATIONS Chrys Shea, et al.  Purchase 
    OPTIMISING THE PRINT PROCESS FOR MIXED TECHNOLOGY Clive Ashmore, Mark Whitmore, and Simon Clasper  Purchase 
    DOES COPPER DISSOLUTION IMPACT THROUGH-HOLE SOLDER JOINT RELIABILITY? Craig Hamilton, et al.  Purchase 
    AN INDUSTRY UNITED TO FIGHT COUNTERFEITING. A COUNTERFEIT EEE PARTS SOLUTION Daniel DiMase and Phillip Zulueta  Purchase 
    ENVIRONMENTAL CHALLENGES TO CONVENTIONAL PTH METALLIZATION - A TIME FOR CHANGE? David H. Ormerod  Purchase 
    FALSE TIN WHISKERS: MASQUERADING TIN COPPER INTERMETALLICS David Hillman  Purchase 
    VIA RELIABILITY – A HOLISTIC PROCESS APPROACH David L. Wolf, Timothy A. Estes, and Ronald J. Rhodes  Purchase 
    EVALUATION OF HALOGEN-FREE LAMINATES USED IN HANDHELD ELECTRONICS David Lau, Laura J. Turbini, Julie Liu, and Y. Norman Zhou  Purchase 
    UNUSUAL CURE MECHANISMS OF THERMOSET EPOXY RESINS David R. Tyler, Sarah E. Brady, Indre Thiel, and Robert L. Hubbard  Purchase 
    FRACTURE TOUGHNESS OF VARIOUS PRINTED CIRCUIT BOARD SURFACE FINISHES SOLDERED WITH LEAD FREE SOLDER Dick Casali  Purchase 
    LATEST DEVELOPMENTS IN BUMPING TECHNOLOGIES FOR FLIP CHIP AND WLCSP PACKAGING Dionysios Manessis and Lars Böttcher,et al.  Purchase 
    STRENGTHENING YOUR DOWNSIZED DESIGN TEAMS THROUGH A STRONG PROTOTYPE PARTNER Duane Benson  Purchase 
    HEAD–AND–PILLOW SMT FAILURE MODES Dudi Amir, Raiyo Aspandiar, Scott Buttars, Wei Wei Chin, and Paramjeet Gill  Purchase 
    BEST PRACTICES REFLOW PROFILING FOR LEAD-FREE SMT ASSEMBLY Ed Briggs and Ron Lasky, Ph.D., PE  Purchase 
    THE PROLIFERATION OF LEAD-FREE ALLOYS Eric Bastow and Timothy Jensen  Purchase 
    AN IMMERSION SILVER PWB SURFACE FINISH TO COMBAT HARSH ENVIRONMENTS Ernest Long, Ph.D., John Swanson, and Lenora Toscano  Purchase 
    NEW SOLDER BUMPING TECHNOLOGY AND ADAPTED ASSEMBLY PROCESSES FOR 100 µm PITCH FLIP-CHIP-TECHNOLOGY USING CAPILLARY FLOW OR NO FLOW UNDERFILL Florian Schüßler, et al.  Purchase 
    INTRODUCTION OF A NEW PCB SURFACE FINISH FOR THE ELECTRONICS INDUSTRY Frank Ferdinandi  Purchase 
    CHARACTERIZING THE RELATIONSHIPS BETWEEN A SOLDER PASTE'S INGREDIENTS AND ITS PERFORMANCE ON THE ASSEMBLY LINE: HEAD-IN-PILLOW TESTING Frank Murch, Derrick Moyer, Krupali Patel, John McMaster, Steve Ratner, and Martin Lopez  Purchase 
    SUSTAINING A ROBUST FINE FEATURE PRINTING PROCESS George Babka, David Sbiroli, Chris Anglin and Richard Brooks  Purchase 
    RoHS – CHANGING PRODUCTS TO CONFORM TO THE NEW EUROPEAN UNION RoHS REGULATIONS George Galyon, et al.  Purchase 
    OVERCOMING REPAIR DEPOT CHALLENGES Greg Bannick  Purchase 
    iNEMI LEAD-FREE ALLOY ALTERNATIVES PROJECT REPORT: THERMAL FATIGUE EXPERIMENTS AND ALLOY TEST REQUIREMENTS Gregory Henshall, Ph.D., et al.  Purchase 
    EVALUATION OF EPOXIDE CONDUCTIVE ADHESIVES CONTAINING GRAPHITE NANO PLATELETS FILLERS Guilian Gao, Ph.D., et al.  Purchase 
    Pb-FREE ALLOY ALTERNATIVES: RELIABILITY INVESTIGATION H.-J. Albrecht, P. Frühauf, and K. Wilke  Purchase 
    REAL OR FAKE? THE COUNTERFEIT CHIP CONUNDRUM Hal Rotchadl  Purchase 
    BRIDGING SUPPLY CHAIN GAP FOR EXEMPT HIGH-RELIABILITY OEMs Hal Rotchadl  Purchase 
    THE DEVELOPMENT AND IMPLEMENTATION OF AN IMPROVED IMMERSION TIN PLATING PROCESS TIN-LEAD AND LEAD-FREE SOLDERING Hank Lajoie  Purchase 
    WHY SWITCH FROM PURE DI-WATER TO CHEMISTRY? Harald Wack, Ph.D., Umut Tosun, Joachim Becht Ph.D., and Helmut Schweigart, Ph.D.  Purchase 
    ASSEMBLY AND RELIABILITY ASSESSMENT OF FINE PITCH TMV PACKAGE ON PACKAGE (PoP) COMPONENTS Heather McCormick, Lee Smith, Jimmy Chow, Ahmer Syed, Corey Reichman and CJ Berry  Purchase 
    RELIABILITY ASSESSMENT OF REBALLED BGAs J. Li, et al.  Purchase 
    DESIGN AND PROCESS DEVELOPMENT FOR THE ASSEMBLY OF 01005 PASSIVE COMPONENTS J. Li, S. Poranki, R. Gallardo, M. Abtew, R. Kinyanjui, Ph.D., and K. Srihari, Ph.D.  Purchase 
    THE SOLDER JOINT RELIABILITY OF CONFORMAL COATED WLCSP COMPONENTS J. Salminen  Purchase 
    RoHS VS. REACH WHAT DOES THIS MEAN TO I/T HARDWARE COMPANIES AND DATA MANAGEMENT? Jackie Adams, et al.  Purchase 
    STRATEGIES FOR FIGHTING COUNTERFEIT ELECTRONICS PRODUCTS James R. Williams, Ph.D.  Purchase 
    INVESTIGATION AND DEVELOPMENT OF TIN-LEAD AND LEAD-FREE SOLDER PASTES TO REDUCE THE HEAD-IN-PILLOW COMPONENT SOLDERING DEFECT Jasbir Bath and Roberto Garcia, et al.  Purchase 
    CLOSED-FORM, STRAIN-ENERGY BASED ACCELERATION FACTORS FOR THERMAL CYCLING OF LEAD-FREE ASSEMBLIES Jean-Paul Clech, Gregory Henshall and Jian Miremadi  Purchase 
    SOLDER CHARGE SMT: THE DESIGN AND VALIDATION OF NEW SOLDER ATTACH TECHNOLOGIES Jim Hines, Kirk Peloza, Adam Stanczak and David Geiger  Purchase 
    NEXT GENERATION PoP PASTES FOR ELECTRONICS ASSEMBLY Jim Hisert and Brandon Judd  Purchase 
    THIN IMMERSION TIN USING ORGANIC METALS Jim Kenny, Nils Arendt, Bernhard Wessling, and Karl Wengenroth  Purchase 
    IN-PLACE TRACKING FOR TIN WHISKERS AND TIN DEPLETED AREAS AT DIFFERENT STRESS STATUS Jing Cheng, Ph.D. and Paul T. Vianco, Ph.D.  Purchase 
    TOMBSTONE CAPACITORS REVISITED, NOW DO WE NEED A PSL (PLATING SENSITIVITY LEVEL) SPECIFICATION FOR CHIP COMPONENTS John Maxwell and Chris England  Purchase 
    RAPID COMPANY TRANSFORMATION: LESSONS LEARNED IN REAL TIME John Walsh, Brian Maguire, and Steve Puente  Purchase 
    ALTERNATIVE ASSEMBLY OPTIONS TO ACHIEVE COST EFFECTIVE AND RELIABLE HANDHELD PRODUCTS Jonas Sjoberg and Andreas Morr  Purchase 
    INSPECTION TO IMPROVE LEAD-FREE SOLDER TECHNOLOGIES Kazuo Kawai  Purchase 
    ELECTROLESS Ni/ELECTROLESS Pd/IMMERSION Au/ELECTROLESS Au (ENEPIGEG) PLATING PROCESS FOR GOLD WIRE BONDING ON ORGANIC PACKAGE SUBSTRATES Kiyoshi Hasegawa, Yoshinori Ejiri, Takehisa Sakurai, and Yosiaki Tsubomatsu  Purchase 
    INNOVATIVE PACKAGE REALIZATION BY CHIP EMBEDDING TECHNOLOGIES Lars Boettcher, Dionysios Manessis, Stefan Karaszkiewicz, Andreas Ostmann, and Herbert Reichl  Purchase 
    ASSESSING RELIABILITY OF REBALLED BALL GRID ARRAY ASSEMBLIES UNDER TEMPERATURE CYCLING TEST Lei Nie, Michael Osterman, and Michael Pecht  Purchase 
    ON THE COMPLETE BREAKDOWN OF MINER'S RULE FOR LEAD FREE BGA JOINTS Linlin Yang, et al.  Purchase 
    A COMPARISON OF ELECTROLESS AND ELECTROPLATED Ni/Au UBM STRUCTURES FOR BOARD LEVEL RELIABILITY OF WLCSP DEVICES Luke England  Purchase 
    SOLDER JOINT RELIABILITY ANALYSIS AND TESTING OF A DUAL ROW QFN PACKAGE Luke England and Yong Liu  Purchase 
    EUROPEAN UNION RoHS EXEMPTION REVIEW CASE STUDY Marie Cole, et al.  Purchase 
    THROUGH-HOLE CONNECTOR REWORK USING CONVECTION HEATING Mark J. Walz and Michael Berry  Purchase 
    AWAKENING FROM HEAD-IN-PILLOW: A NOVEL PRE-PRODUCTION TEST METHOD FOR BGA NON-WET ISSUES Masato Shimamura, Tetsuya Okuno, Satoru Akita, and Derek Daily  Purchase 
    PROCESSING AND RELIABILITY OF LOW-SILVER-ALLOYS Mathias Nowottnick, Andrej Novikov and Joerg Trodler  Purchase 
    LEAD-FREE ASSEMBLY AND QUALIFICATION OF A STORAGE CLASS PCBA Matthew Kelly and Tom Truman, et al.  Purchase 
    SURFACE FINISH EFFECT ON RELIABILITY OF LEAD FREE ELECTRONIC ASSEMBLIES Michael Reid, Maurice N. Collins, Richard Coyle, and Jeff Punch  Purchase 
    STENCIL DESIGN GUIDELINES FOR ROBUST PRINTING PROCESSES IN ELECTRONICS PRODUCTION CONSIDERING STENCIL AND SOLDER PASTE SPECIFIC PROPERTIES Michael Roesch and Joerg Franke  Purchase 
    CLEANING FOR RELIABIILTY POST QFN REWORK Mike Bixenman, D. B. A. and Michael Konrad  Purchase 
    IONIC CLEANLINESS TESTING RESEARCH OF PRINTED WIRING BOARDS FOR PURPOSES OF PROCESS CONTROL Mike Bixenman, D.B.A., Ning-Chen Lee, Ph.D., and Steve Stach  Purchase 
    HALOGENS IN LEAD FREE SOLDER PASTE Mitch Holtzer and Michael Liberatore  Purchase 
    QUALIFICATION OF PWBs OUTSOURCED FROM ASIA Mumtaz Y. Bora  Purchase 
    NANOTECHNOLOGY FOR LEAD-FREE PWB FINAL FINISHES WITH THE ORGANIC METAL N. Arendt, B. Wessling, M. Thun, C. Arribas-Sanchez, S. Gleeson, J. Posdorfer, M. Rischka, and B. Zeysing  Purchase 
    FINE-PITCH QFN REWORK Neil O'Brien and Scott Kentner  Purchase 
    EFFECT OF STRUCTURAL DESIGN PARAMETERS ON WAFER LEVEL CSP BALL SHEAR STRENGTH: EXPERIMENTAL AND COMPUTATIONAL Nikhil Lakhkar and Dereje Agonafer  Purchase 
    LEAD-FREE FLUX TECHNOLOGY AND INFLUENCE ON CLEANING Ning-Cheng Lee, Ph.D.  Purchase 
    ON THERMAL PERFORMANCE OF A PLANAR MAGNETIC TRANSFORMER P. Razi, Ph.D. and Bob Roohparvar, Ph.D.  Purchase 
    THERMAL INTERFACE MATERIALS TESTING Paul Bratt  Purchase 
    ASSESSING DESIGN TRADEOFFS WITH A CUSTOMIZABLE AREA-ARRAY CONNECTOR Paul Chen, Dinesh Kalakkad, Ken Matsubayashi, Woody Maynard, and John Williams  Purchase 
    AUTOMATIC SOLDER PASTE PRINTER POSTIONAL FEEDBACK CONTROL Paul Haugen and Rita Mohanty, Ph.D.  Purchase 
    REWORKING THE LATEST HIGH TECHNOLOGY SMT PACKAGES: FUSIONQUAD™ PACK Paul Wood and Bill Rugg  Purchase 
    EFFECT OF DWELL TIME ON THE LIFE OF LEAD FREE BGA JOINTS IN THERMAL CYCLING Peter Borgesen, Emad Al-Momani and Michael Meilunas  Purchase 
    MODELS FOR PREDICTION OF SHOCK RELIABILITY FOR LEADFREE AREA-ARRAY COMPONENTS IN PORTABLE ELECTRONICS Pradeep Lall, et al.  Purchase 
    CONDUCTIVE ANODIC FILAMENT STUDY: LAMINATES AND Pb-FREE PROCESSING Randal L. Ternes  Purchase 
    SECOND GENERATION Pb-FREE ALLOYS Randy Schueller, Ph.D., Nathan Blattau, Ph.D., Joelle Arnold, and Craig Hillman, Ph.D.  Purchase 
    EFFECTS OF AN APPROPRIATE PCB LAYOUT AND SOLDERING NOZZLE DESIGN ON QUALITY AND COST STRUCTURE IN SELECTIVE SOLDERING PROCESSES Reiner Zoch and Christian Ott  Purchase 
    THERMAL FATIGUE PERFORMANCE OF A QUAD FLAT NO LEAD (QFN) PACKAGE ASSEMBLED WITH Sn-Ag-Cu (SAC) AND SnPb SOLDERS Richard Coyle and Heather McCormick, et al.  Purchase 
    DWELL TIME, MICROSTRUCTURAL DEPENDENCIES, AND THE INTERPRETATION OF THERMAL FATIGUE TEST DATA OF SnPb AND Pb-FREE SOLDERS Richard Coyle1, et al.  Purchase 
    QFN MANUFACTURING: CONFIGURATIONS, MATERIALS AND PROCESSES Richard Otte  Purchase 
    ADVANCES IN BROADBAND PRINTING Rita Mohanty, Ph.D. and Rick Love  Purchase 
    RECENT ADVANCES IN THE TECHNOLOGY OF CONTAMINANT ANALYSIS USING ENERGY DISPERSIVE X-RAY FLUORESCENCE Robert D. Johnson and Jun Seok Choi  Purchase 
    BOARD LEVEL RELIABILITY COMPARISON OF LEAD FREE ALLOYS Robert Darveaux, et al.  Purchase 
    WARPAGE REDUCTION FOR FLIP-CHIP UNDER-FILL ASSEMBLIES Robert L. Hubbard and Pierino Zappella  Purchase 
    COMPARISONS OF SAC FLIP CHIP BGA SOLDER JOINT RELIABILITY UNDER ACCELERATED TEMPERATURE CYCLING AND POWER CYCLING CONDITIONS Ron Zhang, Chirag Shah, and Stanley Pecavar  Purchase 
    DOCUMENTING FABRICATION FOR PCB SOURCING SUCCESS Russ Steiner  Purchase 
    PREVENTING DAMAGE TO MSD'S AND BARE BOARDS BEFORE AND DURING THE ASSEMBLY PROCESS THROUGH PROPER HANDLING AND STORAGE Russell McCarten, Kevin McCarten, and Jack Leonard  Purchase 
    NO-FLOW UNDERFILL VOID NUCLEATION STUDY IN HIGH, STABLE YIELD, AND NEAR VOID-FREE ASSEMBLY PROCESS DEVELOPMENT Sangil Lee and Daniel F. Baldwin, Ph.D.  Purchase 
    MONTE CARLO SIMULATION FOR SURFACE MOUNT ASSEMBLY HEAD AND PILLOW DEFECT PREDICTION Shijiang He, Gregorio Murtagian, Ph.D., and Fay Hua, Ph.D.  Purchase 
    iNEMI SOLDER PASTE DEPOSITION PROJECT – FIRST STAGE REVIEW OPTIMIZING SOLDER PASTE PRINTING FOR LARGE AND SMALL COMPONENTS Shoukai Zhang, et al.  Purchase 
    SCREENING FOR COUNTERFEIT ELECTRONIC COMPONENTS Stephen Schoppe, Glenn Robertson, and Fabian Morales  Purchase 
    HEAD-AND-PILLOW DEFECTS IN BGA SOCKETS Steve Vandervoort, Dudi Amir, Raiyo Aspandiara, Fay Hua, Bin Li, Gregorio Murtagian, and Rajen S. Sidhu  Purchase 
    HOW SANMINA-SCI DETERMINED ITS ALTERNATIVE ENERGIES STRATEGY Sundar M. Kamath, Ph.D.  Purchase 
    ADHESION STUDY OF NANO-PARTICLE SILVER TO ELECTRONICS PACKAGING MATERIALS Sungchul Joo and Daniel F. Baldwin, Ph.D.  Purchase 
    DEVELOPING A ROBUST OFFSHORE PROGRAM MANAGEMENT MODEL Susan Mucha  Purchase 
    THE SMALLER THE BETTER - SIMULTANEOUS ELECTROLYTIC SOLDER DEPOSITION ON BOTH SIDES OF A FINE-PITCH PACKAGE SUBSTRATE Sven Lamprecht, Hugh Roberts, Shozo Nishida, Fumio Aiki, Bernd Roelfs, Ph.D., Steven Kenny, and Kai-Jens Matejat  Purchase 
    JCAA/JG-PP LEAD-FREE SOLDER PROJECT: -20°C TO +80°C THERMAL CYCLE TEST Thomas A. Woodrow, Ph.D.  Purchase 
    ASSESSMENT OF WHISKER GROWTH FROM TIN COATED WIRE AND CABLE Thomas Lesniewski  Purchase 
    PRINTED CIRCUIT BOARD TECHNOLOGIES FOR THE REALIZATION OF STRETCHABLE ELECTRONIC SYSTEMS Thomas Löher, Ph.D., Manuel Seckel, Rene Vieroth, Andreas Ostmann and Herbert Reichl, Ph.D.  Purchase 
    DEVELOPING THE OPTIMUM REFLOW PROCESS: A MATTER OF COST AND QUALITY Ursula Marquez de Tino, Jon Silin, and Denis Barbini  Purchase 
    NOZZLE TECHNOLOGY FOR LEAD FREE SELECTIVE SOLDERING Ursula Marquez de Tino, Linlin Yang and Denis Barbini  Purchase 
    CONTROLLING THE ASSEMBLY PROCESS WITH THE USE OF SPC William Beair, Alton Moore, and Eric Gilley  Purchase 
    STENCIL CONSIDERATIONS FOR MINIATURE COMPONENTS William E. Coleman, Ph.D.  Purchase 
    SEALING THE GAP OF SOLDER PASTE TECHNOLOGY IN LEAD-FREE HALOGEN-FREE ERA Yan Liu, Ph.D., Runsheng Mao, Ph.D., Arnab Dasgupta, Ph.D., and Ning-Cheng Lee, Ph.D.  Purchase 
    ELECTROLESS Ni/Pd/Au PLATING FOR PACKAGE SUBSTRATES WITH FINE PITCH WIRING Yoshinori Ejiri, Takehisa Sakurai, Shuuichi Hatakeyama, Shigeharu Arike, and Kiyoshi Hasegawa  Purchase 
    PAD CRATER ASSESSMENT FOR A TELECOM SYSTEM PCBA Yunxia Xu, et al.  Purchase 
    HOW TO RESOLVE DEFECTS RELATED TO PAD DESIGN WITH THE AID OF NON-DESTRUCTIVE (X-RAY, SPI) AND DESTRUCTIVE METHODS (CROSS SECTION, SHEAR TEST) Zhen (Jane) Feng, Ph.D., et al.  Purchase 

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