SMTA China East Technical Conference 2008 Proceedings

While abstracts in the Knowledge Base are accessible to all visitors, the full articles (PDF format) are FREE FOR SMTA MEMBERS to download:

  • Already a member? Log in to download articles.
  • Not a member? Pay just $10 per article or become a member today!
  • < Back to Conferences List



    TITLE AUTHOR DOWNLOAD
    HALOGEN-FREE DEBATE ON SOLDERPASTE: IPC CLASSIFICATION AND APPLICATION Christine Poon, Audrey Long, James Wang  Purchase 
    HALOGEN-FREE DEBATE ON SOLDERPASTE: IPC CLASSIFICATION AND APPLICATION (CHINESE) Christine Poon, Audrey Long, James Wang  Purchase 
    RELIABILITY IMPACT OF COPPER-DOPED EUTECTIC TIN-LEAD BUMP AND ITS VOIDING UPON FLIP CHIP ASSEMBLIES David Ihms and Shing Yeh  Purchase 
    RELIABILITY IMPACT OF COPPER-DOPED EUTECTIC TIN-LEAD BUMP AND ITS VOIDING UPON FLIP CHIP ASSEMBLIES (CHINESE) David Ihms and Shing Yeh  Purchase 
    A Compliant and Creep Resistant SAC-Al(Ni) Alloy Dr. Benlih Huang, Dr. Hong-Sik Hwang, and Dr. Ning-Cheng Lee  Purchase 
    FUTURE LEAD-FREE SOLDER ALLOYS AND FLUXES – MEETING CHALLENGES OF MINIATURIZATION Dr. Ning-Cheng Lee  Purchase 
    Is it Really Impossible? Combining Superior Anti-Oxidation and Superior Print Dr. Ning-Cheng Lee  Purchase 
    EFFECT OF PROCESS VARIATIONS ON SOLDER JOINT RELIABILITY FOR NICKEL-BASED SURFACE FINISHES Hugh Roberts and Sven Lamprecht, et al.  Purchase 
    THE STUDY ON THE INTERFACIAL REACTION BETWEEN SNAGCU SOLDER AND NI(P)/AU, NI(P)/PD/AU UBMS Jui-Yun Tsai, Josef Gaida, Gerhard Steinberger and Albrecht Uhlig  Purchase 
    THE STUDY ON THE INTERFACIAL REACTION BETWEEN SNAGCU SOLDER AND NI(P)/AU, NI(P)/PD/AU UBMS (CHINESE) Jui-Yun Tsai, Josef Gaida, Gerhard Steinberger and Albrecht Uhlig  Purchase 
    Solder Micro-Bumping for 3D SiP and FlipChip Extended Abstract Klaus Ruhmer and David Hawken, et al.  Purchase 
    SMT BALLING TECHNOLOGY (CHINESE) May Yan, R SIVAM V RAJOO  Purchase 
    DEFECT STRUCTURE AND FAILURE MECHANISM OF PTH ELECTRODEPOSITS Tu Yunhua, Liu Sang, Sun Xiaoyan, Ju Yuandao  Purchase 
    DEFECT STRUCTURE AND FAILURE MECHANISM OF PTH ELECTRODEPOSITS (CHINESE) Tu Yunhua, Liu Sang, Sun Xiaoyan, Ju Yuandao  Purchase 
    MANAGING ELECTRONICS MANAUFACTURING BUSINESS IN CHINA Wei Koh, PhD, BraveWang  Purchase 
    MANAGING ELECTRONICS MANAUFACTURING BUSINESS IN CHINA (CHINESE) Wei Koh, PhD, BraveWang  Purchase 

    SMTA Headquarters
    6600 City West Parkway, Suite 300
    Eden Prairie, MN 55344

    Phone 952.920.7682
    Fax 952.926.1819
    Home
    Site Map
    Update Your Info
    Related Links
    Send Us Feedback
    Contact Us
    Privacy Policy
    ↑ Top