International Wafer-Level Packaging Conference 2008 Proceedings

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    TITLE AUTHOR DOWNLOAD
    WLCSP PRODUCTION USING ELECTROLESS Ni/Au PLATING AND WAFER LEVEL SOLDER SPHERE TRANSFER TECHNOLOGY Andrew Strandjord, et al.  Purchase 
    3D DETECTOR TECHNOLOGY– WAFER BONDING AND DEEP REACTIVE ION ETCHING Angela Kok, et al.  Purchase 
    µPILR EMBEDDED PACKAGE TECHNOLOGY FOR MOBILE APPLICATIONS Carl Ryu, et al.  Purchase 
    VAPOR PHASE VS. CONVECTION REFLOW IN RoHS-COMPLIANT ASSEMBLY Chris Munroe  Purchase 
    VIAS LAST TECHNOLOGY FOR CMOS IMAGE SENSORS: PRESENTATION OF DESIGN RULES AND TECHNOLOGY David Henry, et al.  Purchase 
    A MARKET & TECHNOLOGY ANALYSIS OF WLP SOLUTION FOR ICs, CMOS IMAGE SENSORS & MEMS Eric Mounier, Ph.D., Jérôme Baron, and Jean-Christophe Eloy  Purchase 
    3D-WLCSP PACKAGE TECHNOLOGY: TECHNOLOGY AND DESIGN CONSIDERATIONS Eugene A. Stout, et al.  Purchase 
    WLCSP: CHALLENGES, PERFORMANCES AND TRENDS: KEY PARAMETERS INFLUENCING THE BOARD LEVEL RELIABILITY OF WLCSP Franck Dosseul, et al.  Purchase 
    APPLICATION OF Ni/Pd/Au SURFACE FINISHED SUBSTRATE FOR CHIP-SCALE PACKAGING AND ITS DROP TEST PERFORMANCE Geun Sik Kim, et al.  Purchase 
    COST REDUCTION OF WAFER LEVEL PACKAGING BY USING ESTABLISHED MATERIALS FROM NON-ELECTRONICS INDUSTRIES Giles Humpston  Purchase 
    LOW-COST COMPLIANT WAFER LEVEL PACKAGE TECHNOLOGY Guilian Gao, Kenneth Honer, and Charles Rosenstein  Purchase 
    RF CMOS CIRCUITS WITH WAFER-LEVEL PACKAGING INDUCTORS Hideki Hatakeyama, et al.  Purchase 
    A BASELINE STUDY ON THE PERFORMANCE OF STENCIL AND SCREEN PRINT PROCESSES FOR WAFER BACKSIDE COATING Jeff Schake  Purchase 
    NIR IMAGING OF BOND INTEGRITY FOR WAFER BONDING APPLICATIONS Jeremy McCutcheon, Louis McCarthy, and JoElle Dachsteiner  Purchase 
    METROLOGY IN WAFER-LEVEL MICROSPHERE PROCESSES Jim Hisert, Jeff Schake, and Paul Flynn  Purchase 
    NANOSPRAY – A NEW DEPOSITION METHOD FOR ISOLATING LAYERS FOR 3D TSV APPLICATIONS Johanna Bartel, et al.  Purchase 
    3D CHIP PACKAGING FOR CLASS I MEDICAL DEVICES John Dzarnoski, Ph.D. and Doug Link  Purchase 
    LITHOGRAPHIC CHALLENGES AND SOLUTIONS FOR 3D INTERCONNECT Keith Cooper, et al.  Purchase 
    SAPPHIRE WAFER-BASED WAFER-LEVEL CHIP SCALE PACKAGE TYPE HIGH POWER LIGHT-EMITTING DIODE Kwang Cheol Lee  Purchase 
    HIGH RATE ETCHING OF THROUGH SILICON VIAS FOR PACKAGING Leslie M. Lea  Purchase 
    HIGHLY IONIZED SPUTTERING FOR HIGH ASPECT RATIO THROUGH WAFER METALLIZATION M. Elghazzali, et al.  Purchase 
    INNOVATIVE FRONT TO BACK ALIGNMENT TECHNOLOGY FOR MEETING 3D PACKAGING REQUIREMENTS OF LEADING EDGE CONSUMER PRODUCTS Manish Ranjan, Emily True, and Andrew M. Hawryluk  Purchase 
    3D WAFER LEVEL PACKAGING TECHNOLOGY FOR CIS APPLICATIONS Marc Robinson  Purchase 
    TSV THINNED WAFER DEBONDING PROCESS OPTIMIZATION Mark Privett, et al.  Purchase 
    ALTERNATIVE METALIZATION TECHNOLOGIES FOR FLEXIBLE CIRCUITS AND DIFFICULT TO METALIZE SUBSTRATES Michael Carano  Purchase 
    VECTORED JETS IMPROVE CLEANING OF MICRO-ARRAY IC PACKAGES Mike Bixenman, DBA and Steve Stach  Purchase 
    INTEGRATED TESTING, MODELING AND FAILURE ANALYSIS OF CSPnl FOR ENHANCED BOARD LEVEL RELIABILITY Rex Anderson, et al.  Purchase 
    SEMICONDUCTOR PACKAGING SOLUTIONS UTILIZING FINE POWDER SOLDER PASTE Rick Lathrop  Purchase 
    NON-CAPILLARY PROTECTION OPTIONS FOR WLCSPs Russell Stapleton, Ph.D.  Purchase 
    METAL BASED WAFER LEVEL PACKAGING Shari Farrens, Ph.D.  Purchase 
    CMOS COMPATIBLE ELECTROLESS PLATING PROCESS FOR UNDER BUMP METALLIZATION Shigeo Hashimoto and Don Gudeczauskas, et al.  Purchase 
    SOLAR INTEGRATION TAKES A PAGE FROM THE SEMI WAFER CSP PLAYBOOK Steve T. Cho, Ph.D. and Steve Anderson  Purchase 
    INFRASTRUCTURE BUILDING FOR EMBEDDED DIE PRINTED WIRING BOARD APPLICATIONS Theodore G. Tessier, et al.  Purchase 

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