Pan Pacific Symposium 2009 Proceedings

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    TITLE AUTHOR DOWNLOAD
    APPLICATION OF REVERSE LOGISTICS TO FAILURE ANALYSIS OF ELECTRONIC PRODUCTS A. Gandelli and A. Caliri  Purchase 
    JETTING FLUIDS IN A WIDE VARIETY OF NEW ELECTRONIC AND SEMICONDUCTOR NON-TRADITIONAL PACKAGING AND ASSEMBLY APPLICATIONS Alec J. Babiarz  Purchase 
    A NOVEL MULTI-LAYER PATCH CONFIGURATION FOR MULTI-BAND REFLECTARRAY ANTENNAS Andrea Pirisi, et al.  Purchase 
    COLUMN GRID ARRAY REWORK FOR HIGH RELIABILITY Atul C. Mehta and Charles C. Bodie  Purchase 
    RESOLUTION OF SOLDER VOIDS IN PIN-IN-HOLE PRODUCT Condia Yu, et al.  Purchase 
    HEAVY THERMAL LOAD PB-FREE WAVE SOLDERING – GETTING TOP HOLE FILLETS WITH +3 OZ. COPPER PLANES Corey Peterson and Jeff Kennedy  Purchase 
    RELIABILITY ASSESSMENT OF ALTERNATIVE LEAD-FREE ALLOYS USED DURING WAVE AND REWORK Craig Hamilton, et al.  Purchase 
    ON THE USE OF 3 THERMOCOUPLES TO VERIFY A PRINTED CIRCUIT BOARD PROFILE DURING THE REFLOW OPERATION Daryl L. Santos, Arun Ramasubramanian, and Laurence A. Harvilchuck  Purchase 
    A HYBRID APPROACH FOR ENERGY OPTIMIZATION OF WIRELESS SENSOR NETWORK DEVICES Davide Caputo, et al.  Purchase 
    QUALITY ASSURANCE OF STACKED COMPONENTS USING QUICKSCAN Friedhelm W. Maur  Purchase 
    PLANNING AND IMPLEMENTING A SUCCESSFUL BOX BUILD, A PROCESS FMEA IMPLEMENTATION Haans Petruschke and Roy Starks  Purchase 
    ELECTROSTATIC DISCHARGE (ESD) AND THE REQUIREMENTS FOR PERSONNEL AND MACHINES Hartmut Berndt  Purchase 
    AREA ARRAY CONNNECTORS: TRANSITION TO LEAD-FREE Heather McCormick, et al.  Purchase 
    PoP (PACKAGE ON PACKAGE): AN EMS PERSPECTIVE ON ASSEMBLY, REWORK AND RELIABILITY Heather McCormick, et al.  Purchase 
    DEVELOPMENT AND CHARACTERISATION OF METAL COATED POLYMER BALLS FOR CSP APPLICATION Helge Kristiansen, et al.  Purchase 
    DEVELOPMENT OF LOW MODULUS CONDUCTIVE ADHESIVES FOR MEMS INTERCONNECTS Helge Kristiansen, et al.  Purchase 
    A NOVEL FLEXIBLE SILVER PASTE ENABLES THIN FILM PHOTOVOLTAIC FLEX SOLAR CELLS Hong-Sik Hwang, Ph.D., Lee Kresge, James Slattery, and Ning-Cheng Lee, Ph.D.  Purchase 
    PERFORMANCE EVALUATIONS OF SURFACE FINISH AND SOLDER ALLOY CONFIGURATIONS FOR BGA SOLDER JOINT RELIABILITY Hugh Roberts, et al.  Purchase 
    PERFORMANCE COMPARISON OF ADVANCED SUBSTRATE TECHNOLOGIES FOR HIGH SPEED NETWORKING APPLICATIONS John Savic, et al.  Purchase 
    STUDY OF APPLICATION AND RELIABILITY OF LOW MELTING POINT Sn-Zn-Bi-In-P SYSTEM LEAD-FREE ALLOYS Jusheng Ma  Purchase 
    SAW SINGULATION OPTIMIZATION FOR THIN MOLD-LESS PACKAGE APPLICATION IN SMT ENVIRONMENT Jusszuraini Bin Hashim, Osman Ahmad, and Teng Hoon Ng  Purchase 
    THE EFFECT OF VARIATIONS IN THE SILVER LEVEL AND MICROALLOYING ON THE IMPACT STRENGTH OF TIN-SILVER-COPPER BGA SPHERES Keith Sweatman, Shoichi Suenaga, Masuo Koshi, and Tetsuro Nishimura  Purchase 
    STUDIES ON SOLDER ELECTOMIGRATION IN LEAD-FREE FLIP CHIP JOINT SYSTEM Kimihiro Yamanaka, Takafumi Ooyoshi, Takayuki Nejime, and Yutaka Tsukada  Purchase 
    DATA STORAGE SYSTEM DESIGN: BEST PRACTICES FOR INDUSTRY (FOCUSING ON RoHS-TYPE LEGISLATION) Krista Botsford  Purchase 
    ECO-COMPLIANCE: WHAT, WHEN, & WHY FOCUSING ON EUROPEAN UNION AND CHINA Krista Botsford  Purchase 
    IMPACT OF PCB PAD SITE DRESS METHODS ON PAD ARRAY DAMAGE Laurence A. Harvilchuck, et al.  Purchase 
    COUNTERFEIT ELECTRONICS: THREATS, RISKS AND PREVENTION PRACTICES Lev Shapiro, M.Sc. E.E.  Purchase 
    3D INTEGRATION – FUTURE PERSPECTIVES M. Juergen Wolf, Peter Ramm, and Herbert Reichl  Purchase 
    3D-LSI TECHNOLOGY FOR THE IMAGE SENSOR DEVICES Makoto Motoyoshi, Hirofumi Nakamura, and Manabu Bonkohara  Purchase 
    STRAIN GAGE TESTING: THE DELTA EFFECT OF THERMAL CYCLE TESTING Mark T. McMeen  Purchase 
    LEAD-FREE ASSEMBLY OF SERVER CLASS PCBAs: QUALIFICATION TRIAL RESULTS Matthew Kelly, Marie Cole, Jim Wilcox, and David Braun  Purchase 
    PROGNOSTICS-BASED PRODUCT QUALIFICATION Michael Pecht and Jie Gu  Purchase 
    LEADING THE GLOBALLY INTEGRATED ELECTRONIC ASSEMBLY ORGANIZATION Mike Bixenman, DBA  Purchase 
    THE ULTIMATE ADHESION ENHANCEMENT PROCESS FOR MSL IMPROVEMENT Olaf Kurtz, et al.  Purchase 
    IMPLEMENTATION OF 01005s: A CASE STUDY Paul N. Houston, Gary L. Turpin, and Daniel F. Baldwin, Ph.D.  Purchase 
    COST EFFECTIVE COPPER iTSV INTEGRATION Paul Siblerud  Purchase 
    EFFECTS OF STORAGE PROCEDURES AND BAKE OUT ON THE SOLDERABILITY OF IMMERSION SILVER-COATED PRINTED CIRCUIT BOARDS Paul Vianco, et al.  Purchase 
    HIGH PERFORMANCE THERMAL INTERFACE MATERIALS AND RELIABILITY IN ELECTRONIC ASSEMBLY Radesh Jewram  Purchase 
    SYSTEM-ON-WAFER BY 3D ALL SILICON SYSTEMS TECHNOLOGY Rao Tummala, et al.  Purchase 
    DOE FOR PROCESS VALIDATION INVOLVING NUMEROUS ASSEMBLY MATERIALS AND TEST METHODS Renee Michalkiewicz, Gaylon Morris, and Simin Bagheri  Purchase 
    NEXT LEVEL REQUIREMENTS FOR ULTRA FINE PITCH PRINTING Richard Brooks, John Carr, and Marty Carr  Purchase 
    ADVANCED ELECTRODEPOSITION TECHNOLOGIES FOR 3D INTEGRATION Rozalia Beica and Paul Siblerud  Purchase 
    SOLDER JOINT MICROSTRUCTURE AND RELIABILITY STUDY OF PLASTIC BALL GRID ARRAY (PBGA196) AND MICRO LEAD FRAME (MLF20) COMPONENTS IN LEAD FREE PROCESSES S. Bagheri, et al.  Purchase 
    QUALITY AND RELIABILITY TESTING OF CIRCUIT BOARDS ASSEMBLED WITH LEAD FREE COMPONENTS, FINISHES, SOLDERING MATERIALS AND PROCESSES IN SIMULATED PRODUCTION CONDITIONS Sammy Shina, Ph.D., et al.  Purchase 
    COPPER ELECTROPLATING PROCESS FOR NEXT GENERATION CORE THROUGH-VIA FILLING Stephen Kenny and Bernd Roelfs  Purchase 
    DEVELOPING A REFLOW PROCESS FOR Sn/Cu/Ni SOLDER PASTE Ursula Marquez de Tino, et al.  Purchase 
    WETTABLE VS. NON-WETTABLE NOZZLES FOR LEAD FREE SELECTIVE SOLDERING Ursula Marquez de Tino, Linlin Yang, and Denis Barbini  Purchase 
    SUPER HIGH DENSITY TWO METAL LAYER ULTRA-THIN ORGANIC SUBSTRATES FOR NEXT GENERATION SYSTEM-ON-PACKAGE (SOP), Venky Sundaram, et al.  Purchase 
    STUDY OF METHODS FOR ACCELERATING ELECTROCHEMICAL MIGRATION TEST Wataru Urano, et al.  Purchase 
    SOLID-STATE DRIVE (SSD) TECHNOLOGY AND MARKET TRENDS Wei Koh, Ph.D.  Purchase 
    TOWARDS THE DEVELOPMENT OF PHOTORESIST PROCESSING FOR CONTINUOUS ROLL-TO-ROLL FLEXIBLE ELECTRONICS Xiaozhe Hu, et al.  Purchase 
    SOCKET RELIABILITY OF HIGH-SPEED BGA PACKAGES Yu-Jung Huang, Ming-Kun Chen, and Shen-Li Fu  Purchase 

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