International Conference on Soldering & Reliability 2008 Proceedings

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    TITLE AUTHOR DOWNLOAD
    CHARACTERISTICS OF Sn-Ag-Cu-In QUATERNARY SOLDER COMPOSITIONS AND RELIABILITY EVALUATION OF THE SOLDER JOINTS A-Mi Yu, et al.  Purchase 
    THE CHEMICAL NATURE OF BROMIDE-CONTAINING CONDUCTIVE ANODIC FILAMENT A. Caputo, L.J. Turbini, and D.D. Perovic  Purchase 
    NANOSOLDER – WHAT NEXT? Alan Rae  Purchase 
    LEAD FREE MATERIAL AND PROCESS RE-QUALIFICATION FOR A RUGGED HANDHELD TERMINAL André Gagné and Dan Meringer  Purchase 
    ATTEMPTS TO CONSISTENTLY FORM VOIDS Bev Christian, Graeme Williams and Andrew Michael  Purchase 
    CORRELATION OF WETTING FORCES AND SOLDER SPREAD FOR CONDITIONED ENIG CIRCUIT BOARDS Bev Christian, Ph.D., and Matthew Stevens  Purchase 
    FINE POWDER SOLDER PASTES: STENCIL PRINTING AND REFLOW IN LEAD-FREE ASSEMBLY Chris Anglin, Ed Briggs, Tim Jensen, and Ron Lasky  Purchase 
    LOW-SILVER BGA ASSEMBLY PHASE I – REFLOW CONSIDERATIONS AND JOINT HOMOGENEITY - INITIAL REPORT Chrys Shea, et al.  Purchase 
    A STUDY OF THE PROCESS PERFORMANCE OF ALTERNATIVE LEAD FREE WAVE ALLOYS Craig Hamilton and Matthew Kelly  Purchase 
    SOLDER JOINT INTEGRITY IMPACT OF IMMERSION SILVER SURFACE FINISH THICKNESS FOR TIN/LEAD AND LEAD-FREE SOLDER PROCESSES David Hillman, Jon Soole, and Ross Wilcoxon  Purchase 
    LGA VS. CSP: A COMPARISON IN VARIOUS LEAD FREE APPLICATIONS Heather McCormick, et al.  Purchase 
    BROMINATED FLAME RETARDANT (BFR) AND POLYVINYL CHLORIDE (PVC) FREE MATERIAL EVALUATION REQUIREMENTS Helen Holder and Michael Roesch  Purchase 
    BUILDING A GLOBAL TECHNOLOGICALLY EFFICIENT SUPPLY CHAIN Jackie A. Adams, et al.  Purchase 
    Pb-Free Failure Analysis Case Studies – An EMS Perspective Jason Bragg  Purchase 
    RELATIONSHIP BETWEEN THE IMPACT STRENGTH AND MICROSTRUCTURE OF LEAD-FREE SOLDERS Keith Sweatman, et al.  Purchase 
    MICROSTRUCTURES RESULTING FROM THE USE OF SOLDER BALLS OF ONE COMPOSITION WITH PASTE OF A DIFFERENT COMPOSITION ON A COPPER SUBSTRATE L. Snugovsky, et al.  Purchase 
    SOLDER-DIRECTED SELF-ASSEMBLY BY DIFFERENT-MELTING-POINTS AND CAPILLARY FORCES FOR HIGHLY-INTEGRATED MICROELECTRONICS/MEMS SYSTEMS Mei Liu and Jun Yang  Purchase 
    QUANTIFYING CLEANING RELEVANCE WHEN MANUFACTURING LEAD-FREE PRINTED CIRCUIT BOARD ASSEMBLIES Mike Bixenman, DBA  Purchase 
    A COMPARATIVE RELIABILITY STUDY OF MICROECLECTRONICS WITH RESPECT TO HALT AND VIBRATION Mustafa A. Naviwala and Jacob Kremer  Purchase 
    TWO METHODS OF EVALUATING A PRINTED WIRING BOARD'S DIELECTRIC PERFORMANCE IN A LEAD FREE ASSEMBLY ENVIRONMENT Paul Reid  Purchase 
    WHISKER GROWTH ON SAC SOLDER JOINTS: MICROSTRUCTURE ANALYSIS Polina Snugovsky, Zohreh Bagheri, and Marianne Romansky  Purchase 
    ANALYZING AND PREDICTING ELECTROCHEMICAL MIGRATION FAILURES ON FIELD FAILURE RETURNS Renee J. Michalkiewicz  Purchase 
    PIN TRANSFERABILITY TESTING OF DIPPABLE SOLDER PASTE FORMULATIONS Rick Lathrop  Purchase 
    SOLDER JOINT RELIABILITY OF DIFFERENT BGAs REWORKED USING LOW MELTING POINT LEAD FREE ALLOYS Simin Bagheri, et al.  Purchase 
    FRACTURE BEHAVIOR OF A LEAD-FREE SOLDER/Cu JOINT SYSTEM Siva P. V. Nadimpalli and Jan K. Spelt  Purchase 
    ANOTHER LOOK AT LEAD-FREE SOLDER JOINT RELIABILITY UNDER RANDOM VIBRATION Stephen Bracht, Aghavni Ball, and Lisa Salerno  Purchase 
    METHOD FOR AUTOMATED NONDESTRUCTIVE ANALYSIS OF FLIP CHIP UNDERFILL Steven R. Martell, Ameya Mandlik, and Kieren Mercer  Purchase 
    Pb-Free Alloy Proliferation Project Thilo Sack  Purchase 
    IMPACT OF SOLDERING ATMOSPHERE ON SOLDER JOINT FORMATION Ursula Marquez de Tino, et al.  Purchase 

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