Pan Pacific Symposium 2008 Proceedings

While abstracts in the Knowledge Base are accessible to all visitors, the full articles (PDF format) are FREE FOR SMTA MEMBERS to download:

  • Already a member? Log in to download articles.
  • Not a member? Pay just $10 per article or become a member today!
  • < Back to Conferences List



    TITLE AUTHOR DOWNLOAD
    SHAPE ANALYSIS AND EFFICIENCY OF ARRAYS OF MICROSTRIP PATCH ANTENNAS FOR WIRELESS SENSOR NETWORKS A. Gandelli, D. Monopoli, A. Pirisi and R. E. Zich  Purchase 
    THERMAL MANAGEMENT OF DISK DRIVES USING SILICONE-FREE THERMAL INTERFACE MATERIALS Bill Rugg, Radesh Jewram and Sanjay Misra  Purchase 
    PROCESS AND ASSEMBLY METHODS FOR INCREASED YIELD OF PACKAGE ON PACKAGE DEVICES Brian Toleno, Ph.D. and Dan Maslyk  Purchase 
    RELIEVING Sn WHISKER GROWTH DRIVEN BY OXIDATION ON Cu LEADFRAME BY ANNEALING AND REFLOWING TREATMENTS C. C. Wei, et al.  Purchase 
    THE INFLUENCE OF THE PWB FABRICATION ELECTRODEPOSITION PROCESS ON COPPER EROSION DURING WAVE SOLDERING Chrys Shea and Jim Kenny, et al.  Purchase 
    A STUDY OF 0201’S AND TOMBSTONING IN LEAD-FREE SYSTEMS Chrys Shea and Prashant Chouta, et al.  Purchase 
    DESIGN AND OPTIMIZATION OF A MULTILAYER SHIELD OF DIELECTRIC D. Monopoli, M. Mussetta, A. Gandelli and R. Zich  Purchase 
    DEVELOPMENT STATUS OF AN OCCAM ELECTRONIC ASSEMBLY METHOD Edward S. Binkley, Ph. D. and Richard F. Otte  Purchase 
    EFFECTS OF STORAGE ENVIRONMENTS ON THE SOLDERABILITY OF NICKEL-PALLADIUM-GOLD FINISH WITH Pb-BASED AND Pb-FREE SOLDERS Edwin Lopez, Paul Vianco, Samuel Lucero, and Carly George  Purchase 
    MARKET DRIVERS AND COST ANALYSIS FOR 3D TSV Eric Mounier, Ph.D., Jérôme Baron, and Jean-Christophe Eloy  Purchase 
    HDI VIA ARCHITECTURE EFFECT ON SIP DESIGN FLEXIBILITY AND CONSTRAINTS Happy Holden  Purchase 
    ELECTROSTATIC DISCHARGE (ESD) AND THE TECHNOLOGY ROADMAP TO 2020 Hartmut Berndt  Purchase 
    PACKAGING SUBSTRATE TECHNOLOGIES TREND IN JAPAN Henry H. Utsunomiya  Purchase 
    SILICONE-PHOSPHOR ENCAPSULATION FOR HIGH POWER WHITE LEDs Horatio Quinones, Brian Sawatzky, and Alec Babiarz  Purchase 
    EXPERIMENTAL APPROACH TO ANALYZE FAILURE SITE CONDITION IN FINAL TESTING OF BGA PACKAGE Hsiang-Chen Hsu, Ming-Kun Chen, Yu-Jung Huang, and Shen-Li Fu  Purchase 
    EFFECT OF PROCESS VARIATIONS ON SOLDER JOINT RELIABILITY FOR NICKEL-BASED SURFACE FINISHES Hugh Roberts and Sven Lamprecht, et al.  Purchase 
    SUB-10µm LINE/SPACE TECHNOLOGY ON ORGANIC SUBSTRATES FOR NEXT GENERATION SYSTEM-ON-PACKAGE (SOP) AND FLIP-CHIP PACKAGING Hugh Roberts and Venky Sundaram, et al.  Purchase 
    DEVELOPMENT OF ALGORITHM AND CALCULATION TOOL FOR VISCO-ELASTIC PACKAGE WARPAGE Ichiro Hirata, Ph. D.  Purchase 
    UPDATE ON THE EVALUATION OF STACKED DIE PACKAGES USING ACOUSTIC MICRO IMAGING Janet E. Semmens  Purchase 
    EVALUATING THE MANUFACTURABILITY AND OPERATIONAL COSTS FOR NEW CONFORMAL COATING PROCESSES Jason Keeping, P. Eng.  Purchase 
    SURFACE MOUNT ASSEMBLY CHALLENGES FOR HIGH DENSITY POP (PACKAGE-ON-PACKAGE) UTILIZING SOP (SOLDER-ON-PAD) TECHNOLOGY Joanna Kristine Wildhart and Moody Dreiza  Purchase 
    SOLDERLESS ASSEMBLY AND INTERCONNECTION OF ELECTRONIC PACKAGES Joseph Fjelstad  Purchase 
    ADVANCED DRAM Si AND PACKAGING TECHNOLOGY STATUS AND FUTURE DIRECTIONS Jung H. Yoon, Ph. D.  Purchase 
    A STUDY OF SOLDERING TIP LIFE ON LEAD-FREE ALLOYS Juthathip Fangkangwanwong, Jareerat Jintana, Jarinee Ketui, and Teng Hoon Ng  Purchase 
    STRENGTH OF LEAD-FREE BGA SPHERES IN HIGH SPEED LOADING Keith Sweatman, Shoichi Suenaga, and Tetsuro Nishimura  Purchase 
    MEMBRANE TYPE PRESSURE SENSITIVE SENSOR Kiwako Ohmori, et al.  Purchase 
    NOVEL WAFER LEVEL PACKAGES USING ANISOTROPIC CONDUCTIVE ADHESIVES (ACPs) AND NCPs FOR FLIP-CHIP ASSEMBLY ON ORGANIC SUBSTRATES Kyung-Wook Paik, Il Kim, Ho-Young Son, and Chang-Kyu Chung  Purchase 
    TECHNOLOGIES FOR 3D HETEROGENEOUS INTEGRATION M. Juergen Wolf, Peter Ramm, and Herbert Reichl  Purchase 
    VIBRATION SENSOR FOR WIRELESS CONDITION MONITORING Maaike M. V. Taklo, et al.  Purchase 
    DATA ANALYSIS APPROACH FOR SYSTEM RELIABILITY, DIAGNOSTICS AND PROGNOSTICS Michael Pecht and Sachin Kumar  Purchase 
    METHODOLOGY TO CHARACTERIZE PAD CRATERING UNDER BGA PADS IN PRINTED CIRCUIT BOARDS Mudasir Ahmad, David Senk, and Jennifer Burlingame  Purchase 
    LEAN MANUFACTURING - ITS IMPACT ON SUPPLY CHAIN Nick Misra  Purchase 
    A NOVEL NANO SMT APPROACH FOR WLSOP P. Markondeya Raj, Gopal Jha, Gaurav Mehrotra, Janagama Goud, Mahadevan Iyer and Rao Tummala  Purchase 
    COST EFFECTIVE COPPER TSV INTERCONNECT INTEGRATION Paul Siblerud  Purchase 
    IMPROVEMENTS TO THROUGH SILICON VIAS, OR TSVs Phil Marcoux  Purchase 
    ANALYZING AND PREDICTING ELECTROCHEMICAL MIGRATION FAILURES ON FIELD FAILURE RETURNS Renee J. Michalkiewicz  Purchase 
    BGA COPLANARITY REDUCTION DURING THE BALL ATTACH PROCESS Rick Lathrop  Purchase 
    ELECTRICAL AND THERMAL INTERFACE MATERIALS Rob Emery and Tanawan Chaowasakoo  Purchase 
    THE SCIENCE AND ENGINEERING WORKFORCE AND NATIONAL SECURITY Robert A. Kavetsky, et al.  Purchase 
    FULL METAL TIMs Ross Berntson  Purchase 
    EFFECT OF THICKNESS OF UNDER-BUMP-METALLIZATION ON THE ELECTROMIGRATION LIFETIME OF FLIP-CHIP SOLDER JOINTS S. W. Liang and Chih Chen  Purchase 
    PRECISION WAFER TO WAFER PACKAGING USING EUTECTIC METAL BONDING Shari Farrens, Ph.D.  Purchase 
    NEW METHODS FOR EVALUATING THE CLEANLINESS BENEATH LOW STANDOFF DEVICES Thomas M. Forsythe  Purchase 
    NOVEL LEADFRAME-BASED PACKAGE PROVIDES PERFORMANCE BOOST FOR HARD DISK DRIVE DATA TRANSFER PERFORMANCE Tim Olson and Bill Rugg  Purchase 
    LIFE-TEST STATISTICS FOR SMALL SAMPLE SIZES Tom Clifford  Purchase 
    EMBEDDED PASSIVES -- UNIFORMITY AND RELIABILITY Tom Clifford and Melissa Lau  Purchase 
    DEFECT STRUCTURE AND FAILURE MECHANISM OF PTH ELECTRODEPOSITS Tu Yunhua, Liu Sang, Sun Xiaoyan, and Ju Yuandao  Purchase 
    IMPACT OF SOLDERING ATMOSPHERE ON SOLDER JOINT FORMATION Ursula Marquez de Tino and Denis Barbini, et. al  Purchase 
    µPILR™ PACKAGE PLATFORM- A HIGHER DENSITY PACKAGE-ONPACKAGE INNOVATION FOR NEXT GENERATION ELECTRONICS Vern Solberg  Purchase 
    MANAGING ELECTRONICS MANUFACTURING BUSINESS IN CHINA Wei Koh, Ph. D.  Purchase 
    APPLY MES INTO PCBA MANUFACTURING SHOP FLOOR FOUNDATION OF ADVANCED PRODUCTION MODEL Zhu Jian and Ma Wei  Purchase 

    SMTA Headquarters
    6600 City West Parkway, Suite 300
    Eden Prairie, MN 55344

    Phone 952.920.7682
    Fax 952.926.1819
    Home
    Site Map
    Update Your Info
    Related Links
    Send Us Feedback
    Contact Us
    Privacy Policy
    ↑ Top