NEPCON Shanghai Proceedings

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    TITLE AUTHOR DOWNLOAD
    Through-Silicon-Via Copper Filling for 3D Chip Integration Bioh Kim and Michael Go  Purchase 
    DISPENSING PROCESSES FOR UNDERFILL OF PoP Brad Perkins, Alan Lewis, China Team Member  Purchase 
    DISPENSING PROCESSES FOR UNDERFILL OF PoP (CHINESE) Brad Perkins, Alan Lewis, China Team Member  Purchase 
    A UNIQUE PROCESS THAT ELIMINATES SOLDER DROSS Daniel (Baer) Feinberg, Keith Howell, Miles Lau, and Dr. Erik Severin  Purchase 
    THE CT REVOLUTION: HIGH-SPEED µ-FOCUS X-RAY COMPUTED TOMOGRAPHY FOR SEMICONDUCTOR AND SMT APPLICATIONS Dr. Jens Peter Steffen, Dr. Andreas Lechner  Purchase 
    China Alloy SnAgCuCe in Reflow Applications Dr. Yan Liu, Paul Bachorik, Geoffrey Beckwith, Lee Kresge, Matthew Long, William Manning, Dr. Runsheng Mao, Benjamin Nieman, and Dr. Ning-Cheng Lee  Purchase 
    Lead Free Solder Joints Reliability and Process Control (CHINESE) Freddie Chan  Purchase 
    Lead Free Solder Joints Reliability and Process Control Freddie Chan  Purchase 
    FACTORS AFFECTING VOIDING IN UNDERFILLED FLIP CHIP ASSEMBLIES (CHINESE) George Carson PhD and Maury Edwards  Purchase 
    FACTORS AFFECTING VOIDING IN UNDERFILLED FLIP CHIP ASSEMBLIES George Carson PhD and Maury Edwards  Purchase 
    The Study of Mini-wave Soldering Process in Lead Free Assembly Harvey Chang, Jay Huang, J.L. Ku, Ander Hsieh, Andrew Lee  Purchase 
    The Study of Mini-wave Soldering Process in Lead Free Assembly (CHINESE) Harvey Chang, Jay Huang, J.L. Ku, Ander Hsieh, Andrew Lee  Purchase 
    SOLDER-PASTE INSPECTION MACHINE - WHAT’S YOUR EXPECTATION? Jiang Xiaodong  Purchase 
    SOLDER-PASTE INSPECTION MACHINE - WHAT’S YOUR EXPECTATION? (CHINESE) Jiang Xiaodong  Purchase 
    The Application Research of VOC-free Flux Liu Yunji, Zhu Ailan, Zhang Yuan  Purchase 
    The Application Research of VOC-free Flux (CHINESE) Liu Yunji, Zhu Ailan, Zhang Yuan  Purchase 
    Rework of Package on Package in Lead-Free Array Paul Wood  Purchase 
    ASSEMBLY CHALLENGES OF PACKAGE-ON-PACKAGE (PoP) Richard Boulanger  Purchase 
    The Lead-Free Wave Solder Process and Its Effect on Laminates Steve Brown, Chrys Shea  Purchase 
    Optimising Rheology for Package-on-Package Flux Dip Processes Steve Brown, Chrys Shea, et al.  Purchase 
    Optimising Rheology for Package-on-Package Flux Dip Processes (CHINESE) Steve Brown, Chrys Shea, et al.  Purchase 
    MATERIAL AND PACKAGE OPTIMIZATION FOR POP WARPAGE CONTROL Wei Lin, Akito Yoshida, Moody Dreiza  Purchase 
    OPTIMIZE OXYGEN LEVEL IN SEMI-INERT WAVE SOLDERING - NITROGEN CONSUMPTION COST DOWN Xiao Shenghan  Purchase 
    OPTIMIZE OXYGEN LEVEL IN SEMI-INERT WAVE SOLDERING - NITROGEN CONSUMPTION COST DOWN (CHINESE) Xiao Shenghan  Purchase 
    A STUDY OF PLANAR MICROVOIDING IN Pb-FREE SOLDER JOINTS (CHINESE) Yung-Herng Yau, Karl Wengenroth and Joseph Abys  Purchase 
    A STUDY OF PLANAR MICROVOIDING IN Pb-FREE SOLDER JOINTS Yung-Herng Yau, Karl Wengenroth and Joseph Abys  Purchase 
    High resolution Lead-Free Solder Inspection by X-Ray Zhenhui He, Holger Roth and Dirk Neuber  Purchase 

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