Successful Lead-Free/RoHS Strategies Conference 2007 Proceedings

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    TITLE AUTHOR DOWNLOAD
    TIN WHISKER RISK ASSESSMENT CASE STUDY Craig Hillman, Gerd Fischer, and Robert Esser  Purchase 
    LEAD FREE WAVE SOLDERING: PROCESS OPTIMIZATION FOR SIMPLE TO HIGHLY COMPLEX BOARDS Denis Barbini, et al.  Purchase 
    Lead-Free Rework: Lessons Learned Douglas J. Peck  Purchase 
    SELECTING LAMINATE MATERIALS FOR LEAD-FREE ASSEMBLY APPLICATIONS Edward Kelley  Purchase 
    AN EXPERIMENTAL STUDY OF A COMPONENTS TERMINATION FINISH CONVERSION PROCESS: THE ROBOTIC STRIPPING AND SOLDER DIPPING PROCESS Guhan Subbarayan, Robert Kinyanjui, Ph.D., and Joel Deutsch  Purchase 
    DEFLUXING OF EUTECTIC AND LEAD-FREE ASSEMBLIES IN A SINGLE CLEANING PROCESS Harald Wack, Ph.D., et al.  Purchase 
    RECOMMENDING A STRATEGY FOR IMPLEMETING ROHS COMPLIANT MATERIALS IN ENGINEERING FUNCTIONS Jeffrey Boian  Purchase 
    Six Steps to Lead Free Process Implementation Joe Belmonte  Purchase 
    A UNIQUE TIN WHISKER GROWTH STUDY OF NINE LEAD FREE ALLOYS Karl Seelig and Tetsuro Nishimura  Purchase 
    UNDER BUMP METALLURGY FOR C4NP LEAD FREE SOLDER BUMPING Klaus Ruhmer and Eric Laine, et al.  Purchase 
    Environmental Compliance Documentation: More than Materials Declaration Krista Botsford  Purchase 
    ENVIRONMENTAL COMPLIANCE DOCUMENTATION Krista Botsford  Purchase 
    China RoHS vs. EU RoHS Myths & Misconceptions Krista Botsford  Purchase 
    EU RoHS VS. CHINA RoHS Krista Botsford  Purchase 
    HAVE HIGH Cu DISSOLUTION RATES OF SAC305/405 ALLOYS FORCED A CHANGE IN THE LEAD FREE ALLOY USED DURING PTH PROCESSES? Matthew Kelly, Craig Hamilton and Polina Snugovsky, Ph.D.  Purchase 
    CASE STUDY ON THE VALIDATION OF SAC305 AND SNCU BASED SOLDERS IN SMT, WAVE AND HAND-SOLDERING AT THE CONTRACT ASSEMBLER LEVEL Peter Biocca and Carlos Rivas  Purchase 
    BENCHMARK ELECTRONIC’S FRAMEWORK FOR ROHS IMPLEMENTATION Scott Mazur  Purchase 
    Evaluating Tin Whisker Mitigation Strategies: Conformal Coatings and Plating Technique Sony Mathew, Michael Osterman and Michael Pecht  Purchase 
    EVALUATION OF PRESSURE-INDUCED TIN WHISKER FORMATION Tadahiro Shibutani, Ph.D. et al.  Purchase 

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