Pan Pacific Symposium 2006 Proceedings

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    TITLE AUTHOR DOWNLOAD
    DESIGN OF EMC-INTEGRATED DEVICES FOR WIRELESS SENSOR NETWORKS A. Gandelli, D. Monopoli, M. Mussetta, R. E. Zich,  Purchase 
    SENSOR PACKAGING IN HARSH ENVIRONMENT A. Gandelli, F. Grimaccia and R.E. Zich  Purchase 
    CONDUCTIVE INK JETTABLE METAL AND NONMETAL NANOSYSTEMS Alan Rae & Dana Hammer-Fritzinger  Purchase 
    ADVANCES IN JETTING SMALL DOTS OF HIGH VISCOSITY FLUIDS FOR ELECTRONIC AND SEMICONDUCTOR PACKAGING Alec J. Babiarz  Purchase 
    Pb-FREE BGA SOLDER BALL ATTACH ASSEMBLY RESEARCH: A RETROSPECTIVE OF 5 YEARS OF STUDY Amol Kane, D.L. Santos, and Vatsal Shah  Purchase 
    IMPROVED RELIABILITY OF HI-Q RF FILTERS (SAW AND BAW) FOR RF SIP (SYSTEM-IN-PACKAGE) MODULES Andrew Kay, Tim Walters, Vijay Vijayakumar, and Atsushi Takano  Purchase 
    FLEXIBLE CIRCUIT ATTACH PROCESS FOR CAMERA MODULE Asif R. Chowdhury, Jin Seong Kim, Young Duck Yoon  Purchase 
    COMPARISON OF NEAR-EUTECTIC SnPb AND SnAg SOLDER PLATING FOR WLP APPLICATIONS Bioh Kim, Charles Sharbono, Tom Ritzdorf, and Dan  Purchase 
    SOLDERBALL™ PIN TECHNOLOGY PROVIDES SMT REFLOW SOLUTION TO CO-PLANARITY INTERCONNECTION ISSUES FOR PCB –BASED SUB-ASSEMBLIES Carlos Juvera  Purchase 
    THERMO-ELECTROMIGRATION STUDY OF LEAD-FREE SOLDER BUMPS Chien Chen Lee, Kou Ning Chiang, Kuo Ming Chen, an  Purchase 
    BGA SOLDER VOID CORRELATION TO VIA-IN-PAD, VIA FILL, SURFACE FINISH, AND LEAD-FREE SOLDER – A PRELIMINARY REVIEW Chrys Shea, Rahul Raut, Quyen Chu, Nicholas Tokotc  Purchase 
    NEW TRENDS FOR PWB SURFACE FINISHES IN MOBILE PHONE APPLICATIONS Claus Würtz Nielsen, Dr. Anette Alsted Rasmussen,  Purchase 
    3D PACKAGING ENABLED WITH ELECTROCHEMICAL DEPOSITION TECHNIQUES FROM VARIED ELECTRONIC INDUSTRY SEGMENTS Dan Schmauch, Bioh Kim, and Tom Ritzdorf  Purchase 
    PROCESSING AND RELIABILITY OF HIGH PERFORMANCE FLIP CHIP ON FLEX MODULES Daniel F. Baldwin, Ph.D., Jennifer Muncy, Paul Houston and Brian Lewis  Purchase 
    THREE DIMENSIONAL HETEROGENEOUS CHIP INTEGRATION PROCESS David R. Scheid  Purchase 
    INK-JET AS A MEMS MANUFACTURING TOOL David Wallace, Donald Hayes, Ting Chen, Virang Sha  Purchase 
    THE THERMAL PROPERTIES OF WLCSP SOLDER ATTACH Dennis Lang  Purchase 
    FROM HALT AND HASA TO INTERCONNECT RELIABILITY Dr. Paul P.E. Wang, Ferdie Lizardo, Setareh Siavas  Purchase 
    INTERCONNECT AND THERMAL SYSTEM RELIABILITY FOR PROCESSOR UNITS Dr. Paul P.E. Wang, Julia Purtell, and Michael Mil  Purchase 
    DESIGN OF EMC-INTEGRATED DEVICES FOR WIRELESS SENSOR NETWORKS E. Alfassio Grimaldi, A. Gandelli, and R. E. Zich  Purchase 
    IMPROVE YIELDS WITH AN ENHANCED X-RAY INSPECTION IMAGING CHAIN Friedhelm W. Maur  Purchase 
    MAXIMIZING THE “VALUE-ADD” OF THE ELECTRONICS MATERIALS PARTNER George A. Toskey  Purchase 
    LEAD-FREE PRODUCT AND PROCESS CONVERSION PHASE III. WAVE SOLDERING PROCESS OPTIMIZATION AND PCB THERMAL MANAGEMENT Hana Hsu, Jerry Peng, Anching Chien, Leimo Chen, B  Purchase 
    A STUDY OF RELIABILITY DROP TEST EFFECTS FOR SnAgCu SOLDER BUMP IN SYSTEM-IN-PACKAGE AND BOARD LEVEL PACKAGE Hsiang-Chen Hsu, Yu-Chia Hsu, Hui-Yu Lee, Shen-Li  Purchase 
    EVALUATION OF EMBEDDED DEVICES USING ACOUSTIC MICRO IMAGING Janet E. Semmens  Purchase 
    RELIABILITY TESTING OF 9x9 QFN PACKAGES WITH INTERNAL POWER FOR HARSH ENVIRONMENT ELECTRONICS John Evans, Ph.D., Elliot McBride, Charles Mitchel  Purchase 
    A GIANT STEP IN ASSEMBLY COST REDUCTION USING BREAKTHROUGH LAP Junichi Kasai  Purchase 
    C4NP: LEAD-FREE AND LOW COST SOLDER BUMPING TECHNOLOGY FOR FLIP CHIP AND WLCSP Klaus Ruhmer, Daniel Fleming, Ph.D., and Peter Gru  Purchase 
    PERFORMANCE AND RELIABILITY EVALUATION OF ALTERNATIVE SURFACE FINISHES FOR WIRE BOND AND FLIP CHIP BGA APPLICATIONS Kuldip Johal, Hugh Roberts, Kishor Desai, Q.H. Low  Purchase 
    QUALITY AND RELIABILITY CHALLENGES FOR LARGE DIE FLIP CHIP BGA APPLICATIONS Kumar Nagarajan, Mukul Joshi, and Nael Zohni  Purchase 
    EPOXY/BaTiO3 (SrTiO3) COMPOSITE FILMS AND PASTES FOR HIGH DIELECTRIC CONSTANT AND LOW TOLERANCE EMBEDDED CAPACITORS IN ORGANIC SUBSTRATES Kyung-Wook Paik, Jin-Gul Hyun, Sangyong Lee, and Kyung-Woon Jang  Purchase 
    MIXED ASSEMBLY PROCESS DEVELOPMENT & RELIABILITY QUALIFICATION L. Pymento, W.T. Davis, and T. Godown  Purchase 
    PASTE PRINTING OPTIMIZATION WITH DUAL SQUEEGEES AND INTEGRAL WIPING SYSTEM Mark J. Curtin and Thomas B. Feeney  Purchase 
    STRAIN GAGE TESTING: THE REQUIRED TOOLS AND DATA SET FOR MANUFACTURING HIGH RELIABILITY HARDWARE Mark T. McMeen  Purchase 
    RELIABILITY OF CHIP ON CHIP PACKAGES USING THERMO-COMPRESSION BONDING TECHNOLOGY BETWEEN Au PLATING BUMPS Masamoto Tago, Kenji Nanba, Takashi Miyazaki, Seiy  Purchase 
    NON-INVASIVE SOLDERABILITY TESTS FOR LEAD–FREE PACKAGING Michael Pavlov, Peter Bratin, Eugene Shalyt, Karsten Andrae, Chenting Lin, and Tien Ai Wee  Purchase 
    INTEGRATING QUALITY CONTROL TOOLS WITH PLANNING MODULES IN ERP SYSTEMS P. Bhargava, J. Sturek, R. Murcko & K. Srihari, J.  Purchase 
    EFFECTS OF ACCELERATED STORAGE ENVIRONMENTS ON THE SOLDERABILITY OF IMMERSION SILVER-COATED PRINTED CIRCUIT BOARDS Paul Vianco, Edwin Lopez, R. Wayne Buttry, Alice K  Purchase 
    NANO SOP FOR ULTRA-MINIATURIZED ELECTRONIC AND BIO-ELECTRONIC SYSTEMS Rao Tummala, P. Markondeya Raj, D. Janagama Goud a  Purchase 
    LEAD-FREE BGA PAD DESIGN: A COMPARITIVE STUDY OF THE AFFECT OF PAD DIMENSIONS ON THE ATTACHMENT OF AREA ARRAY PACKAGES UTILIZING LEAD-FREE SOLDER PROCESSES AND VARIOUS PASTE PRINT METHODS Ray Cirimele  Purchase 
    ION MILLING AS AN ALTERNATIVE TO FOCUSED ION BEAM FOR CROSS-SECTION INTERMETALLIC ANALYSES Roger J. Stierman, Becky Holdford, and Maricel Fab  Purchase 
    PLASMA TREATMENT TECHNOLOGY FOR CAPILLARY UNDERFILL Ryota Furukawa  Purchase 
    BOTTLENECK ORIENTED CAPACITY PLANNING THROUGH ERP SYSTEMS AT AN EMS PROVIDER S. Ramakrishnan and K. Srihari  Purchase 
    DESIGN OF MICROSTRIP MICROWAVE FILTERS USING ENHANCED PSO ALGORITHMS S. Selleri, M. Mussetta, R. E. Zich, and P. Pirino  Purchase 
    SUMMARY OF NEW ENGLAND LEAD FREE CONSORTIUM IMPLEMENTATION PLAN OF HIGH VOLUME ASSEMBLY OF PRINTED WIRING BOARDS Sammy Shina, Greg Morose, Liz Harriman, Richard An  Purchase 
    REFLOW PROFILE OPTIMIZATION FOR MINIMIZING FATIGUE FAILURES ON LEAD-FREE ASSEMBLIES USING ALLOY 42 BASED LEAD-FREE TSOP PACKAGES Satyanarayan Iyer, Shaon Baqui, and Zaidy Ismail  Purchase 
    RELIABLE ELECTRONICS PACKAGE PROTOTYPING WITH NANO-PARTICLE METAL INTERCONNECTION Sungchul Joo and Daniel F. Baldwin  Purchase 
    CONTROLLING LOCALIZED CONTAMINATION ON MICROELECTRONIC ASSEMBLIES WITH THE CHANGE TO LEAD FREE ASSEMBLY Terry Munson  Purchase 
    CLEANING ISSUES ASSOCIATED WITH LEAD FREE SOLDERING MATERIALS PHASE II Thomas M. Forsythe  Purchase 
    GOOD LIFE-TEST DATA, HOW TO CREATE AND EVALUATE IT Tom Clifford  Purchase 
    TRANSITION TO Pb-FREE ALLOYS IN CAPACITOR FILTER ASSEMBLIES Vatsal A. Shah, Amol S. Kane, Daryl L. Santos, Mik  Purchase 
    ADVANCED PACKAGE STACKING TECHNOLOGIES - IC Package Qualification Testing for Lead-Free Soldering Vern Solberg, Craig Mitchell, and Gordon Gray  Purchase 
    THIN FILM MEASUREMENT AND OUTGASSING STUDY OF ADHESIVES USED IN OPTICAL MEMS DEVICES Vijay Sundermurthy, Frank Andros, Ph.D., and Nagen  Purchase 
    MATERIALS AND PROCESSES FOR MEMORY CARDS Wei Koh, PhD, Evelyn Baldwin, Steve Meischke, and  Purchase 
    EVALUATION OF SOCKET CONTACT FAILURE FOR BGA PACKAGE Yu-Jung Huang, Sun-Lon Jen, Shen-Li Fu, Ming-Kun C  Purchase 
    FAILURES IN SEMICONDUCTOR DEVICE ENCAPSULATED WITH RED PHOSPHORUS FLAME RETARDANT Yuliang Deng and Michael Pecht  Purchase 

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