2002 Telecom Hardware Solutions Proceedings

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    TITLE AUTHOR DOWNLOAD
    ASSEMBLY OF TELECOM HARDWARE MODULES BASED ON INNOVATIVE CAPILLARY CONNECTION TECHNOLOGYTM (C2-TECHNOLOGYTM) A. Taran, A. Belov, Ph.D. V. Krivoshapko  Purchase 
    MSA EFFECTS ON OPTOELECTRONIC DEVICE PACKAGING Amy Dugan  Purchase 
    PARTITIONING EFFICIENCY FOR MOBILE APPLIANCES Charles E. Bauer, Ph.D.  Purchase 
    OPTIMIZING TEST STRATEGIES DURING PCB DESIGN FOR BOARDS WITH LIMITED ICT ACCESS Charles Robinson & Amit Verma  Purchase 
    DATA TRANSPORT OVER SONET/SDH (DOS) Charlie Roach  Purchase 
    THE FOUNDATION BLOCKS FOR THE NEXT GENERATION NETWORK ELEMENTS Charlie Roach  Purchase 
    LIFE PREDICTION OF LEAD FREE SOLDER JOINTS FOR HANDHELD PRODUCTS D. Xie, et al.  Purchase 
    EMI SHIELDING TEST METHOD FOR SMALL WIRELESS DEVICES David Rich, et al.  Purchase 
    DIRECT PART MARKING IN CIRCUIT BOARD ASSEMBLY AND TEST David S. Thorpe  Purchase 
    LOW COST OPTOELECTRONIC COMPONENT FABRICATION AND PACKAGING Donald J. Hayes, Ting Chen and W. Royall Cox  Purchase 
    CFD-BASED DESIGN AND OPTIMIZATION OF A 1U MOTORIZED IMPELLER FOR TELECOM APPLICATIONS Dr. I.F. Obinelo  Purchase 
    SPLICING LOSS CONTROL AND ASSEMBLY YIELD MANAGEMENT Dr. Katsuji Takasu  Purchase 
    ACCELERATED LIFE TESTING AND ITS INTERACTION WITH QUALIFICATION TESTS Ephraim Suhir  Purchase 
    SOLUTIONS TO MEET HAND-HELD MARKET’S REQUIREMENT FOR LOW COST ADVANCED REFLOW AND ENVIRONMENTALLY SENSITIVE PACKAGING Fonzell Martin and Trent Thompson  Purchase 
    OPTOELECTRONIC FINGERPRINT SENSOR FOR MOBILE PHONES Guy Immega, Niall Parker  Purchase 
    A VIEW OF TOMORROW’S OPTICAL PACKAGING TECHNOLOGY Harry Bonham  Purchase 
    DESIGN, MANUFACTURABILITY AND COST CONSIDERATIONS FOR BASEBAND AND MEMORY STACKED DIE SYSTEM IN PACKAGE SOLUTIONS Jeannie Miller, Trent Thompson & Mark Gerber  Purchase 
    RF MEMS DEVICES FOR WIRELESS COMMUNICATION Jeong-Bong Lee, et al.  Purchase 
    LOW PROFILE TRANSFORMERS USING LOW TEMPERATURE CO-FIRE MAGNETIC TAPE John Bielawski, et al.  Purchase 
    A NOVEL APPROACH TO THERMAL MANAGEMENT AND EMI SHIELDING VIA A METALLIC CONFORMAL COATING ON A PLASTIC HOUSING John Hannafin  Purchase 
    THERMAL PERFORMANCE OF PACKAGES USED FOR A "XAUI" HIGH SPEED INTERFACE Keith Bailey and Roger Emigh  Purchase 
    HERMETIC VS. NON-HERMETIC OPTOELECTRONIC PACKAGING: MEETING, NOT EXCEEDING APPLICATION REQUIREMENTS Leo M. Higgins III, Ph.D.  Purchase 
    PCB DESIGN OPTIMIZATION OF 0201 PACKAGES FOR ASSEMBLY PROCESSES M. Wang, et al.  Purchase 
    PROGRESSION TOWARDS A FULLY INTEGRATED RF TRANSCEIVER MODULE Mark V. Christensen  Purchase 
    ASSESSING THE EFFECT OF FINE PITCH BGA PACKAGES ON MOTHERBOARD DESIGN AND BOARD LEVEL RELIABILITY Michael Leoni & David Patten  Purchase 
    PLANAR MAGNETIC DEVICES SOLUTIONS FOR TODAYS HIGH DENSITY DISTRIBUTED POWER APPLICATIONS P. Harding, C. Tapscott, R. Visan and G. Corfar  Purchase 
    THERMAL INTERFACE MATERIAL SOLUTIONS FOR TELECOM COMPONENTS Paul A. Berry, PE, and Jesus Marin  Purchase 
    SYNTHESIZER-BASED HIGH FREQUENCY, LOW PHASE JITTER OSCILLATOR DESIGN Thomas Knecht  Purchase 
    HISTORY, TRENDS AND ISSUES RELATED TO MICROPROCESSOR PACKAGES USED IN HANDHELD WIRELESS PRODUCTS Tom Gregorich and Edward Reyes  Purchase 
    X-RAY INSPECTION FOR OPTOELECTRONIC COMPONENTS - THE ROLE OF ADVANCED DETECTOR TECHNOLOGY Vikram Butani  Purchase 
    SWITCHED BLAZED GRATING FOR OPTICAL NETWORKING W. Duncan, et al.  Purchase 
    NOVEL PACKAGING APPROACHES FOR MINIATURE ANTENNAS Will McKinzie, et al.  Purchase 

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