Surface Mount International 1998 Proceedings

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    TITLE AUTHOR DOWNLOAD
    TECHNOLOGY VISION ANALYSIS 2010: SPONSORED BY THE SURFACE MOUNT COUNCIL Purchase 
    MAKING SENSE OF CSPS AND BGAS THROUGH TECHNICAL COST MODELING Adam T. Singer  Purchase 
    THE FUTURE OF VACUUM DISPENSING FOR CHIP SCALE PACKAGES Allen Duck  Purchase 
    ASSEMBLY AND INTERCONNECT RELIABILITY OF BGA ASSEMBLED ONTO BLIND MICRO AND THROUGH-HOLE DRILLED VIA IN PAD Andrew Mawer  Purchase 
    LEAD FREE SOLDERS IN ELECTRONICS Angela Grusd  Purchase 
    ZAP YOUR SMD? - USING IONIZATION FOR ESD CONTROL IN AUTOMATED EQUIPMENT FOR SMT PRODUCTION Arnold Steinrnan  Purchase 
    EFFECT OF LARGE CONNECTOR INSERTION ON THE SOLDER JOINT RELIABILITY OF PBGA ON PCB Arthur May  Purchase 
    FINE PITCH BGA PACKAGE ASSEMBLY Barry Miles  Purchase 
    CHANGING ASSEMBLY EQUIPMENT REQUIREMENTS FOR EVOLVING PACKAGING TECHNIQUES Brian Blades  Purchase 
    THE SEARCH FOR YIELD IMPROVEMENT: QUALITY METRICS IN THE EMS INDUSTRY Brian Coll  Purchase 
    EFFECT OF SOLDER PASTE RESIDUES ON RF SIGNAL DEGRADATION Brian Smith  Purchase 
    SMALL LOT PROCESSING AND OTHER NECESSARY CONDITIONS FOR BUILD-TO-ORDER MANUFACTURING Brian Tracey  Purchase 
    EVALUATION OF EUTECTIC SOLDER BUMP INTERCONNECT TECHNOLOGY FOR DIRECT CHIP ATTACH APPLICATIONS CraigBeddingfield  Purchase 
    TECHNOLOGY VISION ANALYSIS 2010: SPONSORED BY THE SURFACE MOUNT COUNCIL David Bergman  Purchase 
    IDENTIFYING SOURCES OF SOLDER DEFECTS IN PRINTED CIRCUIT ASSEMBLIES INCORPORATING BALL GRID ARRAY PACKAGES David Moore  Purchase 
    LIMITS OF COPPER PLATING IN HIGH ASPECT RATIO MICROVIAS Dennis Fritz  Purchase 
    THE DUAL LANE FACTORY: CONSIDERATIONS FOR IMPLEMENTING DUAL LANE MANUFACTURING Dennis O’Neal  Purchase 
    PRINTING GUIDELINES FOR BGA AND CSP ASSEMBLIES DONALD C. BURR  Purchase 
    REWORK PLACEMENT CAPABILITY FOR ADVANCED PACKAGE TYPES- ìBGA, CSP Donald J. Spigarelli  Purchase 
    CSP DESIGN AND MICROVIA PWB FABRICATION (PART A OF CSP CONSORTIA ACTMTIES: PROGRAM OBJECTIVES AND STATUS) E.J. Simeus  Purchase 
    CSP CONSORTIA ACTIVITIES: PROGRAM OBJECTIVES AND STATUS E.J. Simeus,  Purchase 
    FOUR HARD LESSONS IN CONTRACT MANUFACTURING Edwin B. Smith III  Purchase 
    SOLDERABILITY AND BOARD LEVEL RELIABILITY OF PALLADIUM PLATED, FINE PITCH COMPONENTS Elizabeth Elias Benedetto  Purchase 
    ECONOMIC IMPACT OF PRODUCT YIELD IMPROVEMENT EmanuelJ. Tucker  Purchase 
    A MOISURE INDUCED FAILURE IN FCBGA PACKAGES DURING MULTIPLE REFLOW Fay Hua  Purchase 
    DECISION AID FOR FUNCTIONAL MATERIALS IN INTERCONNECTION TECHNOLOGIES H.-J. Albrecht  Purchase 
    ASSEMBLY MULTI-CHIP COB MODULE WITH METAL HEAT SINK Hahn Jong Hsiung  Purchase 
    FLOATING METAL PLANE ON THERMAL AND ELECTRICAL PERFORMANCE OF AN ENHANCED PLASTIC BALL GRID ARRAY PACKAGE Humayun Kabir  Purchase 
    COMPATIBILITY OF CSPs IN SMT ASSEMBLY (PART C OF CSP CONSORTIA ACTIVITIES: PROGRAM OBJECTIVES AND STATUS) I. Sterian  Purchase 
    PALLADIUM SURFACE FINISH FOR SOFT TOUCH SWITCHES AND HIGH DENSITY SMT ASSEMBLIES J. Evans  Purchase 
    FLIP CHIP UNDERFILL CHARACTERIZATION METHODS: DEVELOPING A TEST METHODOLOGY FOR SUCCESS IN THE HARSH AUTOMOTIVE ENVIRONMENT James M. Rosson  Purchase 
    FLIP-CHIP / CSP ASSEMBLY RELIABILITY AND SOLDER VOLUME EFFECTS Jean-Paul Clech  Purchase 
    ESD CONSIDERATIONS FOR AUTOMATED HANDLING OF SMT DEVICES Joe Bernier  Purchase 
    THE IMPACTS OF EUTECTIC SOLDER BALL COPLANARITY OF PBGA PACKAGE ON THE RELIABILITY OF SOLDER BALL JOINTS Joe Chu  Purchase 
    THE TOOLS YOU NEED FOR DEVELOPMENT AND PRODUCTION WHEN USING UNDERFILL MATERIALS* John A. Emerson  Purchase 
    TECHNOLOGY MANAGEMENT IN A COST SENSITIVE, QUICK TO MARKET ENVIRONMENT John YeaUanci  Purchase 
    FLEXIBLE INTERCONNECT TECHNOLOGIES FOR ENHANCED SMT ASSEMBLY Joseph A. DiPalermo  Purchase 
    PASTE PRINTING AND CHARACTERIZATION FOR CHIP SCALE PACKAGE ASSEMBLIES Julian Partridge  Purchase 
    GENERATING OF SOLID SOLDER BUMPS ON PRINTED CIRCUIT BOARDS K.-J Wolter  Purchase 
    HIGH VOLUME, LOW COST FLIP CHIP ASSEMBLY ON POLYESTER FLEX Ken Gilleo  Purchase 
    ASSEMBLY PROCESS DEVELOPMENT OF LAMINATE FLIP CHIP BGA PACKAGE Kumar Nagarajan  Purchase 
    OPTIMIZING BGA TO PCB INTERCONNECTIONS USING MULTI-DEPTH LASER DRILLED BLIND VIAS-IN-PAD Larry W. Burgess  Purchase 
    NO-UNDERFILL FLIP-CHIP ENCAPSULATION M. Albert Capote  Purchase 
    CSP IMPLEMENTING: AN OEM PERSPECTIVE (PART B OF CSP CONSORTIA ACTIVITIES: PROGRAM OBJECTIVES AND STATUS) M. Chan  Purchase 
    ENHANCEMENT OF UNDERFILL ENCAPSULANTS FOR FLIP-CHIP TECHNOLOGY M.B. Vincent  Purchase 
    SELECTION OF BGA / CSP REWORK EQUIPMENT Marc DeRuiter  Purchase 
    DESIGN AND PROCESS OPTIMIZATION FOR 1.0 MM PITCH CCGA Marie Cole  Purchase 
    THE RELIABILITY STUDY OF LEAD-FREE SOLDER BALL FOR THE CHIP SCALE PACKAGE (CSP) Masako Watanabe  Purchase 
    EFFECTS OF MICROSTRUCTURAL HETEROGENEITY ON BGA RELIABILITY* Michael K. Neilsen  Purchase 
    PowerPADTM - A METHOD TO CREATE THERMALLY ENHANCED PLASTIC PACKAGE SOLUTIONS FOR SEMICONDUCTORS Milton L. Buschbom  Purchase 
    EMS PROVIDERS MUST TAKE THE TECHNOLOGY LEAD Nicholas E. Brathwaite  Purchase 
    OPTIMIZING REFLOW PROFILE VIA DEFECT MECHANISMS ANALYSIS Ning-Cheng Lee  Purchase 
    DEVELOPMENT OF MF-BGA (MOUNTING FRAME BGA) Noriaki Taketani  Purchase 
    FLIP CHIP ON LARGE AREA PANEL LAMINATES WITH RELIABILITY ASSESSMENT RESULTS P. Nerio  Purchase 
    PALLADIUM SURFACE FINISH FOR SOFT TOUCH SWITCHES AND HIGH DENSITY SMT ASSEMBLIES P. Seto  Purchase 
    APPLICATION SPECIFIC RELIABILITY OF IC PACKAGES Patrick Counihan  Purchase 
    APPLICATION SPECIFIC RELIABILITY OF IC PACKAGES Patrick Counihan  Purchase 
    PROCESS LIMIT TESTING ON FLUXES USED FOR FLIP CHIP SOLDERING Paul Novak  Purchase 
    SUCCESSFUL REWORK PROCESS FOR CHIP-SCALE PACKAGES Paul Wood  Purchase 
    RELIABILITY VERIFICATION OF PRINTED BOARD ASSEMBLIES: CRITICAL REVIEW OF TEST METHODS AND FUTURE TEST STRATEGY Per-Erik Tegehall  Purchase 
    GLOBAL UPDATE ON LEAD-FREE SOLDERS Peter Biocca  Purchase 
    ASSEMBLY-LEVEL RELIABILITY OF FLEX-SUBSTRATE BGA, LASTOMER-ON-FLEX PACKAGES AND 0.5mm PITCH PARTIAL ARRAY PACKAGES Pradeep Lall  Purchase 
    IN-PROCESS STRESS ANALYSIS OF FLIP CHIP ASSEMBLIES DURING UNDERFILL CURE Prema Palaniappan  Purchase 
    RELIABILITY STUDY OF THROUGH-HOLE SOLDER JOINTS PROCESSED VIA ALTERNATIVE ASSEMBLY REFLOW TECHNOLOGY (AART) R. Seeniraj  Purchase 
    THERMAL CYCLE RELIABILITY OF SOLDER JOINTS TO ALTERNATE PLATING FINISHES R. WayneJohnson  Purchase 
    EFFECTS OF BOARD SURFACE FINISH ON FAILURE MECHANISMS AND RELIABILITY OF BGAs Reza Ghaffarian  Purchase 
    PRECISION PLACEMENI’ CHALLENGES FOR FINE PITCH COMPONENTS Richard Boulanger  Purchase 
    IMMERSION WHITE TIN THE IDEAL SOLDERABLE FINISH Richard Edgar  Purchase 
    QUANTIFYING THE PRINTABILITY OF SMT ADHESIVES Richard R. Lathrop Jr.  Purchase 
    No CLEAN SOLDER PASTE BENCH MARKING FROM A MATERIALS SUPPLIERS VIEWPOINT RichardR Lathrop Jr.  Purchase 
    EFFECT OF TEST BOARD DESIGN ON THE 2ND LEVEL RELIABILITY OF A FINE PITCH BGA PACKAGE Robert Darveaux  Purchase 
    European Trends in Reflow Soldering Technology Robert V. Burress  Purchase 
    CLEANING FOR HIGH RELIABILITY FLIP-CHIP-ON-LAMINATE ASSEMBLY Robin L. Sellers  Purchase 
    ADVANCES IN CHIP SCALE PACKAGING Ron Bauer  Purchase 
    PROCESS AND MATERIAL CHARACTERIZATION FOR LEAD-FREE TIN-COPPER SOLDER ALLOY RonaldE. Pratt  Purchase 
    BALL DETACHMENT EVALUATION FOR TAPE BALL GRID ARRAY PACKAGES S. H. K. Lee  Purchase 
    MANUFACTURE AND RELIABILITY OF ALTERNATE SOLDER ALLOYS S. Wege  Purchase 
    APPLICATION ADVANTAGES OF INTEGRATED PASSIVE DEVICES (IPDs) IN CHIP SCALE PACKAGES Satish Kumar  Purchase 
    ELECTROMIGRATION STUDIES OF FLIP CHIP BUMP SOLDER JOINTS Scott Brandenburg  Purchase 
    PROCESS CONTROL STRATEGIES IN MINIATURE, HIGHLY COMPLEX PCB ASSEMBLY Sean Griffin  Purchase 
    CERAMIC CSP - CURRENT STATUS OF TECHNOLOGY Shoji Uegaki  Purchase 
    LIMITS OF COPPER PLATING IN HIGH A.SPECT RATIO MICROVIAS Steve Castaldi  Purchase 
    NEW HIGH THERMAL CONDUCTIVITY MATERIALS FOR THERMAL MANAGEMENT OF SURFACE MOUNT ELECTRONIC ASSEMBLIES Steve Dunford  Purchase 
    REWORKING AND REBALLING BGAS Steve Stach  Purchase 
    SMT POWER THERMISTORS Theodore J. Krellner  Purchase 
    POLYIMIDE SUBSTRATES AS AN ENABLER FOR LEADING EDGE DCA APPLICATIONS Timothy Patterson  Purchase 
    THE IMPACTS OF EUTECTIC SOLDER BALL COPLANARITY OF PBGA PACKAGE ON THE RELIABILITY OF SOLDER BALL JOINTS Tony Huang  Purchase 
    STRUCTURE AND MATERIAL ANALYSIS OF PBGA PACKAGES Torsten Kirrnse  Purchase 
    SOLDERABILITY OF PRINTED WIRING BOARDS WITH ORGANIC SOLDER PRESERVATION UNDER NITROGEN ATMOSPHERE Torsten Zachert  Purchase 
    RELIABILITY PERFORMANCE ASSESSMENT AND CHAFtACTERIZATION OF FINE PITCH MOLD ARRAY BGA Trent Thompson  Purchase 
    PROCESS IMPROVEMENT STRATEGIES: IMPLEMENTATION OF A NO-CLEAN PROCESS Vicente Martinez Mir  Purchase 
    MINIMIZING ESD EFFECTS OF LABELING IN THE ELECTRONICS ASSEMBLY ENVIRONMENT Viclci Heideman  Purchase 
    PROCESS CAPABILITY COEFFICIENT AND PLACING ACCURACY AS BENCHMARKING VALUES OF SMT PLACEMENT SYSTEMS W. Sauer  Purchase 
    REDUCTION OF BGA EUTECTIC BALL SOLDER JOINT VOIDING William Casey  Purchase 
    THERMOMECHANICAL DEFORMATION AND INTERFACIAL ADHESION IN UNDERFILLED FLIP-CHIP PACKAGES Xiang Dai  Purchase 
    LOW COST WAFER BUMPING WITH MASKLESS PROCESS Yasuhisa Kaga  Purchase 
    EVALUATION OF NI/PD/AU AS AN ALTERNATIVE METAL FINISH ON PCB Zequn Mei  Purchase 

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