Surface Mount International 1997 Proceedings

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    TITLE AUTHOR DOWNLOAD
    E-3 SOLDER BUMP INTEGRITY AND JOINABILITY Addi Mistry  Purchase 
    CONTAMINATION OF LEAD-FREE SOLDERS WITH COPPER AND LEAD Alan Gickler  Purchase 
    HIGH VOLUME ASSEMBLY OF CERAMIC COLUMN GRID ARRAY (CCGA) Andrea Lawrence  Purchase 
    Reliability Evaluation of a PBGA MCM for Automotive Applications Andrew Mawer  Purchase 
    NON-CONTACT SURFACE PROFILE MEASUREMENT SYSTEM FOR PACKAGING APPLICATIONS Anthony Wong,  Purchase 
    MECHANICAL RELIABILITY ANALYSIS OF CCGA SOLDER JOINTS Arvhd Sinha  Purchase 
    TECHNICAL ADVANCE IMPROVES REFLOW PROCESS RELIABILITY AND CONSISTENCY Brad Bailey  Purchase 
    CORROSION TESTING OF LOW SOLIDS AND FLIP CHIP FLUXES Brian A Smith  Purchase 
    THE PRACTICAL APPLICATION OF PHOTO-DEFINED MICRO-VIA TECHNOLOGY Brian J. McDermott  Purchase 
    HIGH FREQUENCY BGAs FOR CELLULAR PHONE AND WIRELESS APPLICATIONS Carmen Mattei  Purchase 
    TRANSIENT LIQUID PHASE SINTERING CONDUCTIVE ADHESIVES FOR USE IN SURFACE MOUNT AND AREA ARRAY APPLICATIONS Catherine Gallagher  Purchase 
    NPI-EXPRESSWAY TO RAPID AND EFFICIENT PRODUCTION Charles Lang  Purchase 
    OPTIONS AND CONCERNS OF BGA SOLDER BUMPING Chingchen S. Chiu  Purchase 
    EFFECTS OF UNDERFILL MATERIALS AND ASSEMBLY PROCESSES ON MOISTURE SENSITIVITY OF FLIP CHIP ASSEMBLIES Craig Beddingfield  Purchase 
    AREAL ARRAY JETTING DEVICE FOR BALL GRID ARRAYS D. R. Frear  Purchase 
    IMPACT OF FINE PITCH LEAD COPLANARITY ON SURFACE MOUNT YIELD David M. Mendez  Purchase 
    STATISTICAL MODEL OF PRINTED WIRING BOARD AND STENCIL ALIGNMENT ISSUES David Mendez  Purchase 
    VALIDATING THEORETICAL CALCULATIONS OF THERMOMECHANICAL STRESS AND DEFORMATION USING THE ATC4.I FLIP-CHIP TEST VEHICLE David W. Peterson  Purchase 
    A PBGA PACKAGE FOR A HIGH PERFORMANCE MICROPROCESSOR Dev Malladi  Purchase 
    ACHIEVING SINGLE DIGIT DPMO IN SMT PROCESSES Don Revelino  Purchase 
    SOLDER JET PRINTING FOR WAFER BUMPING AND CSP Donald J. Hayes  Purchase 
    BALL GRID ARRAY(BGA) SOLDER JOINT INTEGRITY ENHANCEMENT G. Bartlett  Purchase 
    BUMP,DIP,FLIP: SINGLECHIP George A. Riley  Purchase 
    PCB FABRICATION FOR SUCCESSFUL SOLDER PASTE George Trinite  Purchase 
    THE EFFECT OF SUBSTRATE THICKNESS ON CBGA FATIGUE LIFE Gregory B. Martin  Purchase 
    CRITERIA FOR HIGH-SPEED MOUNTING OF AREA ARRAY PACKAGES (BGAs, pBGAs/CSPs AND FLIP CHIPS) Gunter Schiebel  Purchase 
    REDUCING SOLDER DEFECTS UNDER NITROGEN WITH VARYING OXYGEN CONCENTRATIONS H. Hsiao  Purchase 
    MAGNETO-HYDRODYNAMICALLY DRIVEN SOLDER JETTING DEVICE H.C. Peebles  Purchase 
    BGA PACKAGE ANALYSIS FROM MATERIALS POINT OF VIEW Hans-Jurgen Albrecht  Purchase 
    CONCURRENT ENGINEERING IN HIGH 1/0 BGA IMPLEMENTATION I.A. Sterian  Purchase 
    STRENGTH AND LIFETIME ANALYSIS OF SMT SOLDER JOINTS: AN EXEMPLARY STUDY OF THE MINIMELF COMPONENT J. Jendrny  Purchase 
    LOW FREQUENCY IMPEDANCE INVESTIGATION ON AN EPOXIDE RESIN Jane M. Terry  Purchase 
    NEW LEAD-FREE SOLDERS FOR ELECTRONICS PACKAGING AND ASSEMBLY Jennie S. Hwang  Purchase 
    A NEW PRODUCTION LINE FOR LOW COST FLIP CHIP ASSEMBLY Joachim Kloeser  Purchase 
    KEY ELEMENTS IN SUCCESSFUL INTEGRATION OF FLEXIBLE CIRCUITS AND SURFACE MOUNT TECHNOLOGY Joseph Fjelstad  Purchase 
    MOVEMENT OF SOLDER BALLS ON NO-CLEAN ASSEMBLIES Joseph Poole  Purchase 
    HIGH SPEED PC (MEMORY) CARD ASSEMBLY WITH CHIP SCALE BGA Julian P. Partridge  Purchase 
    REVIEW OF CURRENT ISSUES IN LEAD-FREE SOLDERING Kay Nitnmo  Purchase 
    PLACEMENT EQUIPMENT STRATEGIES FOR LOW VOLUME HIGH MIX MANUFACTURING Kevin A. Towle  Purchase 
    FAILURE OF THICK BOARD PLATED THROUGH VIAS WITH MULTIPLE ASSEMBLY CYCLES-- THE HIDDEN BGA RELIABILITY THREAT Kevin T. Knadle  Purchase 
    FLEX CIRCUITRIES OF SILICONES - A MATERIAL WITH HIGH POTENTIALITIES Klaus Feldmann  Purchase 
    ASSESSMENT OF ELECTRICALLY CONDUCTIVE ADHESIVES FOR SMT Klaus Feldmann  Purchase 
    EFFECTS OF PAD SIZE VARIATIONS, SOLDER MASK REGISTRATION, AND SUBSTRATE WARPAGE ON DIRECT CHIP ATTACH ASSEMBLY YIELDS Krishna Kalyan  Purchase 
    REDUCTION OF PIN TEST FALSE FAILURES IN A NO-CLEAN PRODUCTION ENVIRONMENT Kuan-Shaur Lei  Purchase 
    REDUCTION OF PIN TEST FALSE FAILURES IN A NO-CLEAN PRODUCTION ENVIRONMENT Kuan-Shaur Lei  Purchase 
    FLIP CHIP BONDING ON PRINTED CIRCUIT BOARD USING ANISOTROPICALLY CONDUCTIVE ADHESIVE FILM Kyoung H. Kim  Purchase 
    PUTTING BLIND VIAS IN SMD PADS: “WHERE THEY BELONG” Larry W. Burgess  Purchase 
    THE ATTRACTION TO EMERGING REGIONS FOR CONTRACT MANUFACTURERS Leora Lawton  Purchase 
    OPTIMIZATION OF ADHESIVE DEPOSITION FOR MIXED TECHNOLOGY PCB ASSEMBLY Lisa Rielly  Purchase 
    EVALUATION OF ELECTRICAL AND MECHANICAL PERFORMANCE OF DIFFERENT SBU TECHNOLOGIES Mats Lindgren  Purchase 
    CHARACTERIZING AND CONTROLLING THE SMT SCREEN PRINTING PROCESS Michael R. Beck  Purchase 
    SURFACE LAMINAR CIRCUIT1 PRINTED WIRING BOARD AND DIRECT CHIP ATTACH - FLIP CHIP Miguel Jimarez  Purchase 
    CHALLENGES WITH THE BGA PROCESS: THE THICK AND THE THIN Mike Buseman  Purchase 
    BGA ASSEMBLY PROCESS QUALIFICATION AND TRANSFER TO PRODUCTION Nicholas Brathwaite  Purchase 
    FLIP CHIP / BGA HIGH DENSITY “DECAL” PACKAGE P. Nerio  Purchase 
    PARADIGM SHIFT IN INTERCONNECTION TECHNOLOGIES Paul A. Totta  Purchase 
    THE EXPANDING BGA MENU Comparison and Direction of the Exploding Technology Paul Mescher  Purchase 
    SOLDER JOINT DESIGN FOR OPTIMAL MANUFACTURING PROCESS AND FIELD RELIABILITY Pradeep Lall  Purchase 
    REFLOW-CURABLE POLYMER FLUXES FOR FLIP CHIP ASSEMBLY R. Wayne Johnson  Purchase 
    ELECTRICAL PERFORMANCE AND RELIABILITY OF A TBGA WITH A GROUNDED STIFFENER R.D. Schueller  Purchase 
    PROCESS AND DESIGN PARAMETERS TO MINIMIZE TOMBSTONING DURING SURFACE MOUNT REFLOW R.K. Sharma  Purchase 
    MINIMIZING TOTAL COST IN THE CONTRACT MANUFACTURING PROCESS Ralph H. Kenton  Purchase 
    A NEW METHOD OF PRODUCING SOLDER SPHERES FOR CHIP SCALE PACKAGES AND WAFER BUMPING UTILIZING METAL JET TECHNOLOGY Richard Godin  Purchase 
    A NEW METHOD OF PRODUCING SOLDER SPHERES FOR CHIP SCALE PACKAGES AND WAFER BUMPING UTILIZING METAL JET TECHNOLOGY Richard Godin  Purchase 
    SMT COMPONENT SELF-CENTERINGPROPERTIES DURING SOLDER REFLOW Richard Noreika  Purchase 
    SOLDER PASTE DESIGN AND PERFORMANCE FOR FINE PITCH PRINTING Richard R. Lathrop Jr.  Purchase 
    SMT PRINTING PROCESS FOR FINE AND ULTRA FINE PITCH Richard S. Clouthier  Purchase 
    INTEGRATED ASSEMBLY AND TEST CONTRACT MANUFACTURING Rita Pillman  Purchase 
    DESIGN ISSUES FOR FLIP CHIP MODULES Rob Lyn  Purchase 
    ACHIEVING DRAMATIC REDUCTIONS IN SMT DEFECTS Robert A. Williams  Purchase 
    LOCAL BGA QUICK TURNS: ENABLING THERE-MARRIAGE OF FAB, ASSEMBLY& TEST Robert C. Marrs  Purchase 
    RELIABILITY OF MICRO-BGA-ON-FLEX ASSEMBLIES Robert Larmouth  Purchase 
    RELIABILITY OF BALL GRID ARRAY PACKAGES IN AN AUTOMOTIVE ENVIRONMENT Roger Rorgren  Purchase 
    SUCCESSFUL IMPLEMENTATION OF PCMCIA PROCESS Salim Merchant  Purchase 
    IMPLEMENTING NEW TECHNOLOGIES IN THE ELECTRONICS MANUFACTURING SERVICES ENVIRONMENT A Case Study in Ball Grid Array Qualification Sammy Yi  Purchase 
    OPTIMIZATION OF VOIDS IN SOLDER JOINTS AT BOARD-LEVEL BGA ASSEMBLY Sarathy Rajagopalan  Purchase 
    517 WIREBONDED MCM BGA UTILIZING BUILD-UP LAMINATE TECHNOLOGY Satya Chillara  Purchase 
    OPTIMIZATION OF TEMPERATURE PROFILE OF THE THERMAL CYCLING TEST FOR PBGA SOLDER JOINT RELIABILITY Shi-Wei Ricky Lee  Purchase 
    TEKTRONIX PROCESS QUALITY MANAGEMENT CHALLENGE Sue Margolis  Purchase 
    MINIMAL-RESOURCE HYBRID SMT/PTH LINE Tim Strunk  Purchase 
    PHOTODIELECTRIC DRY FILMS FOR ULTRA HIGH DENSITY PACKAGING William E. Estes  Purchase 
    BGA LIFETIME PREDICTIONS: INTERFACE STUDIES, NUMERICAL ANALYSIS AND EXPERIMENTAL COMPARISON Wolfgang H. Muller  Purchase 
    THERMAL FATIGUE ANALYSIS OF BGA SOLDER JOINTS Y.-H. Pao  Purchase 
    NEW STUD BUMPING TECHNOLOGY USING COPPER WIRE Yasuhisa Kaga  Purchase 

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