Surface Mount International 1996 Proceedings

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    TITLE AUTHOR DOWNLOAD
    INTEGRATION OF FLIP CHIP ASSEMBLY WITH SURFACE MOUNT TECHNOLOGY A. James McLenaghan  Purchase 
    IMPACT OF ADVANCED SURFACE MOUNT PACKAGES ON SMT MANUFACTURING PROCESS A. James McLenaghan  Purchase 
    ASSEMBLY DEVELOPMENT OF DIRECT CHIP ATTACH WITH EUTECTIC Pb-Sn SOLDER BUMPS ON ORGANIC SUBSTRATES Abhay Maheshwari  Purchase 
    LOW COST TECHNIQUES FOR FLIP CHIP SOLDERING Andreas Ostmann  Purchase 
    SOLID SOLDER DEPOSITS (SSD): A BARE BOARD SOLUTION FOR HIGH DENSITY PACKAGING Andrew Holzmann  Purchase 
    THE EFFECT OF PBGA SOLDER PAD GEOMETRY ON SOLDER JOINT RELIABILITY Andrew Mawer  Purchase 
    OPTIMIZING CYCLE TIME IN HIGH SPEED SMT LINES Arjun Raman  Purchase 
    MOISTURE INDUCED STRESS SENSITIVITY REDUCTION OF FSRAM 52 LEAD PLCC’S Armando H. Carrasco  Purchase 
    PILOT ASSEMBLY RESULTS WITH A BGA CHIP SCALE PACKAGE Bill Rugg  Purchase 
    EFFECT OF SUBSTRATE CTE ON SOLDER BALL RELIABILITY OF FLIP CHIP PBGA PACKAGE ASSEMBLY Bongtae Han  Purchase 
    LOW-COST FLIP CHIP ASSEMBLY Caroline Beelen  Purchase 
    PROCESS CONTROL OF SOLDER PASTE WITH 1S4000 TOOL Christina L. Sharp  Purchase 
    A MODEL FOR SOLDERABILITY DEGRADATION Christopher Hunt  Purchase 
    LEAD-FREE SOLDER FINE PITCH STENCIL PRINTING Cindy Melton  Purchase 
    SOLDERING ATMOSPHERE OPTIMIZATION: COST ANALYSIS MODEL D. Verbockhaven  Purchase 
    DO SQC TECHNIQUES REALLY WORK? A PRINTED CIRCUIT BOARD MANUFACTURING CASE STUDY Dale W. Wilhite  Purchase 
    CONTRACT MANUFACTURING AND CELLULAR MANUFACTURING Daniel H. Arnold  Purchase 
    PROCESS FEEDBACK SYSTEM Daniel H. Arnold  Purchase 
    WIREBONDABILITY AND SOLDERABILITY OF VARIOUS METALLIC David Hillman  Purchase 
    THE CHANGING LANDSCAPE OF CONTRACT ELECTRONICS MANUFACTURING Denis P. Stradford  Purchase 
    THE EFFECTS OF SOLDER JOINT VOIDING ON PLASTIC BALL GRID ARRAY RELIABILITY Donald R. Banks,  Purchase 
    RESIDUES IN PRINTED WIRING BOARDS AND ASSEMBLIES Douglas Pauls  Purchase 
    OPTIMIZATION OF HEAT TRANSFER IN FULL FORCED CONVECTION REFLOW SOLDERING E.U. Beske  Purchase 
    HIGH FREQUENCY SURFACE MOUNT INDUCTORS Eduardo L. Acuna  Purchase 
    EFFECT OF THERMAL AGING ON THE MICROSTRUCTURE AND RELIABILITY OF BALL GRID ARRAY (BGA) SOLDER JOINTS Edwin Bradley  Purchase 
    TESTING AND QUALIFICATION OF HFE/CO-SOLVENT CLEANING AGENTS IN VAPOR DECREASING APPLICATIONS Elizabeth A. Bivins  Purchase 
    PARAMETRIC STUDY ON THE SOLDERABILITY OF ETCHED PWB COPPER F. M. Hosking  Purchase 
    MODELING THE UNDERFILL FLOW PROCESS G. Lehmann  Purchase 
    ADVANCED SOLDER FLIP CHIP PROCESSES G. Rinne  Purchase 
    SURFACE FINISHES: METALLIC COATINGS OVER NICKEL OVER COPPER George Milad  Purchase 
    CLEANING OF CIRCUIT CARD ASSEMBLIES OF RESIDUAL RMA FLUX Govind Vazirani  Purchase 
    FATIGUE PROPERTIES OF BGA SOLDER JOINTS: A COMPARISON OF THERMAL AND POWER CYCLE TESTS Hans-Jurgen Albrecht  Purchase 
    EXPERIENCES WITH TECHNOLOGIES FOR THE REPAIR OF BGA-BOARDS Helmut Kergel  Purchase 
    TWO METAL LAYER TAPE FOR TAB BALL GRID ARRAY Hiroki Tanaka,  Purchase 
    THE PERFORMANCE AND CHARACTERISTICS OF THE IMIDAZOLE COATING J. L. Parker, Jr.  Purchase 
    USING STATISTICAL PROCESS CONTROL (SPC) TO MONITOR A REFLOW OVEN J. Pierre Menard  Purchase 
    PBGA SOLDER JOINT RELIABILITW MANUFACTURABILITY AS A FUNCTION OF PCB PAD SIZE Jason D. Brown  Purchase 
    SOLDER RELIABILITY SOLUTIONS: A PC-BASED DESIGN-FOR-RELIABILITY TOOL Jean-Paul Clech  Purchase 
    NCMS SURFACE FINISH TESTING Jim Reed  Purchase 
    CIRCUIT BOARD REPAIR AND ENGINEERING CHANGE FOR BGA John G. Davis  Purchase 
    CRACKED CAPACITORS: CAUSES AND SOLUTIONS John Maxwell  Purchase 
    HIGHLY INTEGRATED TERMINATION SOLUTIONS John Nemec  Purchase 
    ORGANIC SOLDERABILITY PRESERVATIVES: BENZOTRIAZOLES AND SUBSTITUTED BENZIMIDAZOLES Joseph D. DeBiase  Purchase 
    COMPLIANCY MODELING OF AN AREA ARRAY CHIP SCALE PACKAGE Joseph Fjelstad  Purchase 
    CERAMIC BGA SOLDER BALL TO SUBSTRATE AND CARD PAD ALIGNMENT K. Berger  Purchase 
    OPTIMIZATION OF SOLDER VOLUME FOR AREA ARRAY PACKAGING APPLICATIONS K.J. Wolter  Purchase 
    FUNDAMENTALS OF PSA AND HEAT ACTIVATED COVER TAPE SEALING FOR COMPONENTS PACKAGED IN TAPE AND REEL Kenneth C. Thompson  Purchase 
    FLIP CHIP AITACH SOLDER DEPOSITION ALTERNATIVES Kenneth M. Fallen  Purchase 
    HIGH FREQUENCY CHARACTERISTICS OF ANNULAR BURIED RESISTORS IN PRINTED CIRCUIT BOARDS Kenneth P.S. Tan  Purchase 
    REEL TO REEL ASSEMBLY MADE POSSIBLE WITH FLEX CIRCUITRY Kevin Corrigan  Purchase 
    FUTURE EXPECTATIONS OF ELECTRONIC MANUFACTURING SERVICES Kevin Terrill  Purchase 
    MOISTURE SENSING AND STRESS TEST CHIPS FOR PLASTIC PACKAGING QUALIFICATION L.T. Nguyen  Purchase 
    KNOWN GOOD DIE VERSUS CHIP SIZE PACKAGE: OPTIONS, AVAILABILITY, MANUFACTURABILITY AND RELIABILITY Lany Gilg  Purchase 
    PLASTIC BALL GRID ARRAY ATTACHMENT: ASSEMBLY AND RELIABILITY PERFORMANCE Leo Anderson  Purchase 
    COMPUTATIONAL MODELING OF DIRECT MOLTEN SOLDER DELIVERY FOR BALL GRID ARRAY APPLICATIONS M. Essien  Purchase 
    SHOCK AND VIBRATION LIMITSFOR CBGA AND CCGA Marie S. Cole  Purchase 
    COST- PERFORMANCE ANALYSIS OF HIGH PIN COUNT SURFACE MOUNT PLASTIC IC PACKAGES Martin P. Goetz  Purchase 
    EFFECTS OF COMPONENT SOLDERABILITY ON SOLDER FILLET SHAPE AND PROCESS YIELD Martin Wickham  Purchase 
    A SILICON MICROBENCH CONCEPT FOR OPTOELECTRONIC PACKAGING Michael Pocha  Purchase 
    ELECTRICALLY CONDUCTIVE ADHESIVES FOR SURFACE MOUNT SOLDER REPLACEMENT Michael Zwolinski  Purchase 
    IMPLEMENTATION AND PRODUCTION TEST RESULTS OF A CLOSED LOOP CONTROL OF ATMOSPHERES FOR SOLDERING N. Saxena  Purchase 
    ALUMINUM NITRIDE LAND GRID ARRAY FOR HIGH PERFORMANCE PACKAGING APPLICATIONS Nobuo Iwase  Purchase 
    DETERMINATION OF THE SERVICE LIFE OF ELECTRONIC COMPONENTS BY FINITE ELEMENT ANALYSIS P.R. Winter  Purchase 
    RELIABILITY EVALUATION OF A NOVEL SURFACE LAMINAR CIRCUIT PROCESS: AN APPROACH TO COST-EFFECTIVE MCM-L Per Carlsson  Purchase 
    ASSEMBLY LINE DEFINITION FOR FLEXIBLE BGA PACKAGE MANUFACTURING Philip Momin  Purchase 
    TIN-PLATING, TIN-NICKEL ELECTROPLATE AND TIN-PLATING OVER NICKEL AS FINAL FINISHES ON COPPER Phillip E. Hinton  Purchase 
    ADHESION ISSUES AT EPOXY UNDERFILL / SOLDER MASK INTERFACES R. A. Pearson  Purchase 
    IMPLEMENTATION OF FLIP CHIP TECHNOLOGY FOR BGA PACKAGES R. Aschenbrenner  Purchase 
    RELIABILITY RESULTS FOR A WIRE BONDABLE TAPE BALL GRID ARRAY PACKAGE R. D. Schueller  Purchase 
    DEVELOPMENT AND QUALIFICATION OF A PLASTIC BALL GRID ARRAY REPLACEMENT PROCESS R. Glenn Robertson  Purchase 
    A NEW PLASTIC CHIP CARRIER (PCC] PACKAGE R. Joshi  Purchase 
    BUMPING PROCESS FOR 40-MIL PBGA R.T. Chen  Purchase 
    APPLICATION OF EUTECTIC SOLDER USING SOLDER JETTING TECHNOLOGY Rick Godin  Purchase 
    A NEW BGA PACKAGE FOR HIGH DENSITY APPLICATIONS Robert Darveaux  Purchase 
    THE IMPACT OF CHIP SCALE PACKAGES ON THE SMT ASSEMBLY PROCESS Robert J. Black, Jr.  Purchase 
    HIGH DENSITY SURFACE MOUNT ASSEMBLIES BASED ON FLEX SUBSTRATES Robert Larmouth  Purchase 
    EMERGING TECHNOLOGY DEMANDS FOR THE CONTRACT MANUFACTURER: “Time to Technology” Roger Liptak  Purchase 
    APPLICATION REALITIES OF CHIP SCALE PACKAGING Ronald Malfatt  Purchase 
    STATISTICAL NEURAL NETWORK MODELING FOR STENCIL PRINTING Roop L. Mahajan  Purchase 
    FLIP CHIP FOR FLEX APPLICATIONS S. Arndt  Purchase 
    ELECTRONICS MANUFACTURING SERVICES: CONTRACTORS AND CUSTOMERS KEEP IT HOT Sandra Fox  Purchase 
    TIN/LEAD COATING DIRECTLYON COPPER Shelgon Yee  Purchase 
    EFFECT OF CHIP DIMENSION AND SUBSTRATE THICKNESS ON SOLDER JOINT RELIABILITY OF PLASTIC BGA PACKAGE Shi-Wei Ricky Lee  Purchase 
    REWORK PROCESS FOR CHIP SCALE COMPONENTS Stanley F. Kench  Purchase 
    A MACHINE-VISION BASED APPROACH TO LOW-COST OPTOELECTRONIC PACKAGING Stanley K. Ault  Purchase 
    NON-PRECIOUS METAL COATINGS FOR FINE PITCH ASSEMBLY AND DIRECT CHIP ATTACHMENT Steve Beigle  Purchase 
    THE ASSEMBLY LINE IN THE NEW MILLENNIUM Steve Dickerson  Purchase 
    CRITICAL ISSUES WITH CHIP SCALE PACKAGES (CSPS) Steve Greathouse  Purchase 
    FLEXIBLE CIRCUIT COVER COATING TECHNIQUES FOR SMT Steven E. Dean  Purchase 
    OFFSHORE MANUFACTURING TRENDS: OVERVIEW FROM A GLOBAL CONTRACT MANUFACTURER Sundra Raj  Purchase 
    AN APPROACH TO THE ANISOTROPIC CONDUCTIVE ADHESIVES FOR MICRO-INTERCONNECTION TECHNOLOGY Takao Komukai  Purchase 
    CONCEPTS TOWARD LIFETIME ANALYSIS OF BGA STRUCTURES Torsten Hauck  Purchase 
    MOISTURE ABSORPTION AND AUTOCLAVE PERFORMANCE OPTIMIZATION OF GLOB TOP BALL GRID ARRAY Trent Thompson  Purchase 
    A MICRO FLIP CHIP PROCESS FOR HIGH SPEED OPTOELECTRONIC COMPONENTS Tun S. Tan  Purchase 
    ASSESSMENT OF CIRCUIT BOARD SURFACE FINISHES FOR ELECTRONIC ASSEMBLY WITH LEAD-FREE SOLDERS U. Ray  Purchase 
    CHIP-SCALE BALL GRID ARRAY PACKAGING FOR SURFACE MOUNT TECHNOLOGY Vern Solberg  Purchase 
    THERMAL PROPERTIES OF FLIP CHIP ENCAPSULANT Wei Koh  Purchase 
    ENGINEERING SOLDER PASTE PERFORMANCE VIA CONTROLLED STRESS RHEOLOGY ANALYSIS Xiaohua Bao  Purchase 
    AN ALTERNATIVE SURFACE FINISH FOR TIN/LEAD SOLDERS: PURE TIN Y. Zhang  Purchase 

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