Pan Pacific Symposium 2004 Proceedings

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    TITLE AUTHOR DOWNLOAD
    IMPROVED EMC DESIGN FOR 3D MICROELECTRONICS PACKAGING A. Brandolini, A. Gandelli and R.E. Zich  Purchase 
    NO-FLOW UNDERFILL TECHNOLOGY FOR FLIP-CHIP BONDING Akira Ohuchi, Tomoo Murakami, and Tsutomu Kawata  Purchase 
    A STUDY OF THE SELF-CENTERING PHENOMENON IN PB-FREE SURFACE MOUNT ASSEMBLY Amey Teredesai et al.  Purchase 
    ADHESION OF GREEN FLEXIBLE MOLDING COMPOUNDS TO PREPLATED LEADFRAMES Anthony A. Gallo et al.  Purchase 
    STRUCTURAL FINITE ELEMENTAL MODELING OF A MULTILAYERED PLATED THROUGH-HOLE - EFFECT OF MATERIAL PROPERTIES Arun Gowda et al.  Purchase 
    MULTI CHIP PACKAGE IMPROVES HARD DISK DRIVE EMI PERFORMANCE Bill Rugg  Purchase 
    IMBEDDED COMPONENT / DIE TECHNOLOGY: AN INNOVATIVE PACKAGING SOLUTION FOR HIGH RELIABILITY Casey Hatcher  Purchase 
    CONTRACT MANUFACTURING STRATEGIES ADDRESSING THE CHANGING GLOBAL LANDSCAPE Charlie Barnhart  Purchase 
    BEHAVIOR OF PACKAGE WITH INTEGRATED HEAT SPREADER Cheng Siew Tay et al.  Purchase 
    M3D(TM) TECHNOLOGY MAKES BOND PAD ECOS A SNAP Dr. Bruce King and Dr. Marcelino Essien  Purchase 
    MECHANICAL STRESS CONTROL AND MANAGEMENT IN THE ASSEMBLY PROCESSES FOR Sn-Pb AND Pb-FREE SYSTEM *PHASE II - LEAD-FREE PROCESS AND PRODUCT TRANSITION Dr. Paul P.E. Wang et al.  Purchase 
    CORRELATION OF SOLDER JOINT RELIABILITY OF µPGA SOCKET TO PACKAGE FLATNESS AND PCB WARPAGE *PHASE I - PCB WARPAGE UNDER THERMAL REFLOW BY MOIRE... Dr. Paul P.E. Wang et al.  Purchase 
    LASER ASSISTED ASSEMBLY FOR NCP, ACF AND SOLDER INTERCONNECTION E. Zakel, T. Teutsch, G. Azdasht, and P. Penke  Purchase 
    ELECTROCHEMICAL MIGRATION ON HASL PLATED FR-4 PRINTED CIRCUIT BOARDS Elissa Bumiller et al.  Purchase 
    MATERIALS AND MANUFACTURING ISSUES IN MEMORY MODULES - WAFER THINNING Evelyn Baldwin / Wei Koh  Purchase 
    X-RAY INSPECTION FOR MICROELECTRONICS LATEST DEVELOPMENTS Friedhelm Maur  Purchase 
    JETTING: DISCRETE DISPENSING OF HIGH VISCOSITY FLUID H. Quinones, A. Babiarz, E. Fiske, L. Fang  Purchase 
    MECHANICAL STRESS CONTROL AND MANAGEMENT IN THE ASSEMBLY PROCESSES FOR Sn-Pb AND Pb-FREE SYSTEM *PHASE I - A METHODOLOGY FOR... Hana Hsu et al.  Purchase 
    EVALUATING TECHNOLOGIES FOR TESTING HIGH SPEED HIGH DENSITY BALL GRID ARRAY PACKAGES Ila Pal  Purchase 
    APPLICATION OF MAINSTREAM CAD/CAE TOOLS FOR MEMS Ilya Mirman  Purchase 
    THE EFFECT OF MATERIAL PROPERTIES AND LENS CHARACTERISTICS ON UHF SAM INSPECTIONS James C. P. McKeon  Purchase 
    DEPARTMENT OF DEFENSE OVERVIEW IN NANOTECHNOLOGY James Short and Clifford Lau  Purchase 
    DEVELOPMENT OF A RESOLUTION TEST WAFER FOR USE IN ACOUSTIC MICROSCOPY OF MICROELECTRONIC DEVICES Janet E. Semmens et al.  Purchase 
    SURFACE-MOUNTING OF POWER DEVICES TO ALUMINUM HEAT SINKS Jim Fraivillig  Purchase 
    APPLICATIONS OF IN-SITU HEALTH-MONITORING AND PROGNOSTIC SENSORS Jingsong Xie and Michael Pecht  Purchase 
    NOVEL METHODS FOR CREATING STACKED DEVICE STRUCTURES USING MODIFIED STANDARD PACKAGES Joseph Fjelstad  Purchase 
    TACTICAL PRODUCTION PLANNING FOR PRINTED CIRCUIT BOARD ASSEMBLY K. Sivakumar, K. Srihari, D. Warheit, and A. Gowda  Purchase 
    STUDY OF ENCAPSULATION PROCESS AND MATERIALS FOR MATRIX ARRAY OVER-MOLDED FLIP CHIP CSP Kai-Chi Chen et al.  Purchase 
    IMPACTS OF BULK PHOSPHOROUS CONTENT OF ELECTROLESS NICKEL LAYERS TO SOLDER JOINT INTEGRITY AND THEIR USE AS GOLD- AND ALUMINUM-WIRE BOND SURFACES Kuldip Johal et al.  Purchase 
    ELECTROLESS NICKEL / ELECTROLESS PALLADIUM / IMMERSION GOLD PLATING PROCESS FOR GOLD- AND ALUMINUM-WIRE BONDING DESIGNED FOR HIGH-TEMP APPS Kuldip Johal, Sven Lamprecht, and Hugh Roberts  Purchase 
    CONSIDERATIONS IN HIGH VOLUME FLIP CHIP MANUFACTURING Lou Nicholls, Paul Mescher and Dave McCann  Purchase 
    FLIP CHIP PACKAGING - CURRENT TRENDS AND ROADMAP Maniam Alagaratnam  Purchase 
    INDIUM SOLDERING FOR A MOEMS BASED SAFETY AND ARMING DEVICE Michael Deeds et al.  Purchase 
    ADVANCED LTCC PROCESSES USING PRESSURE ASSISTED SINTERING Michael Hintz et al.  Purchase 
    NEW UNDERFILL ADHESIVE FOR FLIP CHIP BGA N. Imaizumi, T. Yagi, H. Date, and E. Horikoshi  Purchase 
    THE WORLDWIDE ELECTRONICS MANUFACTURING MARKETCHANGES IN GEOGRAPHY AND PRODUCTS Randall Sherman  Purchase 
    THE NAVY’S PROGRAM IN NANOSCIENCE AND NANOTECHNOLOGY - A LOOK AHEAD Robert Kavetsky  Purchase 
    PACKAGE DEVELOPMENT FOR HIGH MOISTURE AND REFLOW SENSITIVITY LEVELS Robert Warren  Purchase 
    EVALUATION OF THE EFFECTS OF PROCESSING CONDITIONS ON SHEAR STRENGTH AND MICROSTRUCTURE IN PB-FREE SURFACE MOUNT ASSEMBLY S. Bukhari, D. Santos, L. Lehman, and E. Cotts  Purchase 
    COPPER ELECTROPLATING FOR HIGH DENSITY 3D THROUGH SILICON VIA INTERCONNECTS S. Spiesshoefer and L. Schaper  Purchase 
    EPOXY/BaTiO3 COMPOSITE FILMS AND PASTES FOR HIGH DIELECTRIC CONSTANT AND LOW TOLERANCE EMBEDDED CAPACITORS FABRICATION IN ORGANIC SUBASTRATES S.-D. Cho, K.-W. Jang, J.-G. Hyun, and K.-W. Paik  Purchase 
    TECHNICAL CHALLENGES IN MEMORY PACKAGING Se Yong Oh and Dong Ho Lee  Purchase 
    TERNARY INTERMETALLIC COMPOUND - A REAL THREAT TO BGA SOLDER JOINT RELIABILITY Shelgon Yee, Ph. D., et al.  Purchase 
    EFFICIENCY IMPROVEMENT OF BLUE ORGANIC LIGHT EMITTING DIODES WITH NANOSCALE DISPERSING EMISSION ZONE LAYERS Shih-Ching Lin et al.  Purchase 
    LOW TEMPERATURE BONDING OF AU-AU IN NON-VACUUM ENVIRONMENT USING SURFACE ACTIVATED METHOD Su-Tsai Lu, Yao-Sheng Lin, and Yuan-Chang Huang  Purchase 
    COST CONSIDERATIONS, MARKET TRENDS AND TECHNOLOGY FOR IMPROVING MICROELECTRONICS Terence Q. Collier  Purchase 
    ASSEMBLY IMPROVEMENTS BY CONTROLLING PLACEMENT Terence Q. Collier  Purchase 
    POST-PASSIVATION LAYERS: DEVICE ENHANCEMENT AT THE WAFER LEVEL Thomas Goodman and Peter Elenius et al.  Purchase 
    JOINT TECHNOLOGY OF FPC AND FPC WHICH USES ACF Tomiyo Ema  Purchase 
    BOARD-LEVEL ASSEMBLY AND RELIABILITY TESTING FOR STACKED CHIP SCALE IC PACKAGING Vern Solberg  Purchase 
    SIMULATION TECHNOLOGY FOR PREDICTION LIFETIME OF FLIP CHIP Yasuo Michinaka, Yoshihiro Ono, Kosuke Azuma  Purchase 
    A KEY ROLE OF PRINTED CIRCUIT BOARD IN RECENT PACKAGING TECHNOLOGY Yutaka Tsukada  Purchase 
    MEMS APPLICATIONS IN ORDNANCE AND DEFENSE RELATED SYSTEMS Zafer Tuncali et al.  Purchase 

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