SMTA International 2003 Proceedings

While abstracts in the Knowledge Base are accessible to all visitors, the full articles (PDF format) are FREE FOR SMTA MEMBERS to download:

  • Already a member? Log in to download articles.
  • Not a member? Pay just $10 per article or become a member today!
  • < Back to Conferences List



    TITLE AUTHOR DOWNLOAD
    BOARD LEVEL ASSEMBLY AND RELIABILITY CONSIDERATIONS FOR QFN TYPE PACKAGES Ahmer Syed and WonJoon Kang  Purchase 
    CONSIDERATIONS IN THE DEVELOPMENT OF AN 0201 COMPONENT ASSEMBLY PROCESS Alan Rae, Joe Renda, and Joe Belmonte  Purchase 
    THE EFFECT OF NITROGEN REFLOW SOLDERING IN A LEAD-FREE PROCESS Anders Åström  Purchase 
    THE NEXT-GENERATION INFORMATION EXCHANGE FRAMEWORK FOR ELECTRONICS MANUFACTURING: FRAMEWORK IMPLEMENTATION PROJECT FROM THE GEORGIA INSTITUTE OF TECH Andrew Dugenske et al.  Purchase 
    A COMPARISON BETWEEN POWER AND THERMAL CYCLING FOR A FC PBGA Andrew Mawer, D. Hodges Popps, and G. Presas  Purchase 
    ODM OR CDM? Bill Coker  Purchase 
    JOINT GROUP ON POLLUTION PREVENTION LEAD-FREE SOLDER PROJECT Brian E. Greene  Purchase 
    NEMI LEAD-FREE ASSEMBLY PROJECT: COMPARISON BETWEEN PbSn AND SnAgCu RELIABILITY AND MICROSTRUCTURES Carol Handwerker et al.  Purchase 
    LEAD-FREE WAVE SOLDERING - TIGHTER PROCESS WINDOWS NEED TIGHTER PROCESS CONTROLS Chrys Shea and *Keith Howell  Purchase 
    REDUCING VARIATION IN OUTSOURCED SMT MANUFACTURING THROUGH THE USE OF INTELLIGENT STENCIL SYSTEMS Chrys Shea, Valentijn Van Velthoven, and Ron Tripp  Purchase 
    EVALUATION OF WIRE BONDING PERFORMANCE, PROCESS CONDITIONS, AND METALLURGICAL INTEGRITY OF CHIP ON BOARD WIRE BONDS Daniel T. Rooney, Ph.D. et al.  Purchase 
    MANUFACTURING AND RELIABILITY OF PB-FREE AND MIXED SYSTEM ASSEMBLIES (SNPB/PB-FREE) IN AVIONICS ENVIRONMENTS Dave Nelson and Hector Pallavicini et al.  Purchase 
    IMPLICATIONS OF USING LEAD-FREE SOLDERS ON X-RAY INSPECTION OF FLIP CHIPS AND BGAS David Bernard  Purchase 
    CONSIDERATIONS FOR MINIMIZING RADIATION DOSES TO COMPONENTS DURING X-RAY INSPECTION David Bernard et al.  Purchase 
    EMERGING AOI TECHNOLOGY - 2004 AND BEYOND David Doyle  Purchase 
    INVESTIGATION OF SOLDER/FLUX RESIDUE EFFECT ON RF SIGNAL INTEGRITY USING REAL CIRCUITS David Geiger and Dr. Dongkai Shangguan  Purchase 
    RELIABILITY STUDY OF SOLDER JOINTS FOR 0201 COMPONENTS David Geiger et al.  Purchase 
    TECHNICAL ASSESSMENTS AND COST ANALYSIS OF THE EMBEDDED PASSIVE TECHNOLOGIES IN THE MULTI-LAYER CIRCUIT BOARDS (Part I - Resistance) Dominique Numakura  Purchase 
    TOTAL PROCESS CONTROL AND MANAGEMENT- FROM RELIABILITY, STABILITY, TRACEABILITY TO PREDICTABILITY (RSTP) Dr. Paul P.E. Wang et al.  Purchase 
    EPOXY FLUX BRIDGES THE GAP TO LOW COST NO-CLEAN FLIP CHIP ASSEMBLY Dr. Wusheng Yin et al.  Purchase 
    FILLED NO-FLOW UNDERFILLING - PROCESS AND MATERIALS Dr. Wusheng Yin, Dr. H-S Hwang, and Dr. N-C Lee  Purchase 
    EVALUATING THE EFFECT OF SOLDER PASTE RESIDUES ON RF SIGNALS BETWEEN 5 AND 10 GHZ Dwayne R. Shirley et al.  Purchase 
    NO WINNERS HERE: COVERT MONEY LOSSES IN OUTSOURCED ELECTRONICS MANUFACTURING PROGRAMS Edwin B. Smith, III  Purchase 
    SOLDER JOINT RELIABILITY ASSESMENT OF Sn-Ag-Cu BGA COMPONENTS ATTACHED WITH EUTECTIC Pb-Sn SOLDER Fay Hua et al.  Purchase 
    IMPACT OF MICROVIA-IN-PAD DESIGN ON VOID FORMATION Frank Grano et al.  Purchase 
    FLIP CHIP ON STANDARD LEAD FRAME: LOWERING THE COST OF FLIP CHIP OWNERSHIP Frank Juskey  Purchase 
    DFN, A LEAD FRAME SIP FOR WIRELESS Frank Juskey  Purchase 
    DIE ATTACH REWORK - PROCESS COMPARISON Fulvio Fontana  Purchase 
    USING "SIGNATURE IDENTIFICATION" FOR RAPID AND EFFECTIVE X-RAY INSPECTION OF BALL GRID ARRAYS Gil Zweig  Purchase 
    2D OR NOT 2D, THAT IS THE QUESTION! Glenn Wyllie and Mark Norris  Purchase 
    ALTERNATIVE LEAD FREE BALL MATERIALS WITH IMPROVED INTERFACE PROPERTIES H.-J. Albrecht et al.  Purchase 
    HOW TO SOLDER NON-STANDARD CBGAs OF 1.0mm PITCH Haoqiang Song and Zhe Liu  Purchase 
    ASSEMBLY ISSUES WITH MICROVIA TECHNOLOGIES Harjinder Ladhar and Sundar Sethuraman  Purchase 
    APPLYING SIX SIGMA TECHNIQUES TO CONTROL SCRAP COSTS AND IMPROVE QUALITY IN SMT MANUFACTURING Hersh Kohli and *SooBeng Khoh, Ph.D.  Purchase 
    CAPITAL EQUIPMENT PRODUCTION Ian McEvoy  Purchase 
    LEVERAGING MAINSTREAM DESIGN & ANALYSIS TOOLS FOR MEMS Ilya Mirman  Purchase 
    NEMI TIN WHISKER TEST METHOD STANDARDS Irina Boguslavsky  Purchase 
    SOLDER PASTE STENCIL PRINTING PERFORMANCE BASED ON STENCIL AND SOLDER PASTE TECHNOLOGY James Adriance et al.  Purchase 
    EVALUATION OF LEAD-FREE SOLDER BONDS AND EFFECTS OF THE LEAD-FREE PROCESS ON DEVICES USING ACOUSTIC MICRO IMAGING Janet E. Semmens  Purchase 
    THERMALLY INDUCED OUT OF PLANE DEFORMATION ANALYSIS FOR A FLIP CHIP ON FLEX 35MM TBGA Jennifer Muncy et al.  Purchase 
    USE OF SUBSTRATE ETCHBACK TECHNOLOGY AND ROTATED DIE PLACEMENT TO ACHIEVE HIGH DENSITY INTERCONNECT Jesse Phou  Purchase 
    IN SEARCH OF THE PERFECT BOM Jim Arnold  Purchase 
    SOLID-METAL THERMAL COLUMNS IN CONVENTIONAL PCBs Jim Fraivillig  Purchase 
    BLACK PAD DEFECT: INFLUENCE OF GEOMETRY AND OTHER FACTORS Jodi Roepsch, Robert Champaign, and Barbara Waller  Purchase 
    IMPROVING THE ACCEPTANCE OF FLIP CHIP John Davis et al.  Purchase 
    TOWARDS WAFER-SCALE MEMS PACKAGING: A REVIEW OF RECENT ADVANCES John Heck and Steve Greathouse  Purchase 
    CLEANING NEW SOLDER PASTE FORMULATIONS WITH A UNIQUE LOW-VOC AQUEOUS CLEANING AGENT John R. Sanders et al.  Purchase 
    THE DEVELOPMENT OF ADVANCED X-RAY INSPECTION Jon C. Dupree  Purchase 
    EMERGING TRENDS IN SELECTIVE SOLDERING TECHNOLOGY Jonathan Wol and Adrian De’ath  Purchase 
    AN EXAMINATION OF 'DRY BOX' DESICCANT STORAGE WITHIN THE PCB MANUFACTURING ENVIRONMENT Kevin McCarten  Purchase 
    EFFECT OF PRINTED WIRING BOARD WARPAGE ON BALL GRID ARRAYS OVER TEMPERATURE Kyra Ewer and Jeffrey Seekatz  Purchase 
    ELECTROLESS WAFER-LEVEL REDISTRIBUTION - FURTHER DEVELOPMENT AND NEW APPROACHES FOR SYSTEM INTEGRATION L. Boettcher et al.  Purchase 
    THIN ARRAY POLYMER PACKAGING FOR RF MODULES Leo M. Higgins III, Ph.D  Purchase 
    INTEGRATING COMMERCIAL OFF THE SHELF PACKAGES (COTS) INTO GUIDED MISSILE SYSTEMS: THE EMMA PROGRAM Leopold A. Whiteman, Jr.  Purchase 
    ORGANIC FLIP CHIP PACKAGING DESIGN AND MANUFACTURING CHALLENGES Louis Liu et al.  Purchase 
    EVALUATION OF SEMICONDUCTOR PACKAGE RELIABILITY WITH FOUR METAL LAYER PLASTIC BALL GRID ARRAY LAMINATE SUBSTRATES Lucy Grace Dearce et al.  Purchase 
    SELECTIVE SOLDERING WITH LEAD-FREE ALLOYS Marc Dalderup et al.  Purchase 
    LEAD-FREE CARD ASSEMBLY AND REWORK FOR COLUMN GRID ARRAYS Marie Cole et al.  Purchase 
    FEASIBILITY ANALYSIS METHODOLOGY FOR STACKED-DIE VS. SINGLE-DIE PACKAGE CONSIDERATIONS Mark Gerber and Shawn O’Connor  Purchase 
    LONG TERM RELIABILITY OF 0.8MM PITCH BGA PACKAGES DOUBLE-SIDE MOUNTED ON A THIN PRINTED CIRCUIT BOARD Mark Logterman et al.  Purchase 
    SOLDER JOINTS FOR HIGH TEMPERATURE ELECTRONICS Mathias Nowottnick et al.  Purchase 
    HAND PLACING LEADLESS AND FINE PITCH LEADED COMPONENTS WITH SIPAD SOLID SOLDER DEPOSITION Matthew J. Kehoe  Purchase 
    INTEGRATION OF AOI IN A TOTAL QUALITY MANAGEMENT PROGRAM Matthew T. Holzmann  Purchase 
    EVALUATION, OPTIMIZATION, AND RELIABILITY OF NO-FLOW UNDERFILL PROCESS Michael Colella  Purchase 
    CAPITAL EQUIPMENT JUSTIFICATION AND APPROVAL Michael R. Weekes  Purchase 
    INCREASE YIELD THROUGH MACHINE PERFORMANCE OPTIMIZATION Michael Sivigny  Purchase 
    DESIGNED FOR THE ENVIRONMENT CLEANING TECHNOLOGY MORE WITH LESS Mike Bixenman  Purchase 
    MEASUREMENT OF MATERIALS PROPERTIES OF LEAD-FREE SOLDERS FOR MODELLING REQUIREMENTS Milos Dusek and Christopher Hunt  Purchase 
    CHARACTERIZATION OF MECHANICAL PERFORMANCE OF SN/AG/CU SOLDER JOINTS WITH DIFFERENT COMPONENT LEAD COATINGS Minna Arra et al.  Purchase 
    PROCESS CHALLENGES AND SOLUTIONS FOR EMBEDDING CHIP-ON-BOARD INTO MAINSTREAM SMT ASSEMBLY Mukul Luthra  Purchase 
    DFX USING DPMO REDUCES THE COST OF PCB ASSEMBLY Neil Donga et al.  Purchase 
    QUAD FLAT PACK NO LEAD (QFN) BOARD LEVEL RELIABILITY STUDY FOR AUTOMOTIVE APPLICATIONS Pamela O’Brien1 and Thomas Koschmieder2  Purchase 
    HIGH PIN COUNT POWER PACKAGE FOR HIGH CURRENT, HIGH TEMPERATURE AUTOMOTIVE APPLICATIONS Paolo Casati et al.  Purchase 
    RELIABILITY OF 15MM, 0.65 MM PITCH MOLD ARRAY PROCESS (MAP) BALL GRID ARRAY (BGA) FOR AUTOMOTIVE APPLICATIONS Patrice Langford and Thomas Koschmieder  Purchase 
    OPTIMISING ASSEMBLY PROCESS TO ACCOMMODATE OSP FINISH ON PRINTED CIRCUIT BOARDS Paul Doyle, Dirk Eickenhorst and Werner Laub  Purchase 
    REWORK OF BGA/CSP COMPONENTS USING LEAD FREE SOLDERS Paul Wood  Purchase 
    DAMAGE RELATIONSHIPS FOR BGA AND CSP RELIABILITY IN AUTOMOTIVE UNDERHOOD APPLICATIONS Pradeep Lall et al.  Purchase 
    SIX SIGMA BUSINESS SCORECARD Praveen Gupta  Purchase 
    0201 TECHNOLOGY IMPLEMENTATION STRATEGY FOR CEMs Reggie Malli  Purchase 
    VISUAL AND X-RAY INSPECTION CHARACTERISTICS OF EUTECTIC AND LEAD FREE ASSEMBLIES Reza Ghaffarian, Ph.D.  Purchase 
    VIBRATION BEHAVIOR OF CSP ASSEMBLIES WITH AND WITHOUT UNDERFILL Reza Ghaffarian, Ph.D. and *Namsoo Kim  Purchase 
    EMBEDDING CERAMIC THICK-FILM RESISTORS AND CAPACITORS IN PRINTED CIRCUIT BOARDS Richard Snogren  Purchase 
    TAKING DFX TO THE NEXT LEVEL Richard Tormet  Purchase 
    USE OF SIX SIGMA METHODOLOGIES IN ELECTRONICS PROCESSING INDUSTRIES Rita Mohanty, Ph.D.  Purchase 
    LOW COST COMPUTING FOR THE SMALL BUSINESS ELECTRONICS CONTRACT MANUFACTURER Romeo Asuncion  Purchase 
    LEADED AND LEAD-FREE SOLDER PASTE EVALUATION SCREENING PROCEDURE Ronald C. Lasky, Ph.D., PE et al.  Purchase 
    EFFECTS OF THERMAL INTERFACE MATERIAL ON SOLDER JOINT RELIABILITY Ross Wilcoxon and Dave Hillman  Purchase 
    GETTING SMALL WITH DIP PEN NANOLITHOGRAPHY S. Cruchon-Dupeyrat  Purchase 
    ULTRA HIGH-TEMPERATURE PRESSURE SENSITIVE ADHESIVE FOR ELECTRONICS ASSEMBLY S. Jimmy Hwang, Ph.D.  Purchase 
    CASE STUDIES IN THE EVALUATION OF MOISTURE SENSITIVE LEVEL (MSL) AND RELIABILITY OF DEVICES FOR HIGH RELIABILITY (HIGH-REL) APPLICATIONS S. R. Martell  Purchase 
    CURE PROCESSING EFFECT ON CONDUCTIVE EPOXY ADHESIVES AS SOLDER ALTERNATIVES: CERAMIC APPLICATIONS S. Smith, C-M Cheng, W. O’Hara, and V. Buffa  Purchase 
    A COMPARATIVE ANALYSIS OF LEAD FREE MATERIALS AND PROCESSES USING DESIGN OF EXPERIMENTS TECHNIQUES Sammy Shina et al.  Purchase 
    EFFECTS OF VIA PLUGGING IN MULTILAYER PRINTED CIRCUIT BOARDS Santhana Satagopan and Manthos Economou  Purchase 
    MINIATURIZATION USING 3-D STACK STRUCTURE FOR SIP APPLICATIONS Serguei Stoukatch et al.  Purchase 
    CLEANING OUT HIGH COST OF OWNERSHIP WITH PERFORMANCE ADVANCEMENTS Shean R. Dalton  Purchase 
    A SIMULATION-BASED CONTROL AND ANALYSIS ARCHITECTURE FOR ELECTRONICS MANUFACTURING PROCESSES Sreeram Ramakrishnan et al.  Purchase 
    PROCESS OPTIMIZATION FOR MINIMIZING VOIDS IN CERAMIC DIMPLED BALL GRID ARRAYS Steven H. Mills et al.  Purchase 
    CALCULATING THE REAL COST OF OFFSHORE OUTSOURCING Susan E. Mucha  Purchase 
    AUTOMATED SELECTIVE SOLDERING OF LEAD-TIN AND LEAD-FREE SOLDERS - A COMPARATIVE STUDY USING DIODE LASER AND XENON LAMP Syed Naveed et al.  Purchase 
    RELIABILITY AND ENVIRONMENTAL TESTING OF BLUETOOTH MODULES Teijo Kuosmanen et al.  Purchase 
    EFFECTS OF SURFACE CONTAMINATION ON PRODUCT YIELD Terence Q. Collier  Purchase 
    IMPLEMENTATION OF SQC TECHNIQUES FOR CLOSED LOOP PROCESS CONTROL IN ELECTRONICS MANUFACTURING Thanigai Kumar S. Vellore et al.  Purchase 
    PB FREE / HIGH TEMPERATURE REFLOW MSL PACKAGE ASSESSMENT OF A LGA PACKAGE ALTERNATIVE FOR PORTABLE PRODUCTS Thomas Koschmieder and Fonzell Martin  Purchase 
    DESIGN, PERFORMANCE AND RELIABILITY OF FIVE NEW LOW COST THERMALLY ENHANCED BGA Tiao Zhou, Ph.D. et al.  Purchase 
    DESIGN ANALYSIS OF BOARD LEVEL SOLDER JOINT RELIABILITY FOR THERMALLY ENHANCED BGAs Tong Yan Tee et al.  Purchase 
    RELIABILITY COMPARISON OF LEADED, ARRAY, & LEADLESS PACKAGES ON ALTERNATIVE PWB FINISHES Trevor S. Bowers et al.  Purchase 
    RELIABILITY COMPARISON OF LEADED, ARRAY, & LEADLESS PACKAGES ON ALTERNATIVE PWB FINISHES Trevor S. Bowers et al.  Purchase 
    A STUDY OF THE ACCURACY OF COMPONENT PLACEMENT SIMULATION IN ELECTRONICS MANUFACTURING V. Kawli, D. Warheit and K. Srihari  Purchase 
    INNOVATIVE 3-D SOLUTIONS FOR MULTIPLE DIE PACKAGING Vern Solberg  Purchase 
    BALL STACK PACKAGING FOR HIGH PERFORMANCE MEMORY Vern Solberg, Ignacio Osorio, and Jeffrey Demmin  Purchase 
    ROLE OF HDPUG IN LEAD-FREE TRANSITION Vivek Gupta  Purchase 
    NON-DESTRUCTIVE ANALYSIS METHOD FOR DETECTION OF THE "BLACK PAD DEFECT" ON PCB SURFACES Wade E. McFaddin  Purchase 
    MANAGING WASH LINES AND CONTROLLING WHITE RESIDUE BY STATISTICAL PROCESS CONTROL William T. (Tim) Wright  Purchase 
    EVALUATION OF THERMALLY RELIABLE PWB SUBSTRATES William Varnell and Ron Hornsby  Purchase 
    NEW ELECTROMIGRATION FAILURE MODE IN FLIP CHIP SOLDER JOINTS Y. H. Lin et al.  Purchase 
    ACCELERATED THERMAL CYCLING OF TIN-LEAD AND LEAD-FREE SOLDER JOINTS Yan Qi et al.  Purchase 

    SMTA Headquarters
    6600 City West Parkway, Suite 300
    Eden Prairie, MN 55344

    Phone 952.920.7682
    Fax 952.926.1819
    Home
    Site Map
    Update Your Info
    Related Links
    Send Us Feedback
    Contact Us
    Privacy Policy
    ↑ Top