Pan Pacific Symposium 1999 Proceedings

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    TITLE AUTHOR DOWNLOAD
    A CSP OPTOELECTRONIC PACKAGE FOR IMAGING AND A. Badihi  Purchase 
    MODULAR ASSEMBLING TECHNIQUES FOR MICROELECTRONIC SENSORS: ADVANCED DESIGN A. Brandolini  Purchase 
    MULTILAYER HIGH DENSITY FLEX INTERCONNECT Bill Chou  Purchase 
    CONSIDERATIONS IN AN INTERNATIONAL BUSINESS ENVIRONMENT FOR HIGH VOLUME ULTRA-THIN MULTILAYER PRINTED CIRCUIT BOARD FABRICATION Dale Lee  Purchase 
    ULTRA-THIN PRINTED CIRCUIT ASSEMBLY – A SOLUTION FOR LIGHT WEIGHT & COMPACT ELECTRONIC PRODUCTS Dale Lee  Purchase 
    EVALUATING THE MECHANICAL RELIABILITY OF REBALLED BGA MODULES Daryl L. Santos  Purchase 
    FABRICATION AND ASSEMBLY OF A 3D SRAM MEMORY MCM David Scheid  Purchase 
    INDIVIDUAL PART LEVEL TRACEABILITY IN THE BACK END OF SEMICONDUCTOR MANUFACTURING Ed Caracappa  Purchase 
    CSP TECHNOLOGY DEVELOPMENT FOR NON-COMMERCIAL APPLICATIONS Emmanuel J. Siméus  Purchase 
    ADVANCEMENTS IN HIGH DENSITY "IMPRINTED" CIRCUITS George D. Gregoire  Purchase 
    LEADING EDGE TECHNOLOGIES USING ADVANCED CHIP SHOOTERS Günter Schiebel  Purchase 
    OPTIMIZATION OF THERMAL BEHAVIOR FOR RESISTORS IN LTCC AND POSSIBILITIES TO INCREASE THE PERFORMANCE Heiko Thust  Purchase 
    TEMPERATURE EFFECTS ON ENCAPSULANT DISPENSING Horatio Quinones  Purchase 
    VIA-FILLING USING ELECTROPLATING FOR BUILD-UP PRINTED CIRCUIT BOARDS I. Kobayashi  Purchase 
    DEVELOPMENT OF THE REAL CHIP SIZE PACKAGE USING THE WAFER LEVEL ASSEMBLY PROCESS Ichiro Mihara  Purchase 
    THE NEW POSSIBILITIES FOR MANUFACTURABILITY OF THICK – FILM INTELLIGENT GLUCOSE BIOSENSORS IN MCM-C TECHNOLOGIES J. J. Gondek  Purchase 
    WAFER LEVEL CHIP SCALE PACKAGING BENEFITS FOR INTEGRATED PASSIVE DEVICES James L. Young  Purchase 
    CONSIDERATIONS FOR PRACTICAL IMPLEMENTATION OF CSP TEST AND BURN-IN James Rathburn  Purchase 
    ACOUSTIC MICROSCOPY OF FLIP CHIP PACKAGES Joel Sigmund  Purchase 
    TRANSFORMING FLIP CHIP INTO CSP WITH REWORKABLE WAFER-LEVEL UNDERFILL Ken Gilleo  Purchase 
    STUDY ON THE UNDER BUMP METALLURGY(UBM) OF ELECTRO-PLATED EUTECTIC Pb/Sn SOLDER BUMPS ON ORGANIC SUBSTRATES Kyung-Wook Paik  Purchase 
    CHOOSING THE CORRECT CHIP SIZE PACKAGE FOR THE RIGHT APPLICATION Marc Papageorge  Purchase 
    FUJITSU/SUN MICROSYSTEMS ULTRASPARC-IIi MCM: MINIATURIZATION TO THE EXTREME Michelle Hou  Purchase 
    INFLUENCE OF COEFFICIENT OF THERMAL EXPANSION OF ADHESIVE RESIN IN A RESIN PRESSURE CONTACT FLIP CHIP Mitsuru Mura  Purchase 
    DEVELOPING A BEST PRACTICES ENVIRONMENTAL DATABASE (BePED) FOR IRISH SMALL TO MEDIUM SIZED ENTERPRISES P. Wycherley  Purchase 
    ULTRA CSP(tm) A WAFER LEVEL PACKAGE Peter Elenius  Purchase 
    BOARD LEVEL RELIABILITY EVALUATIONS OF 40, 32 AND 30 MIL PITCH BALL GRID ARRAY PACKAGES OVER -40 TO 125 C Puligandla Viswanadham  Purchase 
    THE WORLDWIDE PCB ASSEMBLY MARKET Randall Sherman  Purchase 
    MANAGEMENT STRATEGIES FOR DEVELOPING A VERSATILE GROUP OF MANUFACTURING ENGINEERS Reggie Malli  Purchase 
    PROPERTIES OF DC MAGNETRON SPUTTERED NICKEL-CHROMIUM ALLOY THIN FILMS Ronald S. Nowicki  Purchase 
    USE OF AUGER AND OTHER SURFACE ANALYSIS TOOLS TO IDENTIFY FAILURE MECHANISMS IN THIN FILMS USED IN TAB AND OTHER DEVICE PACKAGING Ronald S. Nowicki  Purchase 
    ADVANCED VIA FILLING METHODS FOR HDIS APPLICATIONS S. Pierce  Purchase 
    ESSENTIALS OF BALL GRID ARRAY PROCESS IMPLEMENTATION Salim Merchant  Purchase 
    BOARD LEVEL RELIABILITY OF HIGH 1/0 STAGGERED ARRAY EUTECTIC BGA PACKAGES Santhana S. Satagopan  Purchase 
    SOLDER REFLOW METHOD AND REFLOW TEMPERATURE PROFILE Yizhe Elisa Huang  Purchase 
    A NOVEL FLIP CHIP BONDING TECHNOLOGY USING Au STUD BUMP Yoshihiro Yoneda  Purchase 
    IMPACT OF RESEARCH AND DEVELOPMENT EFFORTS ON STOCK EXCHANGE EXPECTATIONS -STUDY ON SAMPLE OF CORPORATIONS Zoltán B. Farkas  Purchase 

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