Pan Pacific Symposium 2003 Proceedings

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    TITLE AUTHOR DOWNLOAD
    EMI-ORIENTED DESIGN OF 3D-PACKED MICROELECTRONICS DEVICES A. Brandolini, A. Gandelli and R.E. Zich  Purchase 
    MICROSTRUCTURE AND SOLDERING PROPERTIES OF CSP SOLDER JOINTS USING Sn-Zn-Bi SOLDER Atsushi Yamaguchi et al.  Purchase 
    BUMPLESS FLIP CHIP PACKAGES Charles W.C. Lin, Ph.D., Sam Chiang, and T.A. Yang  Purchase 
    UNDERFILL ADHESIVE FILMS FOR FLIP CHIP AND CSP PACKAGES David Gagnon, Ph.D., Zenner, Zieminski, and Kropp  Purchase 
    LOW STRESS, EQUIVALENT SOLDER BGA REWORK Don Saunders  Purchase 
    PRINTABLE DIE ATTACH ADHESIVES FOR SUBSTRATE-ON-CHIP PACKAGING Dr. Kevin Becker  Purchase 
    µPGA SOCKET AND SOLDER JOINT RELIABILITY STUDY Dr. Paul P.E. Wang et al.  Purchase 
    EFFECTIVE TECHNIQUES FOR HIGH ACCURACY EUTECTIC DIE BONDING Edward J. Wills  Purchase 
    HIGH DENSITY ADVANCED PACKAGING 100-MICRON RESIST APPLICATION Eric Huenger et al.  Purchase 
    METHOD AND MATERIAL FOR MAINTAINING CLEANLINESS OF HIGH DENSITY CIRCUITS DURING ASSEMBLY Gary M. Freedman and Evelyn Baldwin  Purchase 
    CHOOSING YOUR MANUFACTURING PARTNER Grant Bunting  Purchase 
    LIFETIME PREDICTION BY FE-SIMULATION AND EXPERIMENTAL VERFICATION FOR VIAS AND MICROVIAS IN HDI-SUBSTRATES H.-J. Albrecht et al.  Purchase 
    FAILURE MODE AND EFFECTS ANALYSIS IN ELECTRONICS MANUFACTURING J. Patel, F. Jusufagic, S. Phadnis, and K. Srihari  Purchase 
    EFFECT OF WATER BATH TEMPERATURE ON SAM INSPECTIONS James C. P. McKeon  Purchase 
    POWER GOLD FOR 175°C Tj-max James J. Wang and Bob Baird  Purchase 
    EVALUATION OF MEMS (MICRO-ELECTRO-MECHANICAL SYSTEMS) USING ACOUSTIC MICRO IMAGING Janet E. Semmens and Lawrence W. Kessler  Purchase 
    STATE OF THE ART DETECTION & QUANTIFICATION OF OUTGASSED COMPOUNDS FOR THE OPTO ELECTRONICS & MICRO ASSEMBLY INDUSTRIES John C. Hulteen, Ph.D.  Purchase 
    SIGNAL INTEGRITY SYSTEM SOLUTIONS FOR HIGH SPEED BACKPLANE TRANSMISSION AND CONNECTORS INTEGRATED IN PACKAGES Josh G. Nickel et al.  Purchase 
    DEVELOPMENT OF METAL JOINT FLIP CHIP MOUNTING PROCESS USING SURFACE ACTIVATED BY PLASMA ENERGY Kazushi Higashi and Shinji Ishitani  Purchase 
    CAN ET PULL US UPWARD? Ken Gilleo  Purchase 
    Ag-Sn ALLOYS AS CONDUCTIVE FILLERS IN ICAS Kenichi Suzuki  Purchase 
    MICROELECTRONICS PACKAGING RESEARCH DIRECTIONS FOR AEROSPACE APPLICATIONS Lissa Galbraith, Ph.D.  Purchase 
    ANALYSIS OF WETTING AND TENSILE STRENGTH OF SOLDER ALLOYS Mark T. McMeen and Jason B. Gjesvold  Purchase 
    CARBON NANOTUBES AND AN OPTICAL METHOD FOR LIFE CONSUMPTION MONITORING OF ELECTRONIC ASSEMBLIES Paul Casey, Davinder K. Anand, and Michael Pecht  Purchase 
    MICRO AND NANO -SMT PARADIGMS ON THE HORIZON: FACT OR FICTION? Rao R. Tummala  Purchase 
    TECHNOLOGY ROADMAP FOR SILICONE ADHESIVES IN THIN MULTI-CHIP PACKAGES S. J. Dent, K. Mine, Y. Ushio, M. J. Watson  Purchase 
    ACHIEVING INCREASED PRODUCTIVITY AND PROFITABILITY IN AN EMS ENVIRONMENT USING LEAN MANUFACTURING TOOLS AND TECHNIQUES S. Manian Ramkumar  Purchase 
    SMT ASSEMBLY PROCESS COMPARISON OF PB-FREE ALLOY SYSTEMS - PART I Shafi Saiyed and Daryl Santos, Ph.D.  Purchase 
    SIX-SIGMA PROCESS DEVELOPMENT FOR SOLDER PASTE DEPOSITION IN A HIGH VOLUME - LOW MIX SMT LINE Sharafali Shaherwala et al.  Purchase 
    A STUDY ON THE CONDUCTIVE BEHAVIOR OF COPPER FILLED PASTES FOR MICROELECTRONIC PACKAGING SUBSTRATES Shen-Li Fu , YS Lin, SS Chiu, and CS Shi  Purchase 
    A NEW POWER MEMS COMPONENT WITH VARIABLE CAPACITANCE Sterken, Baert, Puers, Borghs, Mertens  Purchase 
    DESIGN ISSUES RELATED TO AREA ARRAY PACKAGING TECHNOLOGY Steve R. Stegura and Emmanuel J. Siméus  Purchase 
    AN INVESTIGATION ON THE RELIABILITY OF CSP SOLDER JOINTS WITH NUMEROUS UNDERFILL MATERIALS Sunny Zhang, Fowler Chang, and Dr. Shelgon Yee  Purchase 
    JOINT RELIABILITY OF FLIP CHIP INTERCONNECTION WITH SN-BI SOLDER T. Akamatsu, H. Ueda, M. Ochiai, and E. Horikoshi  Purchase 
    REAL CHIP SIZE 3-DIMENSIONAL - STACKED PACKAGE Takao Yamazaki et al.  Purchase 
    WLP TODAY: MARKET DRIVERS AND OPPORTUNITIES Thomas Goodman and Peter Elenius  Purchase 
    PRACTICAL AND COST EFFECTIVE SOLUTIONS FOR 3D IC PACKAGING Vern Solberg and Craig Mitchell  Purchase 
    THREE-DIMENSIONAL PACKAGING AND ASSEMBLY OF HIGH-CAPACITY MEMORY MODULES Wei Koh, Ph.D.  Purchase 
    LOW COST HIGH PERFORMANCE BGA - C2BGA William Rugg et al.  Purchase 
    THE THERMO-MOIST MECHANICAL GENERALIZED HYBRID/MIXED SINGULAR FEA OF GBA PACKAGING STRUCTURES WITH SMT STRESSES AND SEALING CRACKS Wu Zhang et al.  Purchase 

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