2002 NEPCON West - Fiberoptic Expo Proceedings

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    TITLE AUTHOR DOWNLOAD
    OPTOELECTRONICS - MAINSTREAM OR TRIBUTARY? NEMI’S OPTOELECTRONICS INITIATIVES Alan Rae  Purchase 
    RELIABILITY EVALUATION OF CCGA MODULES SUBJECTED TO THERMAL CYCLING USING ELECTRON-BEAM MOIRE TECHNIQUE Arvind Sinha  Purchase 
    NANO-OPTICS: NEW OPTICAL STRUCTURES AND LITHOGRAPHY ENABLE STANDARDIZED MANUFACTURING FOR MULTIPLE COMPONENTS Barry J. Weinbaum and Hubert Kostal  Purchase 
    OPTOELECTRONIC PACKAGING FOR AUTOMATION Ben Velsher and Jeff Venegas  Purchase 
    PXI 101 - AN OVERVIEW OF THE PXI ARCHITECTURE Bob Stasonis  Purchase 
    PRECISION ASSEMBLY AUTOMATION Brian Carlisle  Purchase 
    HIGH RELIABILITY, AUTOMATED FIBER RECOAT PROCESS THAT INCREASES FIBER RECOATING YIELDS Bryon J. Cronk et al.  Purchase 
    DESIGN GUIDELINES FOR AVOIDING FLEX CRACKING IN CERAMIC CAPACITORS C. Hillman, N. Blattau, and D. Barker  Purchase 
    INVESTIGATING MASS IMAGING LEAD FREE MATERIALS USING ENCLOSED PRINT HEAD TECHNOLOGY Clive Ashmore and Rick Goldsmith  Purchase 
    LEAN ENTERPRISE TRANSFORMATION AT LASER SURGERY DEVICE MANUFACTURER Collin McLoughlin  Purchase 
    ELECTRODEPOSITED RESIST - A COMPARISON BETWEEN POSITIVE AND NEGATIVE RESIST Daniel Paine, Ph.D. et al.  Purchase 
    PROCESS CHARACTERIZATION OF PCB ASSEMBLY USING 0201 PACKAGES WITH LEAD-FREE SOLDER David Geiger et al.  Purchase 
    TWO FUNDAMENTAL APPROACHES TO ENABLING HIGH PERFORMANCE LGA CONNECTIONS Dirk D. Brown et al.  Purchase 
    A STUDY OF SMALL AND TAPERED APERTURE TRANSFER EFFICIENCY Dr. Gerald Pham-Van-Diep, F. Andres and I. Fleck  Purchase 
    LEAD-FREE SOLDER INTERCONNECTIONS FOR SMT MANUFACTURING Dr. Jennie S. Hwang  Purchase 
    FLEXIBLE CIRCUITS - THE NEXT 100 YEARS Dr. Ken Gilleo  Purchase 
    SURFACE MOUNT OPTICS - A NEW APPROACH TO PHOTONIC ASSEMBLY Dr. Steven K. Case  Purchase 
    EPOXY FLUX - AN ANSWER FOR LOW COST NO-CLEAN FLIP CHIP ASSEMBLY Dr. Wusheng Yin et al.  Purchase 
    LOW COST NO-FLOW UNDERFILLING BEING A REALITY FOR MANUFACTURING Dr. Wusheng Yin et al.  Purchase 
    MARKET PULL VS. TECHNOLOGY PUSH: TRENDS IN PHOTONIC DEVICE PACKAGING & AUTOMATED ASSEMBLY AFTER THE BUBBLE Edward Palen, Ph.D., P.E.  Purchase 
    LASER SOLDER ATTACHING FOR OPTOELECTRONICS AND MEMS PACKAGES Elke Zakel et al.  Purchase 
    ADVANCES IN STACKED-DIE PACKAGING Flynn Carson and Marcos Karnezos  Purchase 
    SYSTEM-IN-PACKAGE: A WIRELESS SOLUTION FOR CELL PHONES Frank Juskey  Purchase 
    BACKPLANE ASSEMBLIES FOR > 10 Gb/s Franz Gisin and Dr. Sundar Kamath  Purchase 
    FLUX-LESS / VOID-FREE - AN ENVIRONMENTALLY FRIENDLY SOLDERING PROCESS FOR OPTOELECTRONICS ASSEMBLIES Gary Pangelina  Purchase 
    OPTIMIZING THE FEAR FACTORS IN 0201 ASSEMBLY Harjinder Ladhar and Sundar Sethuraman  Purchase 
    THE EFFECT OF AGING ON THE SHEAR STRENGTH OF LEAD-FREE AND LEAD-BEARING BGA SOLDER SPHERES Indraneel Chatterji, Daryl Santos, & Frank Andros  Purchase 
    INCREASING QUALITY & PRODUCTIVITY 30-60% WITHOUT ADDING PEOPLE OR EQUIPMENT Ingrid Gudenas, M.Ed.  Purchase 
    MIXED SIGNAL DESIGN ISSUES James C. Blankenhorn  Purchase 
    AUTOMATION'S PLACE IN FIBER OPTIC INDUSTRY RESTRUCTURING Jeff D. Montgomery  Purchase 
    INTELLIGENT SPC METHODOLOGY USING AOI/XRAY DATA CORRELATION Jeff Harrell  Purchase 
    MODEL BASED AUTOMATIC FIBER ALIGNMENT Jeongsik Sin, Dan Popa, and Harry E. Stephanou  Purchase 
    MICROVIA FATIGUE LIFE PREDICTION UNDER THERMO-MECHANICAL CYCLIC LOADING CONDITION Jianjun Wang et al.  Purchase 
    SOLDER FLUX BEARING LEAD TECHNOLOGY - AN ALTERNATIVE METHOD OF SOLDERING THROUGH HOLE CONNECTORS WITH SMT PROCESSES Jim Zanolli and Joe Cachina  Purchase 
    3D NONLINEAR STRESS ANALYSIS OF TIN WHISKER INITIATION ON LEAD-FREE COMPONENTS John H. Lau  Purchase 
    FLEXIBLE PRINTED CIRCUIT TECHNOLOGY - A VERSATILE INTERCONNECTION OPTION Joseph Fjelstad  Purchase 
    REDEFINING THE PERFORMANCE LIMITS OF COPPER CIRCUITS Joseph Fjelstad, B. Haba, Ph.D. and Para Segaram  Purchase 
    AUTOMATED PACKAGING OF MEMS DEVICES Joseph S. Bell  Purchase 
    FUTURE BANKS ON WIFI (802.11) & BLUETOOTH K Raghu Raghunathan  Purchase 
    EFFECTS OF VISION PARAMETERS ON PHOTONICS AUTOMATION SYSTEM PERFORMANCE K.M. (Timber) Yuen and Joshua Capogna  Purchase 
    A STUDY OF LEAD-CONTAMINATION IN LEAD-FREE ELECTRONICS ASSEMBLY AND ITS IMPACT ON RELIABILITY Karl Seelig and David Suraski  Purchase 
    RELIABLE SERIAL BACKPLANE DATA TRANSMISSION AT 10 GB/S Ken Lazaris-Brunner et al.  Purchase 
    ADHESIVE FOR OPTICAL MULTICHANNEL V-GROOVE ARRAY Kenichi Suzuki et al.  Purchase 
    OPTOELECTRONIC PACKAGING CONCEPTS USING ACTIVE POLYMER SYSTEMS Leo M. Higgins III, Ph.D.  Purchase 
    TRANSCEIVER FUNCTIONAL TESTING Leonardo Bonanomi and Stefano Meroni  Purchase 
    COMBINATION AOI/AXI SYSTEMS - A POWERFUL SOLUTION FOR PWA INSPECTION Lloyd Jones and William K. Pratt  Purchase 
    BUILDING TEST APPLICATIONS USING TIMING AND TRIGGERING USING PXI Lokesh Duraiappah  Purchase 
    INDUSTRY-WIDE DESIGN FOR TESTABILITY GUIDELINES Louis Y. Ungar  Purchase 
    ELECTRICALLY CONDUCTIVE SILICONE ADHESIVE Luis C. Montemayor  Purchase 
    ACCURACY MEASUREMENT TECHNIQUES: GLASS PARTS VERSUS REAL PARTS Michael Cieslinski  Purchase 
    LOWERING THE COST OF TESTING MULTI-CHANNEL OPTICAL DEVICES Michael Dewey et al.  Purchase 
    OVERCOMING THE CURRENT QUALITY PLATEAU Michael Motherway  Purchase 
    EFFECTIVE DIELECTRIC CONSTANT OF COMPOSITE PACKAGING MATERIALS Michael Todd and Frank Shi  Purchase 
    THERMAL AGING CHARACTERIZATION OF OSP METAL FINISHING FOR FLIP CHIP PACKAGING WITH FOUR LAYER LAMINATE SUBSTRATE Mike C. Loo and Lily Zhao  Purchase 
    GLASS SEALING MIM BOXES FOR FIBER OPTIC AND ELECTRONIC PACKAGES Mitchell N. Gross  Purchase 
    CPI: A POWERFUL BUSINESS STRATEGY N.T. "Bala" Balakrishnan CFPIM, CQE  Purchase 
    E BUSINESS: A REVIEW OF TRAINING NEEDS AND WHAT THE B SCHOOLS ARE DOING N.T. "Bala" Balakrishnan CFPIM, CQE  Purchase 
    DEMAND CHAIN INTEGRATION & PULL-BASED REPLENISHMENT USING eBizKanban Narayan Laksham  Purchase 
    VISCOSITY AND STENCIL PRINTING BEHAVIOR OF SURFACE MOUNT ADHESIVES Neil Poole, Ph.D. and Brian J. Toleno, Ph.D.  Purchase 
    LEAN AND GREEN: PROFIT FOR YOUR WORKPLACE AND THE ENVIRONMENT Pamela J. Gordon, Certified Management Consultant  Purchase 
    SEVEN STEPS TO APPROACHING CONTINUOUS PROCESS IMPROVEMENT Patricia A. Worsham  Purchase 
    3-D GEOMETRIC COMPONENT LIBRARY USAGE THROUGHOUT THE DESIGN THROUGH MANUFACTURING PROCESS Patrick E. McGoff  Purchase 
    THE ESSENTIALS OF OUTSOURCING - HIGH LEVEL, HIGH TECH, ELECTRONIC AND ELCETRO/MECHANICAL SYSTEMS Peter C. Gordon  Purchase 
    SIX SIGMA - MAKING IT WORK FOR YOU Praveen Gupta, Master Six Sigma Black Belt  Purchase 
    OPTICAL MANUFACTURING BY LEADING CONTRACT MANUFACTURERS Randall Sherman  Purchase 
    SUB-MICRON FIBER ATTACHMENT USING LASER-ASSISTED FLUXLESS SOLDER REFLOW Randy Heyler et al.  Purchase 
    GROUND BOUNCE AND BOUNDARY SCAN TESTING Ray Balzer and Phil King  Purchase 
    THE OPTOELECTRONIC ASSEMBLY WORKCELL Ray Gottsleben and Steve Sytsma*  Purchase 
    NEW STENCIL DESIGN FOR EPOXY PRINTING Rich Freiberger  Purchase 
    PARALLEL TESTING LOWERS THE COST OF MANUFACTURING TEST Richard McDonell  Purchase 
    AGILE CURING FOR PHOTONICS ASSEMBLY Richard S. Garard and Joseph Wander  Purchase 
    SMT FAILURES ASSOCIATED WITH THE HASL SURFACE FINISH Roger Jay and Alfred Kwong  Purchase 
    ADVANCED CHIP TEST TECHNIQUES AT HIGHER INTEGRATION LEVELS Ron Press  Purchase 
    FINITE ELEMENT MODELING OF BALL GRID ARRAY PACKAGES IN SYSTEM PACKAGING VIBRATION ANALYSIS Ron S. Li  Purchase 
    PIGTAILING OF FABRY-PEROT LASER DIODE TO CLEAVED AND WEDGE-SHAPED SINGLE MODE FIBERS: ALIGNMENT DEPENDENT RIN AND LASER-FIBER COUPLING EFFICIENCY Rong Zhang and Frank G. Shi  Purchase 
    EVALUATION OF FUSION SPLICERS FOR HIGH STRENGTH SPLICING Salil Pradhan et al.  Purchase 
    HOW TO WIN THE NPI GAME Salim Merchant  Purchase 
    THE SECRET TO SUCCESSFULLY MANAGE TODAY’S MANUFACTURING ENTERPRISE BEYOND THE FOUR WALLS Sharone Zehavi  Purchase 
    WHEN TO USE AOI, WHEN TO USE AXI, AND WHEN TO USE BOTH Stig Oresjo  Purchase 
    FROM SUPPLIERS TO EMS: REVIEW OF THE FACTORS AFFECTING CLEANLINESS OF FIBER OPTIC CONNECTORS Tatiana Berdinskikh et al.  Purchase 
    SIX SIGMA AT 3M Thomas A. Roth  Purchase 
    AUTOMATED OPTICAL INSPECTION (AOI) - A YIELD MANAGEMENT SOLUTION FOR THE HIGH DENSITY INTERCONNECTION (HDI) INDUSTRY Thomas Cinque et al.  Purchase 
    LIFE-TESTS OF SMALL SAMPLE SIZES = TROUBLE... OR WHAT CAN YOU LEARN, IF YOU TEST ONLY A FEW? Tom Clifford  Purchase 
    A NOVEL FLIP CHIP APPROACH FOR MICROWAVE/HIGH SPEED DATA CHIP PACKAGING Tong Chen and Suchet Chai  Purchase 
    IMPLEMENTATION AND QUALIFICATION OF 0201 ASSEMBLY Tony Huang and Rudolph Yu  Purchase 
    X-RAY INSPECTION FOR OPTOELECTRONIC COMPONENTS Vikram Butani  Purchase 
    DESIGN FOR SIX SIGMA AT SEAGATE Vince Sanchez  Purchase 
    INJECTION MOLDED SURFACE MOUNT 32 PIN VISION PACKAGE COMPETES WITH CERAMICS Wayne Louie, N. Li, T. Shaffer and R. Ross  Purchase 
    BALL STACKED PACKAGE DEVELOPMENT FOR HIGH DENSITY DRAM MODULE APPLICATIONS Young Gon Kim, Ph.D. and Ji-Bum Kim  Purchase 

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