SMTA International 2002 Proceedings

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    TITLE AUTHOR DOWNLOAD
    DEVELOPMENT OF LASER TRIMMING OF EMBEDDED RESISTORS FOR PRINTED CIRCUIT BOARD MANUFACTURING Andrei Naumov, Dave Mahon and Anton Kitai  Purchase 
    IMPACT OF 0201 COMPONENTS ON CURRENT MANUFACTURING SYSTEMS Andrew Butterfield  Purchase 
    FLIP CHIP PBGA FOR COMPUTING AND TELECOMM APPLICATIONS Andrew Mawer, Thomas Koschmieder, and Diane Hodges  Purchase 
    INSPECTION STRATEGIES FOR 0201 COMPONENTS Andy Yates et al.  Purchase 
    INHIBITING GROWTH OF Au-Ni-Sn TERNARY COMPOUNDS AT THE INTERFACES OF Pb-BASED AND Pb-FREE SOLDER JOINTS Anis Zribi et al.  Purchase 
    HIGH IMPINGEMENT CLEANING OF ELECTRONIC FLIP CHIP ASSEMBLIES Ann Shang  Purchase 
    EVALUATION AND SELECTION OF OPTICAL FIBER FUSION SPLICERS FOR OPTOELECTRONICS ASSEMBLY Bill Newell and Jinsoo Kim  Purchase 
    LEAD-FREE SELECTIVE SOLDERING: THE WAVE OF THE FUTURE Bob Klenke  Purchase 
    SYSTEM IN PACKAGE PROCESS SOLUTIONS BASED ON FLIP CHIP PROCESSING Brian J. Lewis et al.  Purchase 
    SOLDER SELECTION FOR PHOTONIC PACKAGING Brian O’Neill and David Suraski  Purchase 
    ASSEMBLY AND RELIABILITY OF EXPOSED PAD TQFP DEVICES Carlos Fiol  Purchase 
    EVALUATION OF THE COMPARATIVE SOLDERABILITY OF LEAD-FREE SOLDERS IN NITROGEN - PART II Christopher Hunt et al.  Purchase 
    LOW COST HIGH PERFORMANCE BGA - C2BGA Claudio M. Villa  Purchase 
    THE INTEGRATION OF CAM TOOLS INTO PCBA MANUFACTURING Dale Lee  Purchase 
    DESIGNING A HIGH YIELD 0201 ASSEMBLY PROCESS FOR NEW PRODUCT INTRODUCTION Daniel F. Baldwin et al.  Purchase 
    MODULAR, DEVICE-SCALE, DIRECT-CHIP-ATTACH PACKAGING FOR MICROSYSTEMS Daniel F. Baldwin, Ph.D.  Purchase 
    X-RAY TUBE SELECTION CRITERIA FOR BGA / CSP X-RAY INSPECTION David Bernard  Purchase 
    UNDERFILL ADHESIVE CHOICES FOR CHIP AND PACKAGE APPLICATIONS David R. Gagnon, Ph.D. et al.  Purchase 
    SOLDERABILITY AND PROCESS INTEGRATION STUDIES OF IMMERSION SILVER AND TIN SURFACE FINISHES Dongji Xie, Ph.D., et al.  Purchase 
    VOIDING OF LEAD-FREE SOLDERING AT MICROVIA Dr. Hyoryoon Jo, B. Nieman, and Dr. N.C. Lee  Purchase 
    WILL MEMS BECOME ALL PERVASIVE? Dr. Ken Gilleo  Purchase 
    THE RELEVANCE OF NEWER GENERATION LASER REWORK TECHNOLOGY IN TODAY’S HIGH DENSITY MANUFACTURING PROCESSES Dr. Paul P.E. Wang  Purchase 
    SOLDER JOINT RELIABILITY OF Sn-Ag-Cu BGA COMPONENTS ATTACHED WITH EUTECTIC Pb-Sn SOLDER PASTE Fay Hua et al.  Purchase 
    CASE STUDIES IN MULTIPLE DIE PACKAGE ASSEMBLY OF LEADED AND BALL GRID ARRAY PACKAGES Fonzell Martin and Ken Thompson  Purchase 
    TAPE BASED SUBSTRATE SOLUTIONS ADVANTAGES AND DISADVANTAGES Fonzell Martin, Yushi Matsuda, and Trent Thompson  Purchase 
    SYSTEM-IN-PACKAGE: THE NEXT GENERATION IN IC PACKAGING Frank Juskey  Purchase 
    SOLDER PASTE PRINTING DATA ANALYSIS: A VISUAL APPROACH Fritz Byle  Purchase 
    REDUCTION OF HIGH-FREQUENCY SIGNAL LOSS THROUGH THE CONTROL OF CONDUCTOR GEOMETRY AND SURFACE METALLIZATION Gary Brist et al.  Purchase 
    ACHIEVING PROCESS CONSISTENCY AND BEST PRACTICES WITHIN DISPARATE MANUFACTURING PLATFORMS Glenn Woodhouse and Bill Barthel  Purchase 
    A CASE STUDY FOR IMPLEMENTING 1149.1 BOUNDARY SCAN Greg Noeninckx  Purchase 
    IMPACT OF COMPONENT TERMINAL FINISH ON THE RELIABILITY OF Pb-FREE SOLDER JOINTS Gregory Henshall et al.  Purchase 
    VACUUM SOLDERING IN ELECTRONICS PACKAGING Gunter Hagen, Klaus Wolter, and Armin Wagner  Purchase 
    BOARD LEVEL RELIABILITY OF LEAD-FREE SOLDERED INTERCONNECTIONS H.-J. Albrecht, K. Wilke, D.S. Brodie  Purchase 
    INTEGRATED TEST TECHNOLOGIES TO IMPROVE YIELDS AND REDUCE COST TO TEST Haydn Povey  Purchase 
    A NEW DIMENSION IN STENCIL PRINT OPTIMIZATION Ian Fleck and Prashant Chouta  Purchase 
    HI-REL LEAD-FREE PRINTED WIRING ASSEMBLIES J.K. "Kirk" Bonner, L. del Castillo, A. Mehta  Purchase 
    FLIP CHIP ON PAPER ASSEMBLY UTILIZING ANISOTROPIC CONDUCTIVE ADHESIVE Jad S. Rasul and Bill Olson  Purchase 
    FATIGUE PROPERTIES OF Sn3.5Ag0.7Cu SOLDER JOINTS AND EFFECTS OF Pb-CONTAMINATION James Oliver, M. Nylén, O. Rod, and C. Markou  Purchase 
    AN AUTOMOTIVE INDUSTRY’S PERSPECTIVE ON HIGH-TEMPERATURE ELECTRONICS James R. Thompson et al.  Purchase 
    AOI: FACING THE CHALLENGES OF 0201 Jean-Marc Peallat and Mark J. Norris  Purchase 
    0201 COMPONENT INSPECTION- AOI BEST PRACTICES AND RECOMMENDATIONS Jeff Bishop  Purchase 
    INTELLIGENT SPC METHODOLOGY USING AOI/XRAY DATA CORRELATION Jeff Harrell  Purchase 
    EFFECTS OF BACKGRIND AND PLASMA CLEAN ELIMINATION IN THE MANUFACTURING PROCESS FLOW ON PACKAGE PERFORMANCE Jesse Phou and Trent Thompson  Purchase 
    STRENGTH TEST OF PIN SOLDERING ON PCB Jiachun Zhou (Frank), K. Elmadbouly, and O. Sorian  Purchase 
    EVALUATING THE EFFECTS OF REFLOW PROFILE CONTROL ON SOLDER JOINT QUALITY AND RELIABILITY John L. Evans and Greg Jones  Purchase 
    RELIABILITY OF NEXT GENERATION COMPONENTS AND SUBSTRATES FOR UNDER-THE-HOOD AUTOMOTIVE ELECTRONICS John L. Evans et al.  Purchase 
    X-RAY INSPECTION IN THE THIRD DIMENSION WITH AIM TECHNOLOGY Jon Dupree  Purchase 
    A STUDY OF LEAD-CONTAMINATION IN LEAD-FREE ELECTRONICS ASSEMBLY AND ITS IMPACT ON RELIABILITY Karl Seelig and David Suraski  Purchase 
    FURTHER STUDY OF CHIP SCALE PACKAGES IN HARSH ENVIRONMENT CONDITIONS Keith Easler  Purchase 
    MANUFACTURING AND RELIABILITY OF CHIP SCALE AREA ARRAY PACKAGING IN AVIONICS ENVIRONMENTS Keith Kirchner and David Nelson  Purchase 
    ALL LASER PROCESS FOR HIGH DENSITY MULTI-LAYER CIRCUIT BOARDS Ken Inaba  Purchase 
    FLIP CHIP UNDERFILL: VOID DETECTION AND CORRECTION Kris Slesinger et al.  Purchase 
    MEMS INTEGRATED OPTICAL MONITORING FOR FAULT DETECTION AND CLOSED-LOOP CONTROL L. A. Hornak et al.  Purchase 
    WAFER-LEVEL REDISTRIBUTION USING FULLY-ADDITIVE CU/NI/AU METALLIZATION Lars Boettcher et al.  Purchase 
    ELECTRICALLY CONDUCTIVE SILICONE ADHESIVE Luis C. Montemayor  Purchase 
    SELECTIVE SOLDERING TECHNOLOGY Marc Dalderup  Purchase 
    COMPRESSIVE LOAD EFFECTS ON CCGA RELIABILITY Marie S. Cole, J. Jozwiak, E. Kastberg, G. Martin  Purchase 
    CONDENSATION HEATING PROCESS FOR LEAD-FREE SOLDERING Mathias Nowottnick  Purchase 
    COMPONENT TEMPERATURE STUDY ON TIN-LEAD AND LEAD-FREE ASSEMBLIES Matthew Kelly et al.  Purchase 
    ASSEMBLY AND REWORK PROCESS INVESTIGATION ON NEW CERAMIC COLUMN GRID ARRAY PACKAGES Mei Wang et al.  Purchase 
    ASSEMBLY PROCESS QUALIFICATION ON 0201 PACKAGES FOR VOLUME MANUFACTURING Mei Wang et al.  Purchase 
    CONTROLLING MOISTURE-SENSITIVE DEVICES (MSDS) FOR DOUBLE-SIDED REFLOW APPLICATIONS Michael Blazier  Purchase 
    ACCURACY MEASUREMENT TECHNIQUES: GLASS PARTS VERSUS REAL PARTS Michael Cieslinski  Purchase 
    OVERCOMING THE CURRENT QUALITY PLATEAU Michael Motherway  Purchase 
    PROGRAMMABLE LOGIC USED TO CONTROL BOUNDARY SCAN CHAINS Michael Spofford  Purchase 
    EFFECT OF SURFACE TENSION OF SOLDER ON UNDERSIDE DEVICE SUPPORT DURING REFLOW OF A PCBA Mulugeta Abtew  Purchase 
    STANDARDIZATION OF FUNCTIONAL TEST FOR IPF BASED SERVERS AND WORKSTATIONS Myke Predko  Purchase 
    HALOGEN AND ANTIMONY-FREE EPOXY THERMOUNT® LAMINATE FOR PRINTED WIRING BOARD (PWB) FABRICATION Ousama Najjar, Ph.D  Purchase 
    ANALYSIS OF SOLDER PASTE RELEASE IN FINE PITCH STENCIL PRINTING PROCESSES Paul Houston  Purchase 
    PROCESS CAPABILITY CASE STUDY ON 0201 PROCESSING UTILIZING 3D AUTOMATED OPTICAL INSPECTION Paul Houston  Purchase 
    ADVANCED PACKAGES REQUIRE A GOOD REWORK PROCESS Paul Wood  Purchase 
    MONITORING MOTHERBOARD SHOCK STRAIN RESPONSE NEAR BGA SOLDER JOINTS Phil Geng and Willem M Beltman  Purchase 
    SOLDER JOINT FORMATION WITH Sn-Ag-Cu AND Sn-Pb SOLDER BALLS AND PASTES Polina Snugovsky et al.  Purchase 
    RELIABILITY AND PASTE PROCESS OPTIMIZATION OF EUTECTIC AND LEAD-FREE FOR MIXED PACKAGING Prof. S. Manian Ramkumar et al.  Purchase 
    INVESTIGATION OF THE MECHANICAL PROPERTIES OF Pb-FREE SOLDER JOINTS BY NANOINDENTATION R.R. Chromik, R.P. Vinci, S.L. Allen & M.R. Notis  Purchase 
    ROAD TO GROWTH AND PROFITABILITY STARTS WITH EFFECTIVE SUPPLIER RELATIONSHIP MANAGEMENT Rajiv Varshney and Praveen Gupta  Purchase 
    MAXIMIZING PICK-AND-PLACE MACHINE UTILIZATION USING A MANUFACTURING OPTIMIZATION AND EXECUTION SYSTEM Ranko Vujosevic  Purchase 
    LONG-LIFE RELIABILITY OF CSP ASSEMBLIES WITH AND WITHOUT UNDERFILL Reza Ghaffarian, Ph.D.  Purchase 
    CSP AND BGA ASSEMBLY RELIABILITY IN A FAST RAMP RATE THERMAL CYCLE ENVIRONMENT Reza Ghaffarian, Ph.D.  Purchase 
    SIP QUALIFICATION AND PRA APPROACHES Reza Ghaffarian, Ph.D.  Purchase 
    EVALUATING AUTOMATED OPTICAL INSPECTION Rob Mitchell  Purchase 
    HIGHER THERMAL STABILITY WITH BROMINE-FREE SUBSTRATES Robert Demaree  Purchase 
    SIMPLIFYING PWB ASSEMBLY BY UTILIZING EMBEDDED PASSIVES Robert T. Croswell et al.  Purchase 
    A DESIGNER’S LOOK AT THE TOOLS Rodney W. Simon  Purchase 
    ESTABLISHING A CONTINUOUS IMPROVEMENT PLAN TO DRAMATICALLY INCREASE PROFITS Ronald C. Lasky, Ph.D., PE  Purchase 
    MATERIALS AND PROCESS CHALLENGES IN RF AND OPTOELECTRONICS ASSEMBLY Ronald C. Lasky, Ph.D., PE  Purchase 
    DFM NPI SYNERGY Scott Buttars  Purchase 
    QUALIFICATION OF 3-D SOLDER PASTE INSPECTION SYSTEMS FOR EFFECTIVE IN-LINE PROCESS CONTROL Sharafali Shaherwala et al.  Purchase 
    THE EFFECTS OF COPPER CONTENT ON THE RELIABILITY OF Sn-Ag BASED BUMP ALLOYS IN FLIP CHIP APPLICATIONS Shing Yeh  Purchase 
    COST SAVINGS AND BENEFITS OF REWORKING BGA, CSP AND PWB MODIFICATIONS FOR HIGH PERFORMANCE APPLICATIONS Stephen R. Stegura et al.  Purchase 
    ADVANCED CAPILLARY UNDERFILL FOR FLIP CHIP ATTACHMENT Steve Hackett, Ph.D.  Purchase 
    NEW THOUGHTS ON TEST STRATEGIES Stig Oresjo  Purchase 
    STRATEGIC CONSIDERATIONS IN MANAGING OEM CUSTOMER RELATIONSHIPS Susan E. Mucha  Purchase 
    AGEING CHARACTERISTICS OF IMMERSION TIN SURFACE FINISHES Sven Lamprecht, Dr. H-J Schreier, and Dr. R. Vogel  Purchase 
    CHARACTERIZATION OF ENVIRONMENT-FRIENDLY HALOGEN-FREE MATERIALS FOR RADIO FREQUENCY ELECTRONICS USE Terry Fischer  Purchase 
    PROCESS CAPABILITY, WETTING BEHAVIOR AND TEMPERATURE DEPENDENT SHEAR STRENGTH OF ALTERNATIVE LEAD FREE SOLDER JOINTS Th. Herzog , S. Rudolph, and K.-J. Wolter  Purchase 
    IMPLEMENTING ‘INTEGRATED PREDICTIVE MANUFACTURING’ AT AN EMS PROVIDER - A CONTINUOUS IMPROVEMENT APPROACH Thanigai Kumar S. Vellore et al.  Purchase 
    UNDERFILLED PBGA PACKAGES AND THEIR BOARD LEVEL CYCLING AND VIBRATION PERFORMANCE Thomas Baumann et al.  Purchase 
    PRACTICAL TIPS IN IMPLEMENTING THE "PIN IN PASTE" PROCESS Tim Jensen and Ronald C. Lasky, Ph.D., PE  Purchase 
    UNDERFILLED FLIP CHIP DEFECT DETECTION: X-RAY ANALYSIS VS. SCANNING ACOUSTIC MICROSCOPY: AN ASSESSMENT OF ANALYTICAL TECHNIQUES Todd Snively  Purchase 
    A STATISTICAL APPROACH TO 0201 COMPONENT PACKAGE UTILIZATION Tom Borkes  Purchase 
    A NOVEL FLIP CHIP APPROACH FOR MICROWAVE/HIGH SPEED DATA CHIP PACKAGING Tong Chen and Suchet Chai  Purchase 
    GETTING FACTORY READY FOR 0201 ASSEMBLY Tony Huang and Rudolph Yu  Purchase 
    IC PACKAGE SOLUTIONS FOR HIGH PERFORMANCE MEMORY Vern Solberg and Ignacio Osorio  Purchase 
    EFFECT OF COPPER CONCENTRATION ON THE SOLID-STATE AGING REACTIONS BETWEEN TIN-COPPER LEAD-FREE SOLDERS AND NICKEL W. T. Chen et al.  Purchase 
    SIMULATION FOR 0201 LEADLESS COMPONENT REFLOW DESIGN AND DEFECT ANALYSIS Xiaohua Wu, Joe Tomase, and Matt Kas  Purchase 
    AUTOMATED X-RAY INSPECTION: SMT PROCESS IMPROVEMENT TOOL Zhen (Jane) Feng, Jacob Djaja, and Ronald Rocha  Purchase 
    QUALITY AND ECONOMICAL ASPECTS OF SELECTIVE WAVE SOLDERING Zsolt Nemes  Purchase 

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