2002 Advanced Technology Symposium Proceedings

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    TITLE AUTHOR DOWNLOAD
    DEVELOPMENT AND APPLICATION OF A PRESS-PIN/PTH RELIABILITY MODEL A. Kulkarni, et al.  Purchase 
    SOLDER SELECTION FOR PHOTONIC PACKAGING Brian O’Neill  Purchase 
    CONDUCTIVE EPOXY ADHESIVES AS VIABLE ALTERNATIVES TO SOLDER: Sn/Pb COMPONENT COMPATIBILITY C. Cheng, S. Smith, W. O’Hara, and V. Buffa  Purchase 
    BMI RESINS AS LOW-STRESS ALTERNATIVES TO EPOXIES FOR OPTOELECTRONIC PACKAGE ASSEMBLY Chris Perabo, B. Eng.  Purchase 
    MEMS AND MOEMS PACKAGING / 3D INTERCONNECTION Christian VAL  Purchase 
    CHALLENGES AND SOLUTIONS FOR PACKAGING MEMS AND MICROSYSTEMS Daniel F. Baldwin  Purchase 
    COMPARISON OF MICROSTRUCTURES IN SAC305 AND SAC405 SOLDER JOINTS AND THE INFLUENCE OF SURFACE FINISH Daryl Santos, et al.  Purchase 
    EFFECTS OF REFLOW PROFILE ON SHEAR STRENGTH OF Sn/4.0Ag/0.5Cu SOLDER SPHERES FOR BALL GRID ARRAY APPLICATIONS Daryl Santos, et al.  Purchase 
    ZERO CLEARANCE SOLDER MASK FOR HIGH DENSITY SMT Dominique Numakura  Purchase 
    A NICKEL-PALLADIUM-GOLD IC LEAD FINISH AND THE POTENTIAL FOR SOLDER JOINT EMBRITTLEMENT Donald Abbott, Douglas Romm and Bernhard Lange  Purchase 
    REAL TIME VISUALIZATION AND PREDICTION OF SOLDER PASTE FLOW IN THE CIRCUIT BOARD PRINT OPERATION Dr. Gerald Pham-Van-Diep  Purchase 
    A SYSTEMATIC APPROACH TO FAILURE ANALYSIS J. Roepsch, C. Snively, and R. Champaign  Purchase 
    ASSEMBLY COST REDUCTIONS THROUGH OPTICAL FIBER RIBBON SPLICING Jason Holman  Purchase 
    DEVELOPMENT OF A COMPLIANT SOLDER John Ranieri and Hsingching Crystal Hsu  Purchase 
    RELIABILITY ASSESSMENT OF FLIP CHIP ON LAMINATE CSP Julia Y. Zhao, Ph.D.  Purchase 
    A CLOSED-LOOP CONTROL ALGORITHM FOR STENCIL PRINTING Leandro G. Barajas  Purchase 
    TEST RESULTS FROM THE LEAD-FREE COMPONENT FOCUS GROUP Lee Whiteman, et al.  Purchase 
    ORGANIC POLYMER-BASED NONHERMETIC OPTOELECTRONIC PACKAGING OPPORTUNITIES AND ISSUES Leo M. Higgins III, Ph.D.  Purchase 
    2003 HIGH DENSITY MICROELECTRONICS PACKAGING ROADMAP FOR SPACE APPLICATIONS Lissa Galbraith, Ph.D.  Purchase 
    HERMETICITY OF METAL INJECTION MOLDED BOXES FOR FIBER OPTIC AND ELECTRONIC PACKAGES Mitchell N. Gross  Purchase 
    CASE STUDY: THE EFFECT OF SEVERE BLACK PAD DEFECT ON SOLDER BONDS ON BALL GRID ARRAY COMPONENTS R. Champaign, J. Roepsch, and M. Downey  Purchase 
    STATIC & DYNAMIC CHARACTERISTICS OF INTERPOSER SOCKETS Raymond J. Iannuzzelli  Purchase 
    SURFACE MOUNT CONDUCTIVE ADHESIVE: AN ALTERNATIVE TO LEAD-BASED SOLDER Rita Mohanty, PhD  Purchase 
    IN-LINE AUTOMATION OF FIBER-OPTIC PROCESSES William L. Emkey  Purchase 
    PATENT DATABASES AND ANALYTICAL TOOLS FOR SURFACE MOUNT TECHNOLOGY RESEARCH AND DEVELOPMENT William N. Hulsey, III, and John R. Schell  Purchase 

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