Pan Pacific Symposium 2002 Proceedings

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    TITLE AUTHOR DOWNLOAD
    SPECIAL ISSUES IN 3D-MICROELECTRONICS INTERNAL COUPLINGS A. Brandolini, A. Gandelli and R.E. Zich  Purchase 
    CHALLENGES IN LEAD-FREE REWORK Arun Gowda  Purchase 
    MECHANICAL RELIABILITY OF UNDERFILLED CSP ASSEMBLIES Arun Gowda et al.  Purchase 
    PRODUCT COST ESTIMATION USING ACTIVITY-BASED COSTING Ashish Tarhalkar & K. Srihari, Ph.D.  Purchase 
    A SIMPLIFIED REFLOW SOLDERING PROCESS MODEL David C. Whalley  Purchase 
    ULTRA HIGH Q INDUCTOR AND RF INTEGRATED PASSIVE DEVICES ON THICK OXIDE SI SUBSTRATE Dong-Wook Kim et al.  Purchase 
    A LOW COST RELIABILITY ASSESSMENT FOR DOUBLE-SIDED MIRROR-IMAGED FLIP CHIP BGA ASSEMBLIES Dr. A.C. Shiah and Xiang Zhou  Purchase 
    OPTOELECTRONICS - ADDING A LITTLE LIGHT TO THE NANO-WORLD Dr. Ken Gilleo  Purchase 
    AFFORDABLE 'STRUCTURES' FOR LOW VOLUME PRODUCTION Dr. Ramesh Sharma  Purchase 
    PREDICTIVE MODELING OF THERMALLY INDUCED STRESSES IN MICROELECTRONIC AND PHOTONIC STRUCTURES: ROLE, ATTRIBUTES, REVIEW E. Suhir  Purchase 
    FACTORS AFFECTING VOIDING IN UNDERFILLED FLIP CHIP ASSEMBLIES George Carson, PhD and Maury Edwards  Purchase 
    A STUDY OF MICROSTRUCTURAL CHANGE OF LEAD-CONTAINING AND LEAD FREE SOLDERS Hans-Jurgen Albrecht  Purchase 
    DEVELOPMENT OF HIGH DENSITY PRINTED WIRING BOARD WITH FINE STACKED VIA HOLES Hideki Higashitani et al.  Purchase 
    ENCAPSULATION TECHNOLOGY FOR 3D STACKED PACKAGES Horatio Quinones et al.  Purchase 
    ENHANCED SCANNING ACOUSTIC MICROSCOPY THROUGH F-SCAN IMAGING James C.P. McKeon  Purchase 
    LEAD-FREE SOLDER BOND EVALUATION USING ACOUSTIC MICRO IMAGING (AMI) Janet E. Semmens  Purchase 
    ACOUSTIC MICRO IMAGING IN THE FOURIER DOMAIN FOR EVALUATION OF ADVANCED PACKAGING Janet E. Semmens and Lawrence W. Kessler  Purchase 
    PROCESS QUALIFICATION STRATEGIES FOR FLIP CHIP IN THE EMS ENVIRONMENT Jeff Kennedy  Purchase 
    ELECTRICAL CHARACTERIZATION OF LEAD-FREE SOLDER SEPARABLE CONTACT INTERFACES Ji Wu, Michael Pecht et al.  Purchase 
    BALL SHEAR STRENGTH OF 63Sn-37Pb SOLDER BUMP WITH TEST CONDITIONS Jin-Won Choi, Jae-Hoon Choi, and Tae-Sung Oh  Purchase 
    PATTERNING THREE-DIMENSIONAL STRUCTURES ON WAFERS WITH ELECTROPHORETIC PHOTORESIST John Klocke  Purchase 
    DEVELOPMENT OF A COMPLIANT SOLDER John Ranieri, Hsingching Crystal Hsu  Purchase 
    DESIGN CHALLENGES IN SMT TERMINAL BLOCK DESIGN Jonathan France  Purchase 
    MULTICHIP MODULE ON SILICON FOR SAW FILTER EMBEDDED RF RECEIVER Jong-Soo Lee et al.  Purchase 
    CAPACITY REQUIREMENTS PLANNING IN A HIGH VOLUME, MEDIUM/HIGH MIX EMS PROVIDER'S ENVIRONMENT K. Srihari, Ph.D.  Purchase 
    mBGA's SOLDER & OVEN PROFILES - CRITICAL PROCESS VARIABLES Kathleen S. Palumbo  Purchase 
    STUDY ON LOW-STRESS FLIP CHIP PACKAGING USING ADVANCED NON CONDUCTIVE PASTE (ANCP) Kenichi Suzuki et al.  Purchase 
    CSP FLUX-FREE UNDERFILL RESIN FOR ELECTRICAL CONNECTION AND PHYSICAL ADHESION Kenji Kitamura et al.  Purchase 
    THERMAL AGING RELIABILITY OF SOLDER BALL JOINT FOR SEMICONDUCTOR PACKAGE SUBSTRATE Kiyoshi Hasegawa et al.  Purchase 
    ADHESION AND RELIABILITY OF UNDERFILL/SUBSTRATE INTERFACES IN FLIPCHIP BGA PACKAGES: METROLOGY AND CHARACTERIZATION Kumar Nagarajan  Purchase 
    STUDY ON COINED SOLDER BUMPS ON PCB PADS Kyung W. Paik et al/  Purchase 
    MASKLESS DEPOSITION TECHNOLOGY TARGETS PASSIVE EMBEDDED COMPONENTS M. J. Renn, B. H. King, and M. Essien  Purchase 
    FROM BATCH TO BREAKTHROUGH: UNDERSTANDING PHASE CONVECTION TECHNOLOGY Mark J. Norris  Purchase 
    AUTOMATED OPTICAL INSPECTION (AOI): USING THE DATA TO ACHIEVE THE "ZERO DEFECT LINE" Mark J. Norris  Purchase 
    SOC VS SIP: ALTERNATIVE PATHS TO HDI (SLI)? Martin Goetz  Purchase 
    THERMAL PACKAGE ENHANCEMENT IMPROVES HARD DISK DRIVE DATA TRANSFER PERFORMANCE Michael Ko  Purchase 
    THE BUSINESS, PRODUCT LIABILITY AND TECHNICAL ISSUES ASSOCIATED WITH USING ELECTRONIC PARTS OUTSIDE THE MANUFACTURER'S SPECIFIED TEMPERATURE RANGE Michael Pecht  Purchase 
    DIELECTRIC CHARACTERISTICS OF ENCAPSULATION MATERIALS USED IN MICROELECTRONIC PACKAGING Michael Todd  Purchase 
    SOLDER JOINT STRENGTH VERSUS INSERTION, EXTRACTION AND IN-FIELD FORCES APPLIED TO A SURFACE MOUNT DEPLUGGABLE CONNECTOR Michel Hodak  Purchase 
    A STATISTICAL BASED STUDY FOR COMPARISON AND OPTIMIZATION OF AN ENCLOSED PRINT HEAD TECHNOLOGY Muffadal Mukadam et al.  Purchase 
    PROCESS CHALLENGES AND SOLUTIONS FOR EMBEDDING CHIP-ON-BOARD INTO MAINSTREAM SMT ASSEMBLY Mukul Luthra  Purchase 
    SMART MEMS MODULE ASSEMBLY FOR AIRCRAFT APPLICATIONS Namsoo P. Kim, Chung-Ping Chien, and Minas H. Tani  Purchase 
    THERMAL ENHANCEMENT OF PBGA BY HIGH THERMAL CONDUCTIVITY MOLD COMPOUND AND PACKAGE DESIGN OPTIONS Navas Khan et al.  Purchase 
    UNDERFILL FLOW MODELING FOR FLIP CHIP ON BOARD ASSEMBLY P.Venkataraman, C. Fullone, M. Ramkumar  Purchase 
    SOLDER FATIGUE RELIABILITY ISSUES IN LEAD-FREE BGA PACKAGES Pedro Chalco  Purchase 
    A RELIABLE FLIP-CHIP FLEX BGA WITH REFLOWABLE UNDERFILL Poi-Siong Teo et al.  Purchase 
    THE NEW FILM INTELLIGENT ELECTRONIC CONVERTERS USING NEW DUPONT AND ESL HIGH TECHNOLOGY MATERIALS FOR LOW POWER DISCHARGE LAMPS Prof. Tadeusz Sobczyk  Purchase 
    "CURING" LOW YIELDS & RELIABILITY ISSUES IN PHOTONICS ASSEMBLY Richard S. Garard and Bruce A. Adams  Purchase 
    INSIDER THREAT RISK MANAGEMENT FOR TRADE SECRETS AND INTELLECTUAL PROPERTY Richard Sheiman  Purchase 
    LINE BALANCING AND PRODUCTIVITY IMPROVEMENTS IN ELECTRONICS ASSEMBLY USING MODELING AND SIMULATION TECHNIQUES S. Manian Ramkumar  Purchase 
    NEW PROCESS/PRODUCT INTRODUCTION: DO IT RIGHT THE FIRST TIME Salim Merchant  Purchase 
    DRAM PACKAGING AND SMT ASSEMBLY OF MEMORY MODULES Sarah Shen and Wayne Koh  Purchase 
    AN INVESTIGATION ON COPPER CONDUCTIVE PASTE FOR HDIIVH SUBSTRATES Shen-Li Fu et al.  Purchase 
    DEVELOPMENT OF A CLOSELY DUCTED HEATSINK COOLING SOLUTION FOR AN ARRAY OF PARALLEL PROCESSORS Steven J. Young and Julius Caesar T. Zerna  Purchase 
    MIL/AERO MEMS: BENEFITS AND BARRIERS Tom Clifford  Purchase 
    X-RAY INSPECTION ... AVOID RADIATION DAMAGE Tom Clifford  Purchase 
    DEVELOPMENT OF SHORTENING PROCESS TIME IN SBB Toshiyuki Kojima et al.  Purchase 
    STACKED MULTI-CHIP PACKAGING FOR THE NEXT GENERATION ELECTRONICS Vern Solberg  Purchase 
    THIN FILM EMBEDDED PASSIVES FOR MICROWAVE AND MILLIMETER WAVE APPLICATIONS W. de Raedt, E. Beyne, R. Mertens  Purchase 
    PERSPECTIVES ON DIGITAL CONSUMER GOODS AND SYSTEM LSI Yukio Furuta  Purchase 

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