SMTA International 2001 Proceedings

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    TITLE AUTHOR DOWNLOAD
    DIFFUSION CONTROLLED GROWTH OF TERNARY INTERMETALLIC COMPOUNDS IN PB-BASED AND PB-FREE ELECTRONIC SOLDER JOINTS A. Zribi and E. J. Cotts  Purchase 
    MATERIALS AND SYSTEMS CHOICES FOR BLUETOOTH AND BEYOND Alan Rae  Purchase 
    LOW COST FLIP CHIP ON PAPER ASSEMBLY UTILIZING NON-THERMAL CURE MATERIALS Ali Tootoonchi and Jad Rasul  Purchase 
    BOARD MOUNTED RELIABILITY CHARACTERISTICS OF FLIP-CHIP PBGA Andrew Mawer, T. Koschmieder and D. Hodges Popps  Purchase 
    PACKAGING CONSIDERATIONS FOR BLUETOOTH APPLICATIONS Antonio Do-Bento-Vieira  Purchase 
    SOLDER JOINT RELIABILITY CHARACTERIZATION OF LBGA CONFIGURATIONS FOR AUTOMOTIVE UNDER-THE-HOOD APPLICATIONS Antonio Do-Bento-Vieira  Purchase 
    CHARACTERISATION OF THE POLYMER STUD GRID ARRAY (PSGA), A LEAD-FREE CSP FOR HIGH PERFORMANCE & HIGH RELIABLE PACKAGING Bart Vandevelde  Purchase 
    REAL TIME STATISTICAL PROCESS CONTROL OF THE SCREEN PRINT PROCESS Bill Beair  Purchase 
    ELIMINATING THE 'HUMAN FACTOR': IMPLEMENTING QUALITY TOOLS AND TECHNIQUES Brian Coll  Purchase 
    FIELD FAILURE OF A CIRCUIT DUE TO CAPACITOR DAMAGE DURING ASSEMBLY C. A. Paszkiet  Purchase 
    SOLDERABILITY OF LEAD-FREE FINISHES USING LEAD-FREE SOLDERS C. Fan, Y. Zhang and J. A. Abys  Purchase 
    INTRODUCING NEW TECHNOLOGY IN THE CONTRACT ELECTRONICS MANUFACTURING ENVIRONMENT Cameron E. Presley  Purchase 
    RELIABILITY OF BGA UNDER VIBRATIONS Cemal Basaran and Alexander Cartwright  Purchase 
    UNDERSTANDING WHISKER PHENOMENON - MECHANISMS STUDY Chen Xu  Purchase 
    SYSTEM-IN-PACKAGE TECHNOLOGY, APPLICATION AND TRENDS Christopher M. Scanlan and Nozad Karim  Purchase 
    WHAT DOES IT TAKE TO SUCCESSFULLY IMPLEMENT AOI? Chuck Gamble  Purchase 
    AN IMPROVED IMAGING SYSTEM FOR INSPECTING BGA, CSP, FLIP CHIP, AND OTHER HIDDEN SOLDER CONNECTIONS Cliff R. Bockard  Purchase 
    IPC-9850 SURFACE MOUNT EQUIPMENT CHARACTERIZATION OFFICIAL PROPOSAL UPDATE Craig C. Ramsey, Ph.D.  Purchase 
    SURFACE MOUNT PLACEMENT EQUIPMENT CHARACTERIZATION Damian Hujic  Purchase 
    THERMAL MANAGEMENT OF POWER FLIP CHIPS AS USED IN PRINTED CIRCUIT BOARD BASED ELECTRONIC ASSEMBLIES Darrel Peugh  Purchase 
    INDUSTRY-UNIVERSITY RESEARCH IN ELECTRONICS MANUFACTURING: THE BINGHAMTON UNIVERSITY MODEL Daryl L. Santos, Ph.D.  Purchase 
    INVESTIGATION OF ANISOTROPIC CONDUCTIVE ADHESIVE INTERCONNECT ASSEMBLY PROCESS ONTO AN ORGANIC SUBSTRATE David Geiger  Purchase 
    TEST AUTOMATION, A COST EFFECTIVE AND RELIABLE ALTERNATIVE TO LABOR David W Dooley  Purchase 
    DESIGN CONSIDERATIONS FOR FABRICATION OF LARGE AREA, HIGH DENSITY, HIGH LAYER COUNT CIRCUIT BOARD ASSEMBLIES Deepak K. Pai  Purchase 
    LOW COST SOLDER BUMPING VIA PASTE REFLOW Dr. Benlih Huang and Dr. Ning-Cheng Lee  Purchase 
    FLIP CHIP BGA RELIABILITY STUDY STATISTIC APPROACH FOR PACKAGE RELIABILITY ASSESSMENT AND PROCESS DEVELOPMENT Dr. Paul P.E. Wang, Ken Kochi, and Livia Hu  Purchase 
    PREDICTION OF NON-VOLATILE RESIDUE FOR SOLDER PASTE FORMULATION BY WEIGHT LOSS BEHAVIOR STUDY OF RAW MATERIALS Dr. Quan Sheng and Charles Bradshaw  Purchase 
    EVALUATION OF TWO NOVEL LEAD-FREE SURFACE FINISHES Dr. Richard Ludwig and Dr. Ning-Cheng Lee  Purchase 
    PROCESS AND MATERIAL SELECTION FOR ZERO DEFECTS AND SUPERIOR ADHESION LEAD FREE SMT SOLDERING Dr. Sammy Shina and Hemant Belbase  Purchase 
    FIBER OPTICS STRUCTURAL MECHANICS: ATTRIBUTES AND REVIEW Ephraim Suhir  Purchase 
    CRITICAL MANUFACTURING ISSUES AND SOLUTIONS FOR TRACKING MOISTURE SENSITIVE DEVICES (MSDS) François Monette  Purchase 
    USING INDUSTRY DPMO STANDARDS - AN IN-DEPTH LOOK AT IPC-9261 AND IPC-7912 Fritz Byle  Purchase 
    FACTORS AFFECTING VOIDING IN UNDERFILLED FLIP CHIP ASSEMBLIES George Carson, PhD and Maury Edwards  Purchase 
    THERMOPLASTIC CONNECTOR HOUSINGS IN A LEAD-FREE WAVE SOLDERING ENVIRONMENT Gerald Keep  Purchase 
    THE WHY, WHERE, WHAT, HOW, AND WHEN OF AUTOMATED X-RAY INSPECTION Glen Leinbach and Stig Oresjo  Purchase 
    PHOTONICS ASSEMBLY IN AN EMS ENVIRONMENT Glenn Woodhouse  Purchase 
    0201 COMPONENT ISSUES: SUPPLY CHAIN, DESIGN, AND MANUFACTURING PROCESS Greg Hansen, Kevin Kent, and Rich Anderson  Purchase 
    AUTOMATED PROCESS CONTROL FOR THE REFLOW PROCESS Greg Jones, Ph.D  Purchase 
    INTERCONNECT RELIABILITY OF WIRE BOND BGA SUBSTRATES USING VIA-IN-PAD TECHNOLOGY Greg Ridsdale  Purchase 
    BOARD LEVEL RELIABILITY OF LEAD-FREE SOLDERED INTERCONNECTS ON CONVENTIONAL AND AREA ARRAY COMPONENTS H.-J. Albrecht, K. Wilke  Purchase 
    WAVE SOLDER BRIDGING REDUCTION THROUGH PHOTO IMAGED SOLDER MASK GLOSS LEVEL CONTROL Hank Sanftleben and John Borneman  Purchase 
    e-MANUFACTURING SOFTWARE FOR PRODUCT AND PROCESS REAL-TIME MONITORING Hersh Kohli, Ranjan Chatterjee, Dan Kauss  Purchase 
    MOISTURE SENSITIVE COMPONENT STORAGE Hiro Suganuma and Alvin Tamanaha  Purchase 
    MULTI-LAYER 3D SYSTEM-ON-PACKAGE (SOP) ARCHITECTURES FOR HIGHLY INTEGRATED MICROWAVE AND MILLIMETER WAVE RADIO FRONT-END J. Laskar  Purchase 
    BROWSER-BASED COMPUTER INTEGRATED MANUFACTURING SOFTWARE FOR ELECTRONICS ASSEMBLERS Jason Spera  Purchase 
    CNES APPROACH FOR THE QUALIFICATION OF MEMS FOR SPACE APPLICATIONS Jean-Pierre Fortéa  Purchase 
    EVALUATIONS TO VALIDATE NEW CHEMICAL ETCH SUBSTRATE PROCESSING ABILITY TO PASS TEMPERATURE CYCLE AND MOISTURE REQUIREMENTS ON MAP BGA Jeannie Miller  Purchase 
    SRM: LEVERAGING THE SUPPLY BASE FOR COMPETITIVE ADVANTAGE Jeff Herrmann and Brian Hodgson  Purchase 
    ADVENTURES IN OUTSOURCING: THE APPLIED USE OF THE BOOTSTRAP METHOD Jeff Renz  Purchase 
    ANALYSIS OF ACCELERATION FACTORS USED TO PREDICT BGA SOLDER JOINT FIELD LIFE Jesse E. Galloway  Purchase 
    KEY FACTORS IN THE DESIGN FOR MANUFACTURABILITY (DFM) PROCESS Joe Belmonte  Purchase 
    SMALL PBGA RELIABILITY CONSIDERATIONS FOR UNDER-HOOD AUTOMOTIVE ELECTRONICS John L. Evans, Ph.D.  Purchase 
    PROCESSING THROUGH-HOLE TERMINALS IN A PURE SMT REFLOW PROCESS Joshua K. Brown  Purchase 
    ADVANCED POWER PACKAGING USING COPPER/TUNGSTEN COMPOSITES Juan L. Sepulveda and David E. Jech  Purchase 
    UNDERFILL : VOID FORMATION AND COUNTER MEASURES K. Mizuike, K. Kanaji, K. Watanabe and T. Mizutani  Purchase 
    THE BENEFITS OF IN-LINE TEST AUTOMATION: NEW PROCESSES AND A CREATIVE APPROACH TO TEST AUTOMATION CAN CREATE COMPETITIVE ADVANTAGE Keith B. Henry  Purchase 
    THERMAL AGING RELIABILITY OF SOLDER BALL JOINT FOR SEMICONDUCTOR PACKAGE SUBSTRATE Kiyoshi Hasegawa  Purchase 
    ACCOMPANYING QUALITY ASSURANCE WITH INTELLIGENT PROCESS COORDINATION Klaus Feldmann and Rüdiger Holzmann  Purchase 
    ARE YOU IN CONTROL OF YOUR ELECTROLESS NICKEL/IMMERSION GOLD PROCESS? Kuldip Johal  Purchase 
    WAFER-LEVEL REDISTRIBUTION USING ELECTROLESS CU DEPOSITION L. Boettcher  Purchase 
    PLATED GOLD THICKNESS EFFECTS ON ORGANIC SUBSTRATE WIREBOND PULL STRENGTH AND BGA BALL SHEAR M. D. Holcomb  Purchase 
    QUALITY PROCESS OPTIMIZATION BY USING "DYNAMIC PROGRAMMING" M. Oppermann, W. Sauer, H. Wohlrabe and T. Zerna  Purchase 
    GUIDELINES FOR FINE FEATURE STENCIL PRINTING Mandar Painaik, Daryl L. Santos, Ph.D.  Purchase 
    THE NEW MILLENNIUM FOR CCGA - BEYOND 2000 I/O Marie S. Cole  Purchase 
    SELECTIVE SOLDER FIXTURES : COST EFFECTIVE MIXED TECHNOLOGY SOLDERING Marie Spalding  Purchase 
    DIFFERENCES BETWEEN ALUMINUM AND COPPER WAFER METALLIZATION IN THE WAFER SAW PROCESS FOR THIN BGA PACKAGES Mark Gerber, Daniel Cavasin and Noel Arguello  Purchase 
    ADVANCES IN AUTOMATIC OPTICAL INSPECTION: GRAY SCALE CORRELATION vs. VECTORAL IMAGING Mark J. Norris  Purchase 
    LEVERAGING SEMICONDUCTOR TECHNOLOGY FOR SYSTEM IN PACKAGE Martin Goetz  Purchase 
    SOLDERING PROCESS USING LIGHT BEAM TECHNOLOGY Masaharu Takagi  Purchase 
    INVESTIGATION OF LEAD FREE SOLDER PROCESSING Mathias Nowottnick, U. Pape, K. Wittke, W. Scheel  Purchase 
    OEM OUTSOURCING TO EMS COMPANIES BUILDING SUCCESSFUL RELATIONSHIPS Matt Srnec and Jim Gryga  Purchase 
    INVESTIGATION OF PRINTING ISSUE AND STENCIL DESIGN FOR 0201 PACKAGE Mei Wang  Purchase 
    MACHINE PLATFORM DETERMINATION WHAT’S BEST FOR YOUR FACTORY? Michael Cieslinski & Brian Mathey  Purchase 
    ALTERNATIVE UNDERFILL MATERIAL FOR CSP PACKAGES: LOW OUTGASSING AND IONICS EPOXY Michael Ko  Purchase 
    PWB CONTAMINATION & RELIABILITY DOE Michael R. Weekes  Purchase 
    USING QUALITY AS A CUSTOMER-CENTRIC ASSESSMENT FOR CAPITAL INVESTMENT Mike Buseman  Purchase 
    COMPONENT AND BOARD LEVEL RELIABILITY OF HIGH PIN COUNT FLIP CHIP PACKAGES Mike Loo  Purchase 
    PERFORMANCE EVALUATION OF LEAD-FREE SOLDER PASTES Minna Arra  Purchase 
    EVALUATION AND OPTIMIZATION OF THE SPEEDLINE MPM CLOSED-LOOP RHEOMETRIC PUMP HEAD Muffadal Mukadam and Daryl Santos  Purchase 
    POLYMER STENCILS FOR FINE PITCH APPLICATIONS Nils Heininger  Purchase 
    IMPLEMENTATION OF NO FLOW UNDERFILL MATERIALS FOR LOW COST FLIP CHIP ASSEMBLY P. N. Houston, B. A. Smith, and D. F. Baldwin  Purchase 
    RELIABILITY OF 27MM, 1.0MM PITCH PLASTIC BALL GRID ARRAYS (PBGAS) FOR AUTOMOTIVE APPLICATIONS Patrice Langford* and Diane Hodges Popps  Purchase 
    THERMAL FATIGUE RESISTANCE OF Pb-FREE SECOND LEVEL INTERCONNECT Patrick Roubaud and Greg Henshall  Purchase 
    BOARD-LEVEL OPTRONICS ASSEMBLY AND PACKAGING Peter Arrowsmith  Purchase 
    FLUX CHEMISTRIES AND THERMAL PROFILING: AVOIDING SOLDERING DEFECTS IN SMT ASSEMBLY Peter Biocca  Purchase 
    PLANE UNDER BGA RELIABILITY Phil Geng and Scott Dixon  Purchase 
    DESIGN AND TEST MUST WORK TOGETHER TO SOLVE LIMITED ACCESS TEST PROBLEMS Randy Bird and Jim Arient  Purchase 
    RELIABILITY OF COTS MEMS ACCELEROMETER UNDER SHOCK AND THERMOMECHANICAL CYCLING Reza Ghaffarian  Purchase 
    RAPID QUALIFICATION OF CSP ASSEMBLIES BY INCREASE OF RAMP RATES AND CYCLING TEMPERATURE RANGES Reza Ghaffarian  Purchase 
    LOGIC CORE DESIGN AND DEVELOPMENT FOR HARSH ENVIRONMENT AUTOMOTIVE APPLICATIONS Riccardo Groppo  Purchase 
    DESIGN FOR TESTABILITY UNDERSTANDING THE OVERALL APPROACH Rich Freiberger  Purchase 
    AN OVERVIEW OF IPC STANDARDS RELATED TO MOISTURE SENSITIVE COMPONENTS Robert Rowland  Purchase 
    FLIP-CHIP UNDERFILLING INNOVATIVE ADHESIVE SYSTEMS FOR AN INNOVATIVE APPLICATION Robert Saller  Purchase 
    DEALING WITH THE "BLACK PAD DEFECT" - A FAILURE ANALYST’S PERSPECTIVE Roger Jay & Alfred Kwong  Purchase 
    Fatigue of Plastic Ball Grid Array and Plastic Quad Flat Packages under Automotive Vibration Ron S. Li and Larry Poglitsch  Purchase 
    PRINT PROCESS CHARACTERIZATION FOR BGA, FINE PITCH BGA AND CSP COMPONENTS S. Manian Ramkumar and Richard Clouthier  Purchase 
    AN ALTERNATIVE APPROACH TO HIGH DENSITY INTERCONNECT PCB Samuel Tilakraj  Purchase 
    WAVE SOLDER: OPTIMIZE THE PROCESS? DESIGN IT OUT Scott Martin AND Heidi Martin  Purchase 
    PBGA RELIABILITY FOR AUTOMOTIVE ELECTRONICS Scott Post  Purchase 
    CERAMIC CSP ; RELIABLE BOARD LEVEL INTERCONNECTION UNDER SEVERE TEMPERATURE CYCLING TEST CONDITION Shoji Uegaki  Purchase 
    INVESTIGATION OF IMMERSION SILVER PCB FINISHES FOR PORTABLE PRODUCT APPLICATIONS Srinivas Chada and Edwin Bradley, III  Purchase 
    HIGH VOLUME LEAD FREE PRODUCTION Stephen Wong, Myron Nestor  Purchase 
    DEFECT LEVELS FOR DIFFERENT COMPONENT TYPES AT THE PCBA MANUFACTURING PROCESS Stig Oresjo  Purchase 
    CONSIDERATIONS IN THE DESIGN OF IMPINGEMENT-COOLED SYSTEMS Suresh V. Garimella  Purchase 
    RELIABILITY OF LEAD FREE SOLDER JOINTS ON MANUFACTURING CONDITIONS Th. Herzog , K.-J. Wolter, Th. Zerna  Purchase 
    PRINTED BOARD PROCESS CAPABILITY, QUALITY AND RELATIVE RELIABILITY (PCQR 2 ) BENCHMARK TEST STANDARD Thomas D. Newton  Purchase 
    ANALYSIS OF RELIABILITY CONCERNS IN UNDERFILLED FLIP CHIPS USING SCANNING ACOUSTIC MICROSCOPY Todd Snively and Bruce Oliver  Purchase 
    DPMO - A KEY METRIC FOR PROCESS IMPROVEMENT IN PCB ASSEMBLY Tom Woody  Purchase 
    TEST EFFECTIVENESS: A METRIC FOR COMPARING TEST EQUIPMENT AND TEST PROCESSES Tracy Ragland  Purchase 
    STRENGTH AND FATIGUE BEHAVIOR OF JOINTS MADE WITH Bi-42Sn-1Ag SOLDER PASTE: AN ALTERNATIVE TO Sn-3.5Ag-0.7Cu FOR LOW COST CONSUMER PRODUCTS V. Schroeder, F. Hua,* and J. Gleason  Purchase 
    MICROSYSTEM TECHNOLOGIES FOR MOBILE COMMUNICATION PRODUCTS Vladimir Ermolov  Purchase 
    STENCIL PRINT PERFORMANCE STUDIES William E. Coleman  Purchase 
    QUANTIFYING THE EFFECTS OF THE FACTORS THAT INFLUENCE YIELD IN AN EMS ENVIRONMENT X. Zhou & H. Ladhar  Purchase 

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