South East Asia Technical Training Conference on Electronics Assembly Technologies 2015 Proceedings

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    TITLE AUTHOR DOWNLOAD
    Package-On-Package (PoP) Solder Short FA Technique Afaq Ahmed, B.E., MBA, Mohammad Nizam Othman, Fazli Haidir  Purchase 
    Enabling the Use of PET Flexible Substrates for LED Lighting Applications Amit Patel, Rahul Raut, Ranjit Pandher, Ph.D., Ramazan Soydan, Westin Bent and Ravi Bhatkal, Ph.D., Brent Sweitzer, James Toonen, Bob Hanson  Purchase 
    Chemical Influences on the Reliability of Complex Assemblies Bruno Tolla, Ph.D., Yanrong Shi, Xiang Wei, Hemal Bhasvar  Purchase 
    Effects of Flux Residues on Thermal Shock Performance of Conformal Coatings Carolyn Taylor, Phil Kinner  Purchase 
    Cool Substrate for 2.5D Packages Charles Lin, Ph.D., Nick Wang, Jerry Tan  Purchase 
    Multi-Array PCB Traceability System Christoph Wimmer  Purchase 
    Laser Singulation of FR-4 and Metal Substrates D Suneail, Tan Chi Wai & Allen Duck  Purchase 
    Reliability Assessment of No-Clean and Water-Soluble Solder Pastes Part I Emmanuelle Guéné, Steven Teh  Purchase 
    Innovative Nanocoatings for High Volume Conformal Coating of Electronics Eva Rogge, MSc and Filip Legein, MSc, MBA  Purchase 
    Key To Building Solar Panel Efficiently and Effectively John Almiranez  Purchase 
    A Novel Solution for Circuit Board Protection Kevin Tan and Casey Ng  Purchase 
    Guidelines for Printed Circuit Board Assembly (PCBA) of UTAC Group's Grid Array Package (GQFN) and Its Board Level Reliability Kyaw Ko Lwin, Daniel Ting Lee Teh, Carolyn Epino Tubillo, Jun Dimaano, Ang Choon Ghee, Nathapong Suthiwongsunthorn, Saravuth Sirinorakul  Purchase 
    The Development of a 0.3mm Pitch CSP Assembly Process Part 1: Stencil Printing Considerations Mark Whitmore, Jeff Schake  Purchase 
    Electronic Cleaning Fluid Adancements Mike Bixenman, DBA, Haley Jones, Chelsea Jewell, Jason Chan and T.C. Loy  Purchase 
    Real Time Control of Multi-Phase Electronic Assembly Cleaning Agents Ram Wissel, Mike Bixenman, DBA, Jason Chan & T.C. Loy  Purchase 
    Low Porosity Pressureless Sintering of Nano-Ag Paste for Die Attach Sihai Chen, Guangyu Fan, Xue Yan, Chris LaBarbera, Lee Kresge, and Ning-Cheng Lee, Ph.D.  Purchase 
    Ultralow Residue (ULR) Semiconductor Grade Fluxes for Copper Pillar Flip-Chip SzePei Lim, Jason Chou, Maria Durham, Dr. Hyoryoon Jo, and Dr. Andy Mackie  Purchase 
    SMT Soldering with Low Temperature Solder Paste Tang Kok Kwan, Raiyo F. Aspandiar, Scott Mokler, Olivia Chen, Art Jiang  Purchase 
    Addressing High Precision Automated Optical Inspection Challenges with Unique 3D Technology Solution Todd Liberty, P.E., Tim Skunes  Purchase 
    Maintaining OSP Coating Integrity During the Cleaning Process Umut Tosun, M.S.Chem.Eng., Naveen Ravindran, M.S.Chem.Eng., Michael McCutchen, M.S.Chem.  Purchase 
    Improving System Quality Through Quality Data Analytics Wen Wei Low, Yvonne Yeo Chii  Purchase 

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