International Conference on Soldering & Reliability 2015 Proceedings

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    TITLE AUTHOR DOWNLOAD
    Crack Paths and Fracture Loads of BGA Solder Joints under Bending as a Function of Strain Rate and Mode Ratio Amir Nourani, Saeed Akbari and Jan K. Spelt  Purchase 
    Enabling the Use of PET Flexible Substrates for LED Lighting Applications Amit Patel, Rahul Raut, Ranjit Pandher, Ph.D., Ramazan Soydan, Westin Bent, Ravi Bhatkal, Ph.D., Brent Sweitzer, James Toonen, and Bob Hanson  Purchase 
    The Effects of Bi and Aging on the Microstructure and Mechanical Properties of Sn-Rich Alloys André Delhaise, Doug Perovic, and Polina Snugovsky, Ph.D.  Purchase 
    The Use of Graphene to Replace Silver in Electricaly Conductive Adhesives - A Study on Electrical Conductivity and Mechanical Properties Behnam Meschi Amoli, Ph.D.; Josh Trinidad; Norman Y. Zhou, Ph.D.; Boxin Zhao, Ph.D.; Alex Chen; John Persic, Ph.D.; Robert Lyn, Ph.D.  Purchase 
    IPC-CC-830B vs The Real World: Part 3. Factors Influencing the Tendency for A Conformal Coating to Crack During Thermal Shock Cycling Carolyn Taylor, Emma Mangham, and Phil Kinner  Purchase 
    BGA Solder Joint Integrity: A Case Study Dave Hillman and Ross Wilcoxon  Purchase 
    Microstructural Evaluation of Low and No-Ag, Bi-Containing Pb-Free Solders Eva Kosiba, Polina Snugovsky, Doug Perovic  Purchase 
    Verification of Cleaning under Leadless Components Flavius Dehel and Ishrat Hasan  Purchase 
    Reliability Threats Fine Pitch Through Hole Soldering Gerjan Diepstraten  Purchase 
    Case Study - Head in Pillow Defect on a Plastic Ball Grid Array Henry Rekers, P. Eng.  Purchase 
    The Development of a 0.3mm Pitch CSP Assembly Process Part 1: Stencil Printing Considerations Jeff Schake and Mark Whitmore  Purchase 
    Solder- Is It The Right Choice For Reliable Electronics Assembly? Joseph Fjelstad  Purchase 
    Characterizing Airplane Environments in Commercial Airplanes Using On-Board Test Vehicles to Evaluate State-Of-The-Art Lead-Free Alloys Joseph M Juarez, Jr, Ph.D.; Connie M Borror, Ph.D.; David Redman, Ph.D.  Purchase 
    Development of Polyurethane-Based Conformal Coatings for Pb-Free Electronics Junghyun Cho, Stephan J. Meschter, and Suraj Maganty  Purchase 
    Estimating the Lifetime of Electrolytic Capacitors M. Simard-Normandin and C. Banks  Purchase 
    Comparing Mechanical and Soldering Properties of Castin™, Babbitt and Alternative Lead-Free Alloys Mehran Maalekian, Yuan Xu, Amir Hossein Nobari, Karl Seelig  Purchase 
    Solder Pastes and Their Marine Pollutant Hazards Michel Hachey, Ph.D.  Purchase 
    How Clean Is Clean Enough to Achieve Reliable Electronic Hardware? Mike Bixenman, DBA, David Lober, Mark McMeen and Jason Tynes  Purchase 
    Preventing Head in Pillow Defects in Area Array Components Nandu Ranadive, Wai Mon Ma, and Daniel Buschel  Purchase 
    Comparison of the Mechanical Shock/Drop Reliability of Flip Chip BGA (FCBGA) Solder Joints Formed by Soldering with Low Temperature BiSn-Based Resin Reinforced Solder Pastes Olivia H Chen, Kevin Byrd, Scott Mokler, Kok Kwan Tang, and Raiyo Aspandiar  Purchase 
    Investigation of Field Failures of Power Systems: A Different Whisker Story Peter Arrowsmith  Purchase 
    Investigations on Magnetic Ni-SAC305 Solder Material System for Inductive Melt Applications R Gopala Krishan, Xu Ke, S. Arun Kumar, Eng Soon Tok, G. Yaadhav Raaj, and G Srayes  Purchase 
    Effect of Viscosity and Fillet Size of Board-Level Underfills on Reliability of BGA Assemblies Saeed Akbari, Amir Nourani, Jan K. Spelt  Purchase 
    Strategic Environmental Research and Development Program (SERDP) Tin Whisker Testing and Modeling: Long Term Low Temperature High Humidity Testing Stephan Meschter, Evan Ekstrom, Polina Snugovsky, Jeff Kennedy, Zohreh Bagheri, and Eva Kosiba  Purchase 
    Stencils for Mixed Flip Chip / SMT Assembly Susan Holmes and William Coleman  Purchase 
    The Performance of Solid Solution Strengthened No Silver Lead Free Solder Takatoshi Nishimura, Mu Dekui, Shuhei Sawada, Keith Sweatman, Keith Howell, Guang Zeng, Kazuhiro Nogita  Purchase 
    Application of Novel Dopamine-Polypyrrole Nanofibers for Electrically Conductive Adhesives Wei Zhang, Behnam Meschi Amoli, Jeffrey d'Eon, Boxin Zhao, Alex Chen  Purchase 

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