2001 Advanced Packaging Technology Proceedings

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    TITLE AUTHOR DOWNLOAD
    MATERIALS AND SYSTEMS CHOICES FOR BLUETOOTH™ AND BEYOND Alan Rae  Purchase 
    Compatibility of Lead-free Solders and Surface finishes Alan Rae, Gene Smelik, Jim McLenaghan  Purchase 
    THE LEAD-FREE SOLDER ALTERNATIVES ISSUE: A DEFENSE INDUSTRY PERSPECTIVE Anthony J. Rafanelli  Purchase 
    LEAD-FREE REWORK PROCESS FOR CHIP SCALE PACKAGES Arun Gowda and K. Srihari, Ph.D.  Purchase 
    IMPLEMENTING BALL GRID ARRAYS IN AN ELECTRONICS MANUFACTURING SERVICE PROVIDER’S ENVIRONMENT Arun Gowda, Robert Murcko, and K. Srihari, Ph.D.  Purchase 
    MICROSTRUCTURE BEHAVIOR OF LEAD-FREE SOLDER JOINTS Blaine L. Partee  Purchase 
    AUTOMATING OPTO-ELECTRONIC PACKAGING Bryan Pate  Purchase 
    EVALUATING SOLDER JOINT FATIGUE RELIABILITY BY MOIRÉ INTERFEROMETRY Cemal Basaran  Purchase 
    ELECTRICAL TESTING OF NO-LEAD –NO-CLEAN PASTE RESIDUES, NO-CLEAN PASTE RESIDUES, AND CONDUCTIVE ADHESIVE RESIDUES TO PREDICT ICT TESTABILITY Charles Bradshaw  Purchase 
    THE INFLUENCE OF STORAGE TIME ON MOISTURE MIGRATION IN POLYMERIC ENCAPSULANTS Charles J. Koehler and Martin A. Seitz  Purchase 
    CONSIDERATIONS FOR THE PIN PROBE TESTING OF NO-CLEAN SOLDER PASTE RESIDUES David Suraski  Purchase 
    WHEN ARE CONDUCTIVE ADHESIVES AN ALTERNATIVE TO SOLDERS? Dr. Ken Gilleo  Purchase 
    Flux Technology For Lead-Free Alloys & Its Impact On Cleaning Dr. Ning-Cheng Lee  Purchase 
    LEAD FREE SOLDER ON COMPAQ’S AERO HANDHELD COMPUTER Elizabeth Elias Benedetto  Purchase 
    CRITICAL MANUFACTURING ISSUES ASSOCIATED WITH MOISTURE SENSITIVE DEVICES (MSD) François Monette  Purchase 
    LEAD-FREE SN3.5AG AND SN0.7CU WAVE SOLDER EVALUATION WITH VOC-FREE NO-CLEAN AND WATER SOLUBLE FLUXES Jasbir Bath  Purchase 
    COMPARING MANUFACTURING PERFORMANCE OF STAGGERED AND INLINE SECOND BOND FINGERS FOR WIRE BONDED BGA SUBSTRATES Jeannie Miller, Mark Gerber and Christina Corona  Purchase 
    DEVELOPING WORLD-CLASS OPTICS ASSEMBLY CAPABILITY John G. Davis  Purchase 
    JOINT FAILURES, LEAD CONTAMINATION AND OTHER IMPORTANT CONSIDERATIONS FOR LEAD-FREE ELECTRONICS ASSEMBLY Karl Seelig and David Suraski  Purchase 
    EVALUATION OF ADVANCED MATERIALS TO SATISFY HIGHER REFLOW AND SOLDER JOINT LIFE REQUIREMENTS ON MAP BGA Mark Gerber, Trent Thompson and Shawn O'Connor  Purchase 
    ATMOSPHERE EFFECTS ON THE COMPARATIVE SOLDERABILITY OF EUTECTIC TIN-SILVER-COPPER AND TIN-LEAD ALLOYS Sean Adams and Paul Stratton  Purchase 
    BOARD-LEVEL RELIABILITY FOR LEAD-FREE QFP ASSEMBLY Shan-Pu Yu  Purchase 
    ENVIRONMENTAL PACKAGING SOLUTIONS WITH NO-PB MATERIALS AND LGA OPTIONS Thomas Koschmieder, Michael Leoni, and Jesse Phou  Purchase 
    A RELIABILITY INVESTIGATION OF Bi-42Sn-1Ag SOLDER PASTE: AN ALTERNATIVE TO Sn-3.5Ag-0.7Cu FOR LOW COST CONSUMER PRODUCTS V. Schroeder  Purchase 
    Lead-Free Solder Bump Technologies for Flip-Chip Packaging Applications Zaheed S. Karim  Purchase 

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