South East Asia Technical Training Conference on Electronics Assembly Technologies 2014 Proceedings

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    TITLE AUTHOR DOWNLOAD
    Applying Lean Six Sigma in Manufacturing Celine YC Chong, Ai Kiar Ang, Marvin Mamac Ortega, Michael Russell and Uy Gonzales  Purchase 
    TSV Barriers Create SMT Opportunities Charles E. Bauer, Ph.D. and Herbert J. Neuhaus, Ph.D.  Purchase 
    Gold Embrittlement in Lead-Free Solder Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen, Julie Silk, and Alex Chiu  Purchase 
    Failure Analysis of High Density Printed Circuit Board Assembly Inside Smartphone David Edwards-Schofield, Anil Kurella Ph.D., Choon Kheam Lim, Yi Yun Chua and Binh T Nguyen  Purchase 
    Bottom Termination Component Design Considerations to Improve Cleaning Dr. Mike Bixenman, Dale Lee, Bill Vuono, and Steve Stach  Purchase 
    Inspection Strategies for More Accurate, Faster and Smarter Inspection Dr. Subodh Kulkarni, Sean Langbridge, Dick Johnson  Purchase 
    High-Reliability, Pb-Free, Halogen-Free Solder Ian J. Wilding & Gavin J. Jackson  Purchase 
    High Density Assembly in PCBb Cavities Jonas Sjoberg, Ranilo Aranda, David Geiger and Murad Kurwa  Purchase 
    Lead-Free and Halogen Free Solder Flip Chips Integration on Board Using SMT Process Jonas Sjoberg, Ranilo Aranda, David Pang, David Geiger and Murad Kurwa  Purchase 
    Package On Package (PoP) Process Characterization And Capability Study Kenny Chiong Kung Chuan, Tan Seak Huat, Ricky Liew and Tan How Chuan  Purchase 
    The Use of MICRO/ATR FTIR in PCBA CRD Smearing Failure Analysis Lee Kong Hui and Jason Ho Wye Meng  Purchase 
    A Process for Improved QFN Reliability Lenora Toscano, John Ganjei, Ph.D., Richard Retallick, and Gu Hong, Ph.D.  Purchase 
    The Rheology and Printing Behaviour of Water Soluble Solder Pastes Li Tianpeng, Tan Ying Ru Jorcelyn, C. D. Breach and A. Hawkins  Purchase 
    Ultra Miniaturized 01005 Passives Assembly Ng Chin Fei, Ng Shirley, Ooi HockWooi, Lim SiewFong  Purchase 
    Optimizing Solder Voids Performance at Thermal Pad and Printability of Its Peripheral Pads for Dual Row QFN Assembly Ooi Hock Wooi, Ricky Liew, Ng Shirley, Wong Hon Sern  Purchase 
    Cleaning PCBs in Electronics: Understanding Today's Needs P.J.Duchi, Anne-Marie Laügt, Marie Verdier, G.Abidh  Purchase 
    Cleaning Soldering Residues From High Lead Soldered PCBs Ram Wissel, Dr. Mike Bixenman & Jason Chan  Purchase 
    0.35mm Pitch Extremely Small Outline No Lead Package (XSON) PCBA Process Characterization Ricky Liew, Shirley Ng, Lim SiewFong  Purchase 
    Failure Modes and Failure Analysis of LEDs in ICMs and Process and Design Optimization of LEDs within ICMs Ron Yin, Ai Kiar Ang, Curtis Grosskopf  Purchase 
    Impact of Low Ag SAC Solder Pastes on BGA Solder Joint Quality Tang Kok Kwan, Raiyo F. Aspandiar, Wu Jin Chang, Colin Wang, Wang Xin  Purchase 
    2014 Best Practices in High Reliability Soldering Terry Clitheroe  Purchase 
    Concentration Monitoring & Closed Loop Control - A Technological Advancement Umut Tosun, M.S.Chem.Eng., Axel Vargas, and Bryan Kim, Ph.D.  Purchase 
    The Second Generation Shock Resistant and Thermally Reliable Low Ag SAC Solder Doped with Mn Vahid Goudarzi, Matthew Brown, Weiping Liu, Ning-Cheng Lee, and Jeffrey ChangBing Lee  Purchase 
    Voiding and Reliability of BGA Assemblies with SAC and 57Bi42Sn1Ag Alloys Yan Liu, Joanna Keck, Erin Page, and Ning-Cheng Lee  Purchase 
    Properties and Structure of Magnetically Responsive Fe - SAC305 Solder Yiteng Lin, Xu Ke, Justin Zhou Yong, Eng Soon TOK, R. Gopala Krishnan, G. Yaadhav Raaj & G Srayes  Purchase 
    Reliability Improvement of Array QFN Package You-Chye How and Shaw-Wei Lee  Purchase 

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