SMTA International 2014 Proceedings

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    TITLE AUTHOR DOWNLOAD
    Characterization and Failure Analysis Techniques for Ball Grid Array Solder Joints Adam W. Mortensen, Maria C. Lee and Roger M. Devaney  Purchase 
    Effect of Solder Alloy, Aging and Tal on High Strain-Rate Fracture of Lead-Free Solder Joints Amir Nourani and Jan K. Spelt  Purchase 
    Low Temperature Assembly of LED Packages on PET & Polyimide Flexible Substrates Amit Patel, Rahul Raut, Ranjit Pandher, Ph.D., Ramazan Soydan, Westin Bent, Ravi Bhatkal, Ph.D., and Brent Sweitzer  Purchase 
    Effect of Thermal Shock on Lead Free Alloy Combinations in Package on Package Assemblies Andrew Daya and S. Manian Ramkumar, Ph.D.  Purchase 
    Recalling the Lead-Free Manhattan Project Anthony J. Rafanelli, Linda Woody  Purchase 
    Reliability of Pcb Solder Joints Assembled With SACm™ Solder Paste Arnab Dasgupta, Fengying Zhou, Christine LaBarbera, Weiping Liu, Paul Bachorik, and Ning-Cheng Lee, Ph.D.  Purchase 
    Soldering Evaluations on the New Direct Palladium Gold Finish (EPAG) Arnd Kilian, Petra Schreier, Maren Bruder, Mustafa Oezkoek and Gustavo Ramos  Purchase 
    Power Overlay (POL) - Advanced Embedding Packaging Technology Platform Arun Gowda, Risto Tuominen, and Paul McConnelee  Purchase 
    A.R.E.A. - Effect Of PCB Surface Finish on Sn Grain Morphology and Thermal Fatigue Performance of Lead- Free Solder Joints Babak Arfaei, Ph.D., Martin Anselm, Ph.D., Francis Mutuku, Eric Cotts, Ph.D.  Purchase 
    Silver Sulfidation Kinetics in Flowers of Sulfur Environment Barry S. Hindin, Ph.D., P.E. and Michah Pledger  Purchase 
    Mitigation of Resistor Silver Sulfide Corrosion Through Design and SMT Process Optimization Biao Cai, Marie Cole, Jing Zhang, Hongqing Zhang, Bae Byung Kwon, Jang In Seok, Ryu Jang Hwan, DongChul Gack  Purchase 
    Design And Material Parameter Effects on BGA Solder-Joint Reliability for Automotive Applications Burton Carpenter, Thomas Koschmieder, Brett Wilkerson, Torsten Hauck Ph.D., John Arthur  Purchase 
    Can Sintered Silvers Be Used in Surface Mount Applications C.P. Hunt & L. Crocker  Purchase 
    Mapping Mechanical Properties of Lead-Free Solder Joints Carlos Morillo Ph.D., Jennifer L. Hay and Julie Silk  Purchase 
    Highly Accurate 3D Solder Paste Inspection Comparing Nano Coated Stencils with Non-Coated Results Carsten Salewski and Jacques L'Heureux  Purchase 
    The Effect of Isothermal Aging on the Reliability of Sn-Ag-Cu Solder Joints Using Various Surface Finishes Chaobo Shen, Zhou Hai, Cong Zhao, Jiawei Zhang, John L. Evans, Ph.D. and M. J. Bozack  Purchase 
    Scalable Approaches for 2.5D IC Assembly Charles G. Woychik Ph.D., Akash Agrawal Ph.D., R. Zhang Ph.D., Roseann Alatorre, Bong-Sub Lee Ph.D., Laura Mirkarimi Ph.D., and Sitaram Arkalgud Ph.D.  Purchase 
    To Kill a Circuit Board: Perils in Manual Soldering and Cleaning Processes Cheryl Tulkoff  Purchase 
    A High Dense Organic Interposer with Fine Feature Size for Advanced Packaging Applications Christian Romero, Jeongho Lee, and Youngdo Kweon  Purchase 
    The Effects of Stencil Alloy, Tension and Cut Quality on Solder Paste Print Performance Chrys Shea and Ray Whittier  Purchase 
    Package on Package Module Assembly Process Development Chuan Xia, Charles Gui and Scott Priore  Purchase 
    Tin Whisker Inorganic Coating Evaluation (TWICE) Dave Hillman, Ross Wilcoxon, Nate Lower and Dan Grossman  Purchase 
    Optimizing X-Ray Inspection with Package on Package David A. Geiger, Zhen (Jane) Feng, Ph. D., Weifeng Liu, Ph.D., Hung Le, Tho Vu, Anwar Mohammed, Murad Kurwa, and Evstatin Krastev, Ph.D.  Purchase 
    Flip Chip Component Technology Qualification for High Performance Avionics Products David Hillman, Ross Wilcoxon, Lauren Schlueter, Ryan Walker, Mario Scalzo, Delia Lara  Purchase 
    Lessons Learned from AIM's Participation in the Conflict-Free Tin Initiative David Suraski  Purchase 
    Thick Copper PCBA Technology & Process Development Dennis Willie, Richard Loi, and David Geiger  Purchase 
    Assembly and Failure Analysis of WLP with 0.3 mm Pitch and Smaller Dudi Amir and Chonglun Fan  Purchase 
    Microstructure Study of Lead-Free Solder Joints Reflowed Using Alternative Low Silver Alloy Solder Pastes Elissa Grace McKay and Jennifer Nguyen  Purchase 
    A Closed-Form Norris-Landzberg Solder Reliability Model Emad S. Al-Momani, Ph.D., Mohammad T. Khasawneh, Ph.D. and Bahgat Sammakia, Ph.D.  Purchase 
    The Effect of Thermal Profiles on Cleanliness and Electrical Performance Eric Camden  Purchase 
    Reworkable Underfill Evaluation for Fine Pitch BGA Applications Fei Xie, Ph.D., Han Wu, Daniel F. Baldwin, Ph.D., Paul Houston, Qing Ji, Ph.D., Ben Bo  Purchase 
    Reliable Soldering for High and Mixed Volume Selective Soldering Processes Gerjan Diepstraten  Purchase 
    Temperature Cycling and Fatigue in Electronics Gilad Sharon, Ph.D. and Cheryl Tulkoff, ASQ CRE  Purchase 
    BTC: Bottom Termination Component or Biggest Technical Challenge? Greg Caswell and Cheryl Tulkoff, ASQ CRE  Purchase 
    High Temperature Resistant Interconnects for Power Electronic Application H.-J. Albrecht, Ph.D., N. Busche and J. Strogies  Purchase 
    A Review of the Opportunities and Processes for Printed Electronics Happy Holden  Purchase 
    A.R.E.A - Component Level Testing of Thermal Interface Materials Harry Schoeller, Ph.D. and Martin K. Anselm, Ph.D.  Purchase 
    Understanding Nano-Sized Fillers in Conductive Adhesives Herbert J. Neuhaus, Ph.D. and Charles E. Bauer, Ph.D.  Purchase 
    Embedded Passive Technology Materials, Design and Process Hikmat Chammas  Purchase 
    Assembly Material/Flux Interactions and the Impact on Reliability Ian J. Wilding, Gavin J. Jackson, Katherine Day, Richard Boyle, Michael Carter, Daniel Buckland  Purchase 
    Advances in Fine Pitch Printing Process Technology Isaiah Smith  Purchase 
    Hydrophobic Coatings as an Approach for Preventing Corrosion Under BGAs J. D. Clifton, P. A. Panackal, K. F. Schoch, Jr.  Purchase 
    Ceramic Column Grid Array Design and Assembly J. Scott Nelson  Purchase 
    3DIC Yield Analysis Challenges Jacob Orbon  Purchase 
    Comparative Analysis of cCGA Solder Column Interconnects Following Aerospace Level Vibration Testing to Failure Jeffrey Marcus Jennings  Purchase 
    Development of an Underfill Rework Process and Evaluation of Underfill Reworkability Jenny England, Ph.D., Brian Toleno, Ph. D., and Jonathan Israel  Purchase 
    Non-Destructive Evaluation of Solder Bump Quality Under Mechanical Bending Using Laser Ultrasonic Technique Jie Gong, Charles Ume, Ph.D., Kola Akinade, Ph.D., Bryan Rogers, Cherif Guirguis, David Chan, Cesar Escobar  Purchase 
    Electroless Nickel Immersion Gold (Enig) and Black Tar - What Is It? How Can It Be Prevented? Jim Trainor  Purchase 
    Effect of Isothermal Preconditioning on Thermal Fatigue Life and Microstructure of a SAC305 BGA Jim Wilcox, Richard Coyle, Lawrence Lehman, Joe Smetana  Purchase 
    Impact of Solder Interconnect Configuration Modeling on Reliability Assessment Results of Electronic Assemblies Jingsong Xie, Ph.D.  Purchase 
    3D IC Integration with a TSV/RDL Passive Interposer John H. Lau  Purchase 
    Spherical Bend Test Failure Criteria Correlation in Compliant Systems John McMahon, Brian Standing and Meisam Salahi  Purchase 
    Contract Manufacturing and Conflict Minerals: Creating a Workable Compliance System John Sheehan and Allen Abell  Purchase 
    X-Ray / Bondtester Reliability Study of BGA Devices – Impact of Interfacial Voiding John Tingay and Evstatin Krastev  Purchase 
    New Interconnection for High Temperature Application: Hotpowcon (Hpc) – Part 3 Final Jörg Trodler, Mathias Nowottnick, Prof., Andreas Fix, and Timo Herberholz  Purchase 
    Several Studies of NaCl Presence on Tin Metallization Jose Servin  Purchase 
    The Effect of Solder Paste Reflow Conditions on Surface Insulation Resistance Karen Tellefsen and Mitch Holtzer  Purchase 
    J-STD-004B: A New Twist on an Old Standard? Karl F. Seelig and Timothy O'Neill  Purchase 
    Connector Reliability: Tradeoff Between Surface Plating and Mechanical Solutions Karumbu Meyyappan, Alan McAllister, Anil Kurella, Balu Pathangey  Purchase 
    Enhancing the Impact Properties of Tin-Copper and Tin-Copper-Nickel Lead-Free Solders with Trace Additions of Zinc, Indium and Gold Keith Sweatman, Dekui Mu and Takatoshi Nishimura  Purchase 
    iNEMI Pb-Free Alloy Characterization Project Report: Part VII - Thermal Fatigue Results for Low-Ag Alloys Keith Sweatman, Richard Coyle, Richard Parker, Keith Howell, Elizabeth Benedetto, Joseph Smetana, Aileen Allen, Weiping Lui, Julie Silk  Purchase 
    Microstructure and Reliability Studies of Mixed Sn-Pb and Pb-Free BGA Soldering Ken Kramer, Ph.D., Corey Nelson, Alok Sharan, Ph.D.  Purchase 
    Turning Printed Circuit Boards into Printed Circuit Structures Using 3D Printing Kenneth Church, Xudong Chen, Paul Deffenbaugh, Casey Perkowski, Sam LeBlanc, Eduardo Rojas and Thomas Weller  Purchase 
    Embedding of Power Semiconductors for Innovative Packages and Modules Lars Boettcher, Stefan Karaszkiewicz, Dionysios Manessis, and Andreas Ostmann  Purchase 
    Controlling High Copper Roughness for Enhancing Immersion Metal Surface Finish Performance Lenora Toscano, Aaron Karoly, Ernest Long, Ph.D.  Purchase 
    Process Sensitive Components Guideline – A Primer for the Industry Marie Cole, Mike Bixenman, David Geiger, Curtis Grosskopf, Michelle Lam, Michael Lauri, Holly-Dee Rubin, Thilo Sack, Laurence Schultz, James Wilcox  Purchase 
    The Next Big Challenge for Stencil Printing - Sub 0.5 Area Ratio Apertures Mark Whitmore and Clive Ashmore  Purchase 
    A.R.E.A. - Component Warpage: Issues with Measurement and Standardization Martin K. Anselm, Ph.D.  Purchase 
    An Innovative Reliability Solution to Interconnect of Flexible/Rigid Substrates Mary Liu, Ph.D., and Wusheng Yin, Ph.D.  Purchase 
    Soldering With Exothermic Reacting Pastes Mathias Nowottnick, Dirk Seehase and Heiko Huth  Purchase 
    Via-In-Pad Design Considerations for Bottom Terminated Components on Printed Circuit Board Assemblies Matt Kelly, Mark Jeanson, Mitch Ferrill  Purchase 
    Critical Process and Chemical Parameters Affecting the Assembly Performance of Organic Solderability Preservatives (OSP) Michael Carano  Purchase 
    A.R.E.A. – Low Loss Laminate Material Pad Cratering Resistance Michael Meilunas and Martin Anselm  Purchase 
    Removal of High Density Plated Through Hole Connectors on Large Mass Multi-Layered Circuit Card Assemblies Michael Newman  Purchase 
    QFN Design Considerations to Improve Cleaning a Follow On Study Mike Bixenman, D.B.A., Dale Lee, Bill Vuono, and Steve Stach  Purchase 
    Understencil Video Effects to Study Solder Paste Transfer and Wiping Effects Mike Bixenman, D.B.A., Wayne Raney, Chrys Shea, and Ray Whittier  Purchase 
    The Effect of Pcb and System Thermal Efficiency on The Thermal Performance of Die Attach Materials Mohammed Mansi, Daryl Santos, Ross Havens, Krishnaswami Srihari, Bruce Fried and Julia Zhao  Purchase 
    Immersion Tin Surface Finish - Reviewing the Past and a Look to the Future Mustafa Oezkoek, Dipl.-Ing., Hubertus Mertens, and Maren Bruder  Purchase 
    Effect of Board Thickness, Temperature Range, and Dwell Time on Solder Joint Reliability of FCBGA Packages Based on IPC9701 Characterization Olivia H. Chen, Jagadeesh Radhakrishnan and Al Molina  Purchase 
    Microstructurally Adaptive Constitutive Relations and Reliability Assessment Protocols for Lead Free Solder P. Borgesen, Ph.D., E. Cotts, Ph.D., and I. Dutta  Purchase 
    Sensitivity of Copper Dissolution to the Flow Behavior of Molten Sn-Pb Solder P. T. Vianco, J. A. Rejent, A. C. Kilgo, and S. E. Garrett  Purchase 
    What You Cannot See Can Be Hand Soldered Paul Wood and Bob Wettermann  Purchase 
    Measurement of the High Strain Rate Mechanical Behavior of SAC305 Alloy at Product Operating Temperature and Derivation of Anand Viscoplasticity Constants Pradeep Lall, Di Zhang, Vikas Yadav, David Locker  Purchase 
    Assessment of the Effect of Mean Temperature on Thermal Cycling Reliability of SAC Solder Joints Using Leading Indicators of Failure Pradeep Lall, Kazi Mirza  Purchase 
    X-Ray Micro-CT for Non-Destructive Analysis of Cracks and Defects in Fine-Pitch Electronic Packages Pradeep Lall, Shantanu Deshpande, Junchao Wei  Purchase 
    Component Removal Techniques with Underfill on Printed Circuit Boards for Failure Analysis Priyanka Dobriyal, Ph.D., James Wade, Anil Kurella  Purchase 
    Risk and Mitigation for Tin Whiskers and Tin Pest Professor Ronald C. Lasky, Ph.D., P.E  Purchase 
    Low-Temperature Soldering of Si-Based Photo Multipliers R.P.J. Denteneer, L.C.P. Krassenburg, J.H.G. Brom, M.H. Biglari  Purchase 
    Eliminating BTC Voiding on the Fly: In-Production Optimization Techniques Rafael Padilla, Satoru Akita, Derek Daily, Tokuro Yamaki, Hideki Mori, Tomoyasu Yoshikawa, Masato Shimamura, Kazuyori Takagi and Ko Inaba  Purchase 
    Manufacturing Readiness of BVA™ Technology for Fine-Pitch Package-On-Package Rajesh Katkar, Rey Co and Wael Zohni  Purchase 
    More than Monitoring; Controlling Multi-Phase Cleaning Agents Ram Wissel, Haley Jones, David Lober and Jonathan Afugu  Purchase 
    Reliability of Capacitors/CGAs onto Substrate/PCB Reza Ghaffarian, Ph.D.  Purchase 
    iNEMI Pb-Free Alloy Characterization Project Report: Part VIII - Thermal Fatigue Results for High-Ag Alloys at Extended Dwell Times Richard Coyle, Richard Parker, Elizabeth Benedetto, Keith Howell, Keith Sweatman, Stuart Longgood, Joseph Smetana, Aileen Allen, Peter Read, Babak Arfaei, and Francis Mutuku  Purchase 
    Improving Electronics Assembly Process Through Organic-Metal Final Finish Rita Mohanty, Ph.D., John Fudala, Sathiya Narayanan  Purchase 
    Electromigration Performance of WLCSP Solder Joints Robert Darveaux, Jimmy-Dinh V Hoang, and Bhuvaneshwaran Vijayakumar  Purchase 
    Rework of High Thermal Mass BGAs, QFNs, and SMT Connectors on Lead Free Circuit Board Assemblies with Temperature Sensitive Optical Fiber Robert Farrell, Paul Bodmer, and Jeff Duhaime  Purchase 
    Complicated Board Programming for Automated Printed Solder Paste Inspection without CAD Data File Run-Sheng Mao, Ph.D. and Ning-Cheng Lee, Ph.D.  Purchase 
    Strategic Environmental Research and Development Program (SERDP) Nanoparticle Enhanced Conformal Coating for Whisker Mitigation S. Meschter, J. Cho, S. Maganty, D. Starkey, M. Gomez, D. Edwards, A. Ekin, K. Elsken, J. Keeping, P. Snugovsky, Eva Kosiba, Zohreh Bagheri, and J. Kennedy  Purchase 
    Comparative Study of Next-Generation Surface Finishes for Printed Circuit Assembly S.Y. Teng and S. Priore  Purchase 
    Low-Porosity Pressureless Sintering of a Novel Ag Paste for Die-Attach Sihai Chen, Guangyu Fan, Xue Yan, Chris LaBarbera, Lee Kresge, and Ning-Cheng Lee, Ph.D.  Purchase 
    Component Level Reliability for High Temperature Power Computing with SAC305 and Alternative High Reliability Solders Sivasubramanian Thirugnanasambandam, Thomas Sanders, John Evans, Ph.D., Michael Bozack, Ph.D., Wayne Johnson, Ph.D. and Jeff Suhling, Ph.D.,  Purchase 
    Fundamental Study on a Secure Printing Process Using Nanowork Stencils for 01005 Components Stefan Härter, Jörg Franke, and Carmina Läntzsch  Purchase 
    Strategic Environmental Research and Development Program (SERDP) Tin Whisker Testing and Modeling: Tin Whisker Growth on SAC305 Assemblies Stephan Meschter, Ph.D., Polina Snugovsky, Jeff Kennedy, Zohreh Bagheri and Eva Kosiba  Purchase 
    Warpage Studies on Large BGA Site and Corner Bridging Mitigation Method Steven Perng, Weidong Xie, Cherif Guirguis  Purchase 
    Effect of Gold and Copper on AuSn4 Deposition and Isothermal Durability of SAC305 Solder Joints Subhasis Mukherjee, Lay-Ling Ong, Julie Silk, and Abhijit Dasgupta  Purchase 
    Inspection Strategies for More Accurate, Faster and Smarter Inspection Subodh Kulkarni, Ph.D., Sean Langbridge, Dick Johnson  Purchase 
    Root Cause Failure Analysis of Dendrite Shorting: A Comparison of Analytical Techniques Terry Munson  Purchase 
    Copper Dissolution as a Function of Surface Finish as Observed on Rohs Selective Soler Equipment Thomas Shoaf  Purchase 
    Advancement of Preform Technology to Reduce QFN Voiding Tim Jensen, Seth Homer and Greg Wade  Purchase 
    Conformal Coating Over No Clean Flux Residues Part II Timothy O’Neill  Purchase 
    Performance Enhancing Nano-Coatings: Changing The Rules of Stencil Design Tony Lentz  Purchase 
    Cleaning Process Efficiency and the Influence of Static & Dynamic Cleaning Rates Umut Tosun, M.S.Ch.E. and Axel Vargas  Purchase 
    PCB Design and Fabrication Process Variations for Embedding Passive and Active Components Vern Solberg  Purchase 
    Reliability Evaluation of Ultra Large BGA System-In-Package (SiP) Module Assemblies Weidong Xie, Cherif Guirguis, Qiang (Johnson) Wang, and Mudasir Ahmad  Purchase 
    Effect of Flux Systems on Electrochemical Migration of Lead-Free Assembly Xiang Wei, Ph.D. and Bruno Tolla, Ph.D.  Purchase 
    Study of Precise Micro-Dispensing for Adhesive Deposition Xudong Chen, Jacob Denkins and Kenneth Church  Purchase 
    Smart Chemistry Towards Highly Efficient Soldering Material Formulation Yanrong Shi, Ph.D, Xiang Wei, Ph.D, Bruno Tolla, Ph.D  Purchase 
    Pb Free Solder Joint Reliability of Various Surface Finishes Yoshinori Ejiri, Takehisa Sakurai, Yoshinori Arayama, Yoshiaki Tsubomatsu, Kunihiko Akai, Masashi Nakagawa, Kiyoshi Hasegawa  Purchase 

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