Pan Pacific Symposium 2001 Proceedings

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    TITLE AUTHOR DOWNLOAD
    EMC-ORIENTED 3D MICROELECTRONICS DESIGN A. Gandelli  Purchase 
    FLUXLESS SOLDER NCP TECHNIQUE Akira Yamauchi, Toshiyuki Mori  Purchase 
    FAST UNDERFILL PROCESSES FOR LARGE TO SMALL FLIP CHIPS Alec J. Babiarz, Horatio Quinones and Robert Ciard  Purchase 
    EMI REJECTION AND EMC PROBLEMS IN MICROELECTRONIC SENSORS FOR AUTOMOTIVE APPLICATIONS Alessandro Gandelli  Purchase 
    DEVELOPING A ROBUST STENCIL PRINTING PROCESS FOR DIVERSE INTERCONNECTION TECHNOLOGIES Ashish D. Alawani  Purchase 
    HOW TO PACKAGE AND INDUSTRIALIZE MEMS B. Brox, L. Bergstedt and K. Persson  Purchase 
    PRODUCT DEVELOPMENT AND IMPLEMENTATION OF A SELF–FLUXING UNDERFILL (FluxFill) INTO WIRELESS COMMUNICATION PRODUCTS Bryan Anderson  Purchase 
    DESIGN AND ASSEMBLY FACTORS FOR 0201 COMPONENTS Christina Piasky  Purchase 
    EFFECTS OF NO-LEAD PCB FINISHES ON DISK DRIVE ASSEMBLY PROCESS Dale Lee  Purchase 
    AN ACCELERATED AGING STUDY OF OSPs AND THEIR SOLDERABILITY ASSAYS VIA THREE TEST METHODS Daryl Santos, Ph.D.  Purchase 
    FLIP-CHIP ON ORGANIC CARRIER ASSEMBLY EVALUATION Donald R. Banks  Purchase 
    ADVANCED WAFER LEVEL CSP PACKAGING USING NEW LIQUID BISMALEIMIDE POLYMERS Dr. Ben Santos, Art Burkhart  Purchase 
    ECONOMIC, PERFORMANCE AND ENVIRONMENTAL CONSTRAINTS: HOW DO WE RECONCILE THEM? Ed Kanegsberg and Barbara Kanegsberg,  Purchase 
    INTEGRAL INDUCTIVE ELEMENTS ON THE BASE OF POLYCRYSTALLINE SILICON FILMS Farida F. Kasimova,  Purchase 
    THE INFLUENCE OF ELECTROERROSION TREATMENT ON Ni/6H-SiC CONTACTS Fuad Kasimov  Purchase 
    PROBES FOR CHIPS, WAFERS, PACKAGES AND PCBs Gabe Cherian  Purchase 
    HIGH-DENSITY SOCKETS FOR TEST & BURN-IN OF MICRO-BGAs, CHIPS and WAFERS Gabe Cherian  Purchase 
    ACCURATELY MONITORING TOTAL ORGANIC CARBON IN ULTRA HIGH PURITY WATER BY NEW INSTRUMENTATION Hai Wei Zhu, Ph.D.  Purchase 
    TEST PROCESS OPTIMIZATION IN SMT-MANUFACTURING LINES Heinz Wohlrabe  Purchase 
    LIQUID CRYSTAL POLYMER FILM WITH HIGH HEAT RESISTANCE AND HIGH DIMENTIONAL STABILITY Hiroshi Inoue, Sunao Fukutake, Hiroyuki Ohata  Purchase 
    UNDERFILLING CHIP SCALE PACKAGES WITH REWORKABLE UNDERFILLS FOR CONSUMER PRODUCT APPLICATIONS Horatio Quinones  Purchase 
    QUALITY CONSIDERATIONS FOR SOLDER SPHERES IN BGA PACKAGING Hubert K. Chow  Purchase 
    THE NEW HYBRID ELECTRONIC IGNITION CIRCUITS FOR DISCHARGE LAMPS J.Pawelczyk  Purchase 
    FREQUENCY DOMAIN ANALYSIS FOR IMPROVED SAM INSPECTION OF MICROELECTRONIC COMPONENTS James C. P. McKeon  Purchase 
    MATERIAL PROPERTY EFFECTS ON FOCUSED BEAM TRANSDUCERS James C. P. McKeon  Purchase 
    GENERAL RULE IN DETERMINING PELLET WEIGHT OF THE TSOP PACKAGES James Fan, C. L. Lin, F. J. Tsai, R. B. Tsai  Purchase 
    APPLICATION STUDY OF HIGH SPEED SEPARABLE INTERCONNECT FOR HIGH DENSITY AREA ARRAY PACKAGING James Rathburn  Purchase 
    EVALUATION OF SILICON ON INSULATOR (SOI) BONDED WAFERS USING AUTOMATED ACOUSTIC MICRO IMAGING Janet E. Semmens and Bryan P. Schackmuth  Purchase 
    PACE OF INNOVATION DEMANDS CLOSER COLLABORATION WITH MATERIALS PROVIDERS Joe McGonnell  Purchase 
    SYSTEMATIC ANALYSIS TOWARDS THE MINIMIZATION/ELIMINATION OF FLUX SPATTER ON GOLD FINGER CONTACTS Karthik Vijayamadhavan  Purchase 
    DEVELOPMENT OF FLIP-CHIP MOUNTING PROCESS BY METALLIC JOINT WHICH USES SUPERSONIC(ULTRASONIC) WAVE ENERGY Kazushi Higashi  Purchase 
    A SMORGASBORD OF PACKAGES - PETITE & LIGHT Ken Gilleo  Purchase 
    THE NEO-MANHATTAN BUMP INTERCONNECTION FOR B²IT BUILD-UP PRINTED WIRING BOARDS AND AREA ARRAY IC PACKAGE SUBSTRATES Kenji Ohsawa  Purchase 
    SIGNIFICANT RELIABLITY ENHANCEMENT USING NEW ANISOTROPIC CONDUCTIVE ADHESIVES FOR FLIP CHIP ON ORGANIC SUBSTRATES APPLICATIONS Kyung-Wook Paik  Purchase 
    ADVANCED IC PACKAGING DESIGN OPTIMIZATION Les Ammann  Purchase 
    CHARACTERIZATION OF OSP FOR FLIP CHIP PBGA PACKAGING Li Ann Wetz, Keri Kirschenbaum  Purchase 
    HIGH DENSITY MICROELECTRONICS PACKAGING ROADMAP FOR SPACE APPLICATIONS Lissa Galbraith, PhD  Purchase 
    ADHESION OF FLIP-CHIP UNDERFILLS TO VARIOUS DIE PASSIVATIONS BEFORE AND AFTER ACCELERATED ENVIREMENTAL EXPOSURE Mark Dimke, Ph.D.  Purchase 
    RELIABILITY STUDY AND FAILURE ANALYSIS OF ASSEMBLED AND REWORKED CERAMIC COLUMN GRID ARRAY PACKAGES Mei Wang  Purchase 
    UNDERFILLING CHIP SCALE PACKAGES WITH REWORKABLE UNDERFILLS FOR CONSUMER PRODUCT APPLICATIONS Nael Hannan and Puligandla Viswanadham  Purchase 
    LASER PROCESSING OF HIGH DENSITY INTERCONNECTS Neal Hofmann  Purchase 
    CONSTRUCTION AND OPTIMIZATION OF THE REACTOR FOR RAPID THERMAL PROCESSING OF LARGE DIAMETER WAFERS Oleg A. Agueev  Purchase 
    ADVANCED WARPAGE CHARACTERIZATION: LOCATION AND TYPE OF DISPLACEMENT CAN BE EQUALLY AS IMPORTANT AS MAGNITUDE Patrick B. Hassell  Purchase 
    ADVANCED WARPAGE CHARACTERIZATION: LOCATION AND TYPE OF DISPLACEMENT CAN BE EQUALLY AS IMPORTANT AS MAGNITUDE Patrick B. Hassell  Purchase 
    A SHEAR STRENGTH STUDY OF LEAD-FREE SOLDER SPHERES FOR BGA APPLICATIONS ON DIFFERENT PAD FINISHES Prashant Chouta  Purchase 
    USE OF AUGER DEPTH PROFILING AND SURFACE ANALYSIS TO IDENTIFY FAILURE MECHANISMS IN THIN FILMS USED IN TAB AND OTHER DEVICE PACKAGING Ronald S. Nowicki  Purchase 
    IMPEDANCE AND PROPAGATION DELAY CHARACTERIZATION FOR FR-4 PRINTED CIRCUIT BOARDS S. Pochareddy  Purchase 
    CSP BOARD LEVEL RELIABILITY TESTING OF PB-FREE SN-AG-X (X=CU, IN) AND POLYMER-CORE SOLDER BALL Seung Wook Yoon and Ik Seung Park  Purchase 
    DIMPLED BALL GRID ARRAY PROCESS DEVELOPMENT FOR SPACE FLIGHT APPLICATIONS Sharon L. Barr and Atul Mehta  Purchase 
    IMPACT OF PCB SURFACE PAD FINISH AND CONTAMINATION ON BGA SOLDER JOINT VOIDING Shawn Eckel, Naveen Kini, Du Le  Purchase 
    SUPERIOR STRUCTURE BUILD-UP SUBSTRATE, "ADVANCED DV-MULTI" FOR PACKAGING Shinji Sumi, Hirofumi Nakamura, Hisaya Takahashi,  Purchase 
    ENHANCING YIELD WITH SOLDER FLUX AND SOLDER PASTE PROCESS CONTROL Stacy Kalisz  Purchase 
    300 MM WAFER STEPPER FOR BUMP AND WAFER LEVEL SCALE PACKAGING (CSP) APPLICATIONS Stephen Kay, Doug Anberg  Purchase 
    PLATING CHEMICAL EVALUATIONS AND RELIABILITY OF LEAD-FREE LEADFRAME PACKAGES Swaminath Prasad & Flynn Carson  Purchase 
    ADVANCED WAFER LEVEL CSP PACKAGING USING NEW LIQUID BISMALEIMIDE POLYMERS T. Wakabayashi, O. Kuwabara  Purchase 
    RELIABILITY STUDIES OF FLIP CHIP PACKAGE WITH REFLOWABLE UNDERFILL Tie Wang  Purchase 
    RELOCATING THE MANUFACTURING FACILITY Tim Crawford  Purchase 
    “LIFE-TESTING .... SAVE TIME AND MONEY, GET BETTER DATA" Tom Clifford  Purchase 
    IC PACKAGE SOLUTIONS FOR HIGH PERFORMANCE MEMORY Vern Solberg  Purchase 
    THE PRACTICAL WIRE SWEEP ANALYSIS SOFTWARE- INPACK, AND VERIFICATION FOR PBGA, STACKED CSP Vincent Tu  Purchase 
    A CASE-BASED DECISION SUPPORT MODEL FOR SEMICONDUCTOR ASSEMBLY Yun-ok Yang, Cheolwoo-Kwak  Purchase 

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